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45 条记录 (耗时 0.029 秒)

    Re-workable metallic TIM for efficient heat exchange
    22.
    发明申请
    Re-workable metallic TIM for efficient heat exchange 审中-公开
    可重复使用的金属TIM，用于高效的热交换

    公开(公告)号：US20070175621A1

    公开(公告)日：2007-08-02

    申请号：US11345556

    申请日：2006-01-31

    申请人： Madhav Datta ,  Peng Zhou ,  James Hom ,  Mark Munch ,  Mark McMaster

    发明人： Madhav Datta ,  Peng Zhou ,  James Hom ,  Mark Munch ,  Mark McMaster

    IPC分类号： H05K7/20

    CPC分类号： H01L23/3736 ,  H01L23/3735 ,  H01L23/473 ,  H01L2224/73253

    摘要： A heat exchanging system uses a metallic TIM for efficient heat transfer between a heat source and a heat exchanger. The heat source is preferably an integrated circuit coupled to a circuit board. The metallic TIM preferably comprises indium. The metallic TIM is comprised of either a separate metallic TIM foil or as a deposited layer of metal material. The metallic TIM foil is mechanically joined to a first surface of the heat exchanger and to a first surface of the integrated circuit by applying sufficient pressure during clamping. Disassembly is accomplished by un-clamping the heat exchanger, the metallic TIM foil, and the integrated circuit from each other. Once disassembled, the heat exchanger and the metallic TIM foil are available to be used again. If the metallic TIM is deposited onto the heat exchanger, disassembly yields a heat exchanging sub-assembly that is also reusable.

    摘要翻译： 热交换系统使用金属TIM来在热源和热交换器之间进行有效的热传递。 热源优选为耦合到电路板的集成电路。 金属TIM优选包含铟。 金属TIM由单独的金属TIM箔或金属材料的沉积层组成。 金属TIM箔通过在夹紧期间施加足够的压力机械地连接到热交换器的第一表面和集成电路的第一表面。 通过将热交换器，金属TIM箔和集成电路彼此不夹紧来实现拆卸。 一旦分解，热交换器和金属TIM箔可以再次使用。 如果金属TIM沉积在热交换器上，则拆卸产生也是可重复使用的热交换子组件。

    Pump and fan control concepts in a cooling system
    23.
    发明申请
    Pump and fan control concepts in a cooling system 有权
    冷却系统中的泵和风扇控制概念

    公开(公告)号：US20060180300A1

    公开(公告)日：2006-08-17

    申请号：US11400347

    申请日：2006-04-06

    申请人： Daniel Lenehan ,  Kenneth Goodson ,  Thomas Kenny ,  Mark Munch ,  Saroj Sahu

    发明人： Daniel Lenehan ,  Kenneth Goodson ,  Thomas Kenny ,  Mark Munch ,  Saroj Sahu

    IPC分类号： H05K7/20

    CPC分类号： H01L23/473 ,  H01L23/34 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of and apparatus for cooling heat-generating devices in a cooling system is disclosed. The apparatus includes various sensors, control schemes and thermal models, to control pump flow rates and fan flow rates in a concerted manner, while minimizing power consumption, noise, and noise transients. The apparatus further includes at least one heat-generating device, at lease one heat exchanger, and at least one heat rejector. The apparatus can also include many pumps and fans.

    摘要翻译： 公开了一种用于冷却冷却系统中的发热装置的方法和装置。 该装置包括各种传感器，控制方案和热模型，以一致的方式控制泵流量和风扇流量，同时最小化功耗，噪声和噪声瞬变。 该装置还包括至少一个热产生装置，至少一个热交换器和至少一个热排出器。 该设备还可以包括许多泵和风扇。

    Pumped fluid cooling system and method
    24.
    发明申请
    Pumped fluid cooling system and method 审中-公开
    泵送流体冷却系统及方法

    公开(公告)号：US20060042785A1

    公开(公告)日：2006-03-02

    申请号：US10927800

    申请日：2004-08-27

    申请人： Douglas Werner ,  Kenneth Goodson ,  Mark Munch ,  Girish Upadhya

    发明人： Douglas Werner ,  Kenneth Goodson ,  Mark Munch ,  Girish Upadhya

    IPC分类号： F28F7/00

    CPC分类号： F28F9/0263 ,  F28F3/12 ,  F28F2260/02

    摘要： The present invention is a pumped fluid cooling system and method. The pumped fluid cooling system and method includes new relative magnitudes of advection, convection and spreading components of the resistance for a pumped fluid system. The pumped fluid cooling system and method also includes adjusting the chemical composition of the working fluid, specifically adjusting the composition and viscosity as the sensitivity to the fluid heat capacity per unit mas increases.

    摘要翻译： 本发明是一种泵送流体冷却系统和方法。 泵送流体冷却系统和方法包括泵送流体系统的电阻的平流，对流和扩散分量的相对量级。 泵送流体冷却系统和方法还包括调整工作流体的化学成分，特别是调整组成和粘度，因为每单位流体热容量的敏感度增加。

    Liquid cooling loops for server applications
    30.
    发明申请
    Liquid cooling loops for server applications 有权
    用于服务器应用的液体冷却回路

    公开(公告)号：US20070201204A1

    公开(公告)日：2007-08-30

    申请号：US11707350

    申请日：2007-02-16

    申请人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

    发明人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

    摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

    摘要翻译： 液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。 每个电子服务器包括一个或多个发热装置。 集成到每个电子服务器上是一种基于液体的冷却系统。 每个基于液体的冷却系统包括服务器泵和通过流体管线耦合在一起的一个或多个微通道冷板（MCP）。 用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。 排料板通过热界面材料连接到底盘冷板。 在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。