LAYER PATTERNING USING DOUBLE EXPOSURE PROCESSES IN A SINGLE PHOTORESIST LAYER
    23.
    发明申请
    LAYER PATTERNING USING DOUBLE EXPOSURE PROCESSES IN A SINGLE PHOTORESIST LAYER 有权
    在单个光电层中使用双重曝光过程的层状图

    公开(公告)号:US20090035708A1

    公开(公告)日:2009-02-05

    申请号:US11831099

    申请日:2007-07-31

    IPC分类号: G03F7/20

    摘要: A structure and a method for forming the same. The method includes providing a structure which includes (a) a to-be-patterned layer, (b) a photoresist layer on top of the to-be-patterned layer wherein the photoresist layer includes a first opening, and (c) a cap region on side walls of the first opening. A first top surface of the to-be-patterned layer is exposed to a surrounding ambient through the first opening. The method further includes performing a first lithography process resulting in a second opening in the photoresist layer. The second opening is different from the first opening. A second top surface of the to-be-patterned layer is exposed to a surrounding ambient through the second opening.

    摘要翻译: 一种结构及其形成方法。 该方法包括提供一种结构,其包括(a)待图案化层,(b)在待图案化层的顶部上的光致抗蚀剂层,其中光致抗蚀剂层包括第一开口,和(c)帽 区域在第一开口的侧壁上。 待图案化层的第一顶表面通过第一开口暴露于周围环境。 该方法还包括执行在光致抗蚀剂层中产生第二开口的第一光刻工艺。 第二个开口与第一个开口不同。 待图案化层的第二顶表面通过第二开口暴露于周围环境。

    Methods for forming a wrap-around gate field effect transistor
    26.
    发明授权
    Methods for forming a wrap-around gate field effect transistor 有权
    形成环绕栅场效应晶体管的方法

    公开(公告)号:US07435653B2

    公开(公告)日:2008-10-14

    申请号:US11735075

    申请日:2007-04-13

    IPC分类号: H01L21/336

    摘要: A field effect transistor is formed having wrap-around, vertically-aligned, dual gate electrodes. Starting with a silicon-on-insulator (SOI) structure having a buried silicon island, a vertical reference edge is defined, by creating a cavity within the SOI structure, and used during two etch-back steps that can be reliably performed. The first etch-back removes a portion of an oxide layer for a first distance over which a gate conductor material is then applied. The second etch-back removes a portion of the gate conductor material for a second distance. The difference between the first and second distances defines the gate length of the eventual device. After stripping away the oxide layers, a vertical gate electrode is revealed that surrounds the buried silicon island on all four side surfaces.

    摘要翻译: 形成具有环绕,垂直排列的双栅电极的场效应晶体管。 从具有掩埋硅岛的绝缘体上硅(SOI)结构开始,通过在SOI结构内产生空腔并在可以可靠地执行的两个回蚀步骤期间使用垂直参考边缘。 第一次回蚀将氧化物层的一部分去除第一距离,然后施加栅极导体材料。 第二次回蚀将栅极导体材料的一部分移除第二距离。 第一和第二距离之间的差异定义了最终设备的栅极长度。 剥离氧化物层后,显示出在所有四个侧表面上包围掩埋硅岛的垂直栅电极。

    Wrap-around gate field effect transistor
    27.
    发明授权
    Wrap-around gate field effect transistor 有权
    环绕栅场效应晶体管

    公开(公告)号:US07271444B2

    公开(公告)日:2007-09-18

    申请号:US10732958

    申请日:2003-12-11

    IPC分类号: H01L29/76

    摘要: A field effect transistor is formed having wrap-around, vertically-aligned, dual gate electrodes. Starting with an silicon-on-insulator (SOI) structure having a buried silicon island, a vertical reference edge is defined, by creating a cavity within the SOI structure, and used during two etch-back steps that can be reliably performed. The first etch-back removes a portion of an oxide layer for a first distance over which a gate conductor material is then applied. The second etch-back removes a portion of the gate conductor material for a second distance. The difference between the first and second distances defines the gate length of the eventual device. After stripping away the oxide layers, a vertical gate electrode is revealed that surrounds the buried silicon island on all four side surfaces.

    摘要翻译: 形成具有环绕,垂直排列的双栅电极的场效应晶体管。 从具有掩埋硅岛的绝缘体上硅(SOI)结构开始,通过在SOI结构内产生空腔并在可以可靠地执行的两个回蚀步骤期间使用垂直参考边。 第一次回蚀将氧化物层的一部分去除第一距离,然后施加栅极导体材料。 第二次回蚀将栅极导体材料的一部分移除第二距离。 第一和第二距离之间的差异定义了最终设备的栅极长度。 剥离氧化物层后,显示出在所有四个侧表面上包围掩埋硅岛的垂直栅电极。

    Layer patterning using double exposure processes in a single photoresist layer
    30.
    发明授权
    Layer patterning using double exposure processes in a single photoresist layer 有权
    在单一光致抗蚀剂层中使用双曝光工艺的层图案化

    公开(公告)号:US07923202B2

    公开(公告)日:2011-04-12

    申请号:US11831099

    申请日:2007-07-31

    IPC分类号: G03F7/26

    摘要: A structure and a method for forming the same. The method includes providing a structure which includes (a) a to-be-patterned layer, (b) a photoresist layer on top of the to-be-patterned layer wherein the photoresist layer includes a first opening, and (c) a cap region on side walls of the first opening. A first top surface of the to-be-patterned layer is exposed to a surrounding ambient through the first opening. The method further includes performing a first lithography process resulting in a second opening in the photoresist layer. The second opening is different from the first opening. A second top surface of the to-be-patterned layer is exposed to a surrounding ambient through the second opening.

    摘要翻译: 一种结构及其形成方法。 该方法包括提供一种结构,其包括(a)待图案化层,(b)在待图案化层的顶部上的光致抗蚀剂层,其中光致抗蚀剂层包括第一开口,和(c)帽 区域在第一开口的侧壁上。 待图案化层的第一顶表面通过第一开口暴露于周围环境。 该方法还包括执行在光致抗蚀剂层中产生第二开口的第一光刻工艺。 第二个开口与第一个开口不同。 待图案化层的第二顶表面通过第二开口暴露于周围环境。