公开(公告)号：US20130208072A1

公开(公告)日：2013-08-15

申请号：US13459499

申请日：2012-04-30

申请人： Jian Zeng

发明人： Jian Zeng

IPC分类号： B41J2/325

CPC分类号： B41J2/32 ,  B41J3/01 ,  B41J15/005

摘要： A thermal transfer printing device includes a thermal transfer printing module and a paper ejecting module. The paper ejecting module includes a D-shaped ejecting roller, a driving gear, a switching roller, a spring, and a stopper. During a thermal transfer paper is printed by the thermal transfer printing module, the spring provides a friction force to the switching roller. In response to the friction force, the switching roller is driven by the driving gear, and the D-shaped ejecting roller is not contacted with the thermal transfer paper. After the printing task of the thermal transfer printing module is completed, the friction force provided by the spring allows the D-shaped ejecting roller to transport the thermal transfer paper.

摘要翻译： 热转印打印装置包括热转印打印模块和纸排出模块。 纸张排出模块包括D形排出辊，驱动齿轮，开关辊，弹簧和止动件。 在热转印纸由热转印印刷模块印刷时，弹簧向开关辊提供摩擦力。 响应于摩擦力，切换辊由驱动齿轮驱动，D形排出辊不与热转印纸接触。 在热转印打印模块的打印任务完成之后，由弹簧提供的摩擦力允许D形排出辊传送热转印纸。

公开(公告)号：US20120153011A1

公开(公告)日：2012-06-21

申请号：US13393032

申请日：2010-09-03

申请人： Michael Schäfer ,  Wolfgang Schmitt ,  Jian Zeng

发明人： Michael Schäfer ,  Wolfgang Schmitt ,  Jian Zeng

IPC分类号： B23K31/02 ,  B23K35/24

CPC分类号： B23K35/34 ,  B22F1/0062 ,  B22F3/1003 ,  B22F7/04 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/025 ,  B23K35/3602 ,  B23K35/3618 ,  B23K35/362 ,  B23K35/365 ,  B23K2101/36 ,  H01L24/83 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/8384 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/00014

摘要： A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes (a) providing a sandwich arrangement having at least (a1) one component 1, (a2) one component 2, and (a3) a metal paste located between component 1 and component 2, and (b) sintering the sandwich arrangement. The metal paste contains (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound, (B) 0-12 weight percent of at least one metal precursor, (C) 6-20 weight percent of at least one solvent, and (D) 0.1-15 weight percent of at least one sintering agent selected from the group comprising (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids.

摘要翻译： 提供一种烧结方法，其允许组件以稳定的方式彼此接合，其中处理温度低于200℃，并且产生稳定的接触点，其具有低孔隙率和高导电性和高导热性。 接合部件的方法包括（a）提供具有至少（a1）一种组分1，（a2）一种组分2和（a3）位于组分1和组分2之间的金属糊剂的夹层结构，和（b）烧结 三明治安排。 金属糊含有（A）75-90重量％的至少一种以颗粒形式存在的至少一种金属，所述金属具有包含至少一种有机化合物的涂层，（B）0-12重量％的至少一种金属前体，（C ）6-20重量％的至少一种溶剂，和（D）0.1-15重量％的至少一种选自以下的烧结剂：（i）有机过氧化物，（ii）无机过氧化物和（iii）无机酸 。