公开(公告)号：US20220256717A1

公开(公告)日：2022-08-11

申请号：US17234805

申请日：2021-04-20

Applicant: Unimicron Technology Corp.

Inventor： John Hon-Shing Lau ,  Cheng-Ta Ko ,  Pu-Ju Lin ,  Chi-Hai Kuo ,  Kai-Ming Yang ,  Chia-Yu Peng ,  Shao-Chien Lee ,  Tzyy-Jang Tseng

IPC: H05K3/46 ,  H05K3/02 ,  H05K3/40 ,  H05K3/38

Abstract: A circuit board structure includes a first sub-board including a plurality of circuit patterns, a second sub-board including a plurality of pads, and a connecting structure layer having a plurality of through holes and including an insulating layer, first and second adhesive layers, and a plurality of conductive blocks. The first adhesive layer is directly connected to the first sub-board. The second adhesive layer is directly connected to the second sub-board. The through holes penetrate through the first adhesive layer, the insulating layer, and the second adhesive layer. The conductive blocks are located in the through holes. An upper surface and a lower surface of each conductive block are respectively lower than a first surface of the first adhesive layer and a second surface of the second adhesive layer relatively away from the insulating layer. Each circuit pattern contacts the upper surface, and each pad contacts the lower surface.

公开(公告)号：US20210247147A1

公开(公告)日：2021-08-12

申请号：US17168200

申请日：2021-02-05

Applicant: Unimicron Technology Corp.

Inventor： Ra-Min Tain ,  John Hon-Shing Lau ,  Pu-Ju Lin ,  Wei-Ci Ye ,  Chi-Hai Kuo ,  Cheng-Ta Ko ,  Tzyy-Jang Tseng

IPC: F28D15/04 ,  F28D15/02 ,  F28F21/08 ,  F28F3/10 ,  B23P15/26

Abstract: A vapor chamber structure including a thermally conductive shell, a capillary structure layer, and a working fluid is provided. The thermally conductive shell includes a first thermally conductive portion and a second thermally conductive portion. The first thermally conductive portion has at least one first cavity. The second thermally conductive portion and the first cavity define at least one sealed chamber, and a pressure in the sealed chamber is lower than a standard atmospheric pressure. The capillary structure layer covers an inner wall of the sealed chamber. The working fluid is filled in the sealed chamber.