公开(公告)号：US12063871B2

公开(公告)日：2024-08-13

申请号：US18230189

申请日：2023-08-04

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chiu-Jung Chiu ,  Ya-Sheng Feng ,  I-Ming Tseng ,  Yi-An Shih ,  Yu-Chun Chen ,  Yi-Hui Lee ,  Chung-Liang Chu ,  Hsiu-Hao Hu

IPC: H10N50/80 ,  H10B61/00 ,  H10N50/01 ,  H10N50/85

CPC classification number: H10N50/80 ,  H10B61/00 ,  H10N50/01 ,  H10N50/85

Abstract: A method for fabricating semiconductor device includes the steps of forming an inter-metal dielectric (IMD) layer on a substrate, forming a trench in the IMD layer, forming a synthetic antiferromagnetic (SAF) layer in the trench, forming a metal layer on the SAF layer, planarizing the metal layer and the SAF layer to form a metal interconnection, and forming a magnetic tunneling junction (MTJ) on the metal interconnection.

公开(公告)号：US11864469B2

公开(公告)日：2024-01-02

申请号：US17902895

申请日：2022-09-05

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Wen Hung ,  Ya-Sheng Feng

IPC: H10N50/80 ,  H01L21/768 ,  H10N50/01

CPC classification number: H10N50/80 ,  H01L21/76801 ,  H01L21/76838 ,  H10N50/01

Abstract: A method for fabricating semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a metal interconnection in the first IMD layer; forming a bottom electrode layer and a pinned layer on the first IMD layer; forming a sacrificial layer on the pinned layer; patterning the sacrificial layer, the pinned layer, and the bottom electrode layer to form a first magnetic tunneling junction (MTJ); forming a second IMD layer around the first MTJ; removing the sacrificial layer to form a recess; forming a barrier layer and a free layer in the recess; forming a top electrode layer on the free layer; and patterning the top electrode layer and the free layer to form a second MTJ.

公开(公告)号：US20230380296A1

公开(公告)日：2023-11-23

申请号：US18230189

申请日：2023-08-04

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chiu-Jung Chiu ,  Ya-Sheng Feng ,  I-Ming Tseng ,  Yi-An Shih ,  Yu-Chun Chen ,  Yi-Hui Lee ,  Chung-Liang Chu ,  Hsiu-Hao Hu

IPC: H10N50/80 ,  H10B61/00 ,  H10N50/01 ,  H10N50/85

CPC classification number: H10N50/80 ,  H10B61/00 ,  H10N50/01 ,  H10N50/85

Abstract: A method for fabricating semiconductor device includes the steps of forming an inter-metal dielectric (IMD) layer on a substrate, forming a trench in the IMD layer, forming a synthetic antiferromagnetic (SAF) layer in the trench, forming a metal layer on the SAF layer, planarizing the metal layer and the SAF layer to form a metal interconnection, and forming a magnetic tunneling junction (MTJ) on the metal interconnection.

公开(公告)号：US20230380295A1

公开(公告)日：2023-11-23

申请号：US18229661

申请日：2023-08-02

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Wen Hung ,  Ya-Sheng Feng

IPC: H10N50/80 ,  H01L21/768 ,  H10N50/01

CPC classification number: H10N50/80 ,  H01L21/76838 ,  H01L21/76801 ,  H10N50/01

Abstract: A method for fabricating semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a metal interconnection in the first IMD layer; forming a bottom electrode layer and a pinned layer on the first IMD layer; forming a sacrificial layer on the pinned layer; patterning the sacrificial layer, the pinned layer, and the bottom electrode layer to form a first magnetic tunneling junction (MTJ); forming a second IMD layer around the first MTJ; and removing the sacrificial layer.

公开(公告)号：US11765983B2

公开(公告)日：2023-09-19

申请号：US17972542

申请日：2022-10-24

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chiu-Jung Chiu ,  Ya-Sheng Feng ,  I-Ming Tseng ,  Yi-An Shih ,  Yu-Chun Chen ,  Yi-Hui Lee ,  Chung-Liang Chu ,  Hsiu-Hao Hu

IPC: H10N50/80 ,  H10B61/00 ,  H10N50/01 ,  H10N50/85

CPC classification number: H10N50/80 ,  H10B61/00 ,  H10N50/01 ,  H10N50/85

Abstract: A method for fabricating semiconductor device includes the steps of forming an inter-metal dielectric (IMD) layer on a substrate, forming a trench in the IMD layer, forming a synthetic antiferromagnetic (SAF) layer in the trench, forming a metal layer on the SAF layer, planarizing the metal layer and the SAF layer to form a metal interconnection, and forming a magnetic tunneling junction (MTJ) on the metal interconnection.

公开(公告)号：US11765982B2

公开(公告)日：2023-09-19

申请号：US17900898

申请日：2022-09-01

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Wen Hung ,  Ya-Sheng Feng

IPC: H10N50/80 ,  H01L21/768 ,  H10N50/01

CPC classification number: H10N50/80 ,  H01L21/76801 ,  H01L21/76838 ,  H10N50/01

Abstract: A method for fabricating semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a metal interconnection in the first IMD layer; forming a bottom electrode layer and a pinned layer on the first IMD layer; forming a sacrificial layer on the pinned layer; patterning the sacrificial layer, the pinned layer, and the bottom electrode layer to form a first magnetic tunneling junction (MTJ); forming a second IMD layer around the first MTJ; and removing the sacrificial layer.

公开(公告)号：US20230040932A1

公开(公告)日：2023-02-09

申请号：US17972542

申请日：2022-10-24

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chiu-Jung Chiu ,  Ya-Sheng Feng ,  I-Ming Tseng ,  Yi-An Shih ,  Yu-Chun Chen ,  Yi-Hui Lee ,  Chung-Liang Chu ,  Hsiu-Hao Hu

IPC: H01L43/02 ,  H01L43/12 ,  H01L43/10 ,  H01L27/22

Abstract: A method for fabricating semiconductor device includes the steps of forming an inter-metal dielectric (IMD) layer on a substrate, forming a trench in the IMD layer, forming a synthetic antiferromagnetic (SAF) layer in the trench, forming a metal layer on the SAF layer, planarizing the metal layer and the SAF layer to form a metal interconnection, and forming a magnetic tunneling junction (MTJ) on the metal interconnection.

公开(公告)号：US20220416153A1

公开(公告)日：2022-12-29

申请号：US17900898

申请日：2022-09-01

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Wen Hung ,  Ya-Sheng Feng

IPC: H01L43/02 ,  H01L21/768 ,  H01L43/12

Abstract: A method for fabricating semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a metal interconnection in the first IMD layer; forming a bottom electrode layer and a pinned layer on the first IMD layer; forming a sacrificial layer on the pinned layer; patterning the sacrificial layer, the pinned layer, and the bottom electrode layer to form a first magnetic tunneling junction (MTJ); forming a second IMD layer around the first MTJ; and removing the sacrificial layer.

公开(公告)号：US11515471B2

公开(公告)日：2022-11-29

申请号：US16988707

申请日：2020-08-09

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chiu-Jung Chiu ,  Ya-Sheng Feng ,  I-Ming Tseng ,  Yi-An Shih ,  Yu-Chun Chen ,  Yi-Hui Lee ,  Chung-Liang Chu ,  Hsiu-Hao Hu

IPC: H01L43/02 ,  H01L43/12 ,  H01L43/10 ,  H01L27/22

Abstract: A method for fabricating semiconductor device includes the steps of forming an inter-metal dielectric (IMD) layer on a substrate, forming a trench in the IMD layer, forming a synthetic antiferromagnetic (SAF) layer in the trench, forming a metal layer on the SAF layer, planarizing the metal layer and the SAF layer to form a metal interconnection, and forming a magnetic tunneling junction (MTJ) on the metal interconnection.

公开(公告)号：US11011575B2

公开(公告)日：2021-05-18

申请号：US16655251

申请日：2019-10-17

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ya-Sheng Feng ,  Yu-Chun Chen ,  Chiu-Jung Chiu

IPC: H01L27/22 ,  G11C11/16 ,  H01L43/10 ,  H01F10/32 ,  H01L43/02

Abstract: A circuit selector of embedded magnetoresistive random access memory (EMRAM) includes a transistor comprising a source/drain terminal coupled to a first magnetic tunneling junction (MTJ) and a second MTJ, a gate terminal, and a drain/source terminal coupled to a voltage source. Preferably, the first MTJ includes a first free layer, a first barrier layer, and a first pinned layer, in which the first free layer is coupled to the source/drain terminal and the first pinned layer is coupled to a first circuit. The second MTJ includes a second free layer, a second barrier layer, and a second pinned layer, in which the second pinned layer is coupled to the source/drain terminal and the second free layer is coupled to a second circuit.