摘要:
A cooling fan module is disclosed. The cooling fan module includes a module housing, a fan assembly, a fan control circuit board, and an electrical connector. The fan assembly is disposed within the module housing and includes a fan housing, a motor disposed within the fan housing, and a blade assembly coupled to the motor. The fan control circuit board is disposed between the module housing and the fan housing, and is coupled to the motor. The electrical connector is coupled to the fan control circuit board and projects outside of the module housing.
摘要:
A cooling fan with an outer rotor motor supported by a fan housing. A motor housing is disposed within a conduit through the fan housing, while the outer rotor motor is disposed within the motor housing. A plurality of support members coupled between the motor housing and the fan housing enable the fan housing to support the motor housing. A hub is rotatably coupled to the outer rotor motor and has a first portion disposed within the motor housing and a second portion disposed outside of the motor housing. A plurality of blades extends radially from the second portion said hub.
摘要:
A cooling fan comprising a fan housing and a plurality of blades rotatably disposed within a conduit through the fan housing. Each of the plurality of blades extends radially outward from a hub to a tip. The radial gap between the tips of the blades and the conduit defines a tip clearance. The cooling fan further comprises an tip clearance reduction system operable to control the tip clearance.
摘要:
A cooling fan comprising a housing, an electric motor, a blade assembly, and a first motor control circuit board. The housing is operable to connect to a computer chassis that supports an electronic component. An electric motor is fixably mounted within a volume formed by an inner surface of the housing. A blade assembly is rotatably mounted to the electric motor. A first motor control circuit board is coupled to the electric motor and is disposed externally to the volume formed by the inner surface of said housing.
摘要:
A system, comprising a circuit board having a heat sink spanning multiple components on the circuit board and at least one compliant pad flexibly interfacing the heat sink with the multiple components.
摘要:
Embodiments of the present invention overcome the deficiencies of the prior art by providing a tool-less, lever actuated, robust yet tolerant, high load delivery, low-profile component retention assembly for coupling components together. The assembly may include a plate and a lever coupled to the plate.
摘要:
A drive carrier includes a substrate, a computing device located on the substrate, an electrical interface located on the substrate, and a light source located on the substrate and communicatively coupled to the computing device. The computing device is to control illumination of the light source.
摘要:
A drive carrier includes a bezel and opposing sidewalls connected to the bezel. At least one of the opposing sidewalls includes a plurality of slots that form at least part of a keying solution, and a dimension of at least two of the plurality of slots is not the same.
摘要:
Embodiments of the present invention are directed to a blade server and blade server components. Specifically, one embodiment is directed to a server comprising a server chassis, a system board coupled to the server chassis, the system board comprising a first electrical connector, and a bezel assembly coupled to the server chassis and the system board, the bezel assembly comprising a printed circuit assembly comprising a second electrical connector communicatively mated to the first electrical connector.
摘要:
A heat sink and processor assembly that can be easily installed and uninstalled from a circuit board without tools. One preferred embodiment of the heat sink assembly comprises a heat sink component, an alignment cage attached to the base of the heat sink and having an attachment point for releasably attaching a processor. The heat sink assembly further comprises a plurality of alignment pins and alignment tabs that are affixed to the base of the heat sink and interface with a specially designed socket and circuit board so as to align the mating components. The processor chip is installed onto the heat sink and then the combined assembly is installed onto a circuit board mounted socket. The alignment mechanisms provide a method for installing a processor without using tools or having to manually align the processor pins to the socket receptacles.