公开(公告)号：US07202552B2

公开(公告)日：2007-04-10

申请号：US11182254

申请日：2005-07-15

Applicant: Wang Zhe ,  Miao Yubo

Inventor： Wang Zhe ,  Miao Yubo

IPC: H01L23/552

CPC classification number: H01L23/057 ,  B81B2201/0257 ,  B81C1/0023 ,  B81C1/00309 ,  H01L23/5387 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A MEMS package and a method for its forming are described. The MEMS package has at least one MEMS device located on a flexible substrate. A metal structure surrounds the at least one MEMS device wherein a bottom surface of the metal structure is attached to the flexible substrate and wherein a portion of the flexible substrate is folded over a top surface of the metal structure and attached to the top surface of the metal structure thereby forming the MEMS package.

Abstract translation: 描述了MEMS封装及其形成方法。 MEMS封装具有位于柔性基板上的至少一个MEMS器件。 金属结构围绕至少一个MEMS器件，其中金属结构的底表面附接到柔性基板，并且其中柔性基板的一部分折叠在金属结构的顶表面上并且附接到金属结构的顶表面 金属结构从而形成MEMS封装。

公开(公告)号：US20070013052A1

公开(公告)日：2007-01-18

申请号：US11333579

申请日：2006-01-17

Applicant: Wang Zhe ,  Miao Yubo

Inventor： Wang Zhe ,  Miao Yubo

IPC: H01L23/12

CPC classification number: H01L23/057 ,  B81B2201/0257 ,  B81C1/0023 ,  B81C1/00309 ,  H01L23/5387 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A MEMS package and methods for its embodiment are described. The MEMS package has at least one MEMS device mounted on a flexible and foldable substrate. A metal cap structure surrounds the at least one MEMS device wherein an edge surface of the metal cap structure is attached to the flexible substrate and wherein a portion of the flexible substrate is folded under itself thereby forming the MEMS package. A meshed metal environmental hole underlying the at least one MEMS device provides enhanced EMI immunity.

Abstract translation: 描述了用于其实施例的MEMS封装和方法。 MEMS封装具有安装在柔性和可折叠衬底上的至少一个MEMS器件。 金属盖结构围绕至少一个MEMS器件，其中金属帽结构的边缘表面附接到柔性基底，并且其中柔性基底的一部分在自身下折叠，从而形成MEMS封装。 至少一个MEMS器件下面的网状金属环境孔提供增强的EMI抗扰度。

公开(公告)号：US20070013036A1

公开(公告)日：2007-01-18

申请号：US11182254

申请日：2005-07-15

Applicant: Wang Zhe ,  Miao Yubo

Inventor： Wang Zhe ,  Miao Yubo

IPC: H01L23/552 ,  H01L21/48

CPC classification number: H01L23/057 ,  B81B2201/0257 ,  B81C1/0023 ,  B81C1/00309 ,  H01L23/5387 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A MEMS package and a method for its forming are described. The MEMS package has at least one MEMS device located on a flexible substrate. A metal structure surrounds the at least one MEMS device wherein a bottom surface of the metal structure is attached to the flexible substrate and wherein a portion of the flexible substrate is folded over a top surface of the metal structure and attached to the top surface of the metal structure thereby forming the MEMS package.