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47 条记录 (耗时 0.053 秒)

    Sensor chip and inspection device
    22.
    发明授权
    Sensor chip and inspection device 有权
    传感器芯片和检测装置

    公开(公告)号：US08166835B2

    公开(公告)日：2012-05-01

    申请号：US12076499

    申请日：2008-03-19

    申请人： Michiaki Murata

    发明人： Michiaki Murata

    IPC分类号： G01M99/00

    CPC分类号： G01N27/4145

    摘要： A sensor chip of an electrical signal detection type, comprises a semiconductor sensing device, the sensor chip being detachable with respect to an inspection device.

    摘要翻译： 电信号检测型的传感器芯片包括半导体感测装置，传感器芯片相对于检查装置可拆卸。

    LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING ELEMENT FABRICATION METHOD
    23.
    发明申请
    LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING ELEMENT FABRICATION METHOD 有权
    发光元件和发光元件制造方法

    公开(公告)号：US20110037093A1

    公开(公告)日：2011-02-17

    申请号：US12701743

    申请日：2010-02-08

    申请人： Michiaki Murata ,  Shuichi Yamada ,  Hiroyuki Usami ,  Takahiro Hashimoto

    发明人： Michiaki Murata ,  Shuichi Yamada ,  Hiroyuki Usami ,  Takahiro Hashimoto

    IPC分类号： H01L33/00 ,  H01L21/28

    CPC分类号： H01L33/40 ,  H01L27/15 ,  H01L33/0041 ,  H01L33/44

    摘要： According to an aspect of the invention, a light-emitting element includes a semiconductor layer, a gold electrode layer, an insulator, a barrier metal layer, and an aluminum wiring layer. The gold electrode layer is formed on a part of the semiconductor layer and is electrically connected to the semiconductor layer. The gold electrode layer being made of metal including gold. The insulator film covers the semiconductor layer and has a contact opening corresponding to the gold electrode layer. The barrier metal layer covers a an upper face of the gold electrode layer and the insulator film in a vicinity of the contact opening. The aluminum wiring layer is formed on the barrier metal layer and electrically connected to the barrier metal layer.

    摘要翻译： 根据本发明的一个方面，发光元件包括半导体层，金电极层，绝缘体，阻挡金属层和铝布线层。 金电极层形成在半导体层的一部分上并与半导体层电连接。 金电极层由包括金的金属制成。 绝缘膜覆盖半导体层并具有与金电极层对应的接触开口。 阻挡金属层覆盖金电极层的上表面和接触开口附近的绝缘膜。 铝布线层形成在阻挡金属层上并与阻挡金属层电连接。

    Method of manufacturing substrate and substrate, method of manufacturing liquid drop ejecting head and liquid drop ejecting head, and liquid drop ejecting device
    25.
    发明申请
    Method of manufacturing substrate and substrate, method of manufacturing liquid drop ejecting head and liquid drop ejecting head, and liquid drop ejecting device 有权
    制造基板和基板的方法，液滴喷射头和液滴喷射头的制造方法以及液滴喷射装置

    公开(公告)号：US20080043067A1

    公开(公告)日：2008-02-21

    申请号：US11704668

    申请日：2007-02-09

    申请人： Regan Nayve ,  Michiaki Murata

    发明人： Regan Nayve ,  Michiaki Murata

    IPC分类号： B41J2/04 ,  B21D53/76

    CPC分类号： B41J2/1631 ,  B41J2/161 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1642 ,  H05K3/4602 ,  H05K3/467 ,  H05K2201/09063 ,  H05K2203/308 ,  Y10T29/49002 ,  Y10T29/49155 ,  Y10T29/49401

    摘要： The present invention provides a method of manufacturing a substrate which forms a wiring pattern on a substrate having a plurality of through-holes. In the method, the wiring pattern is formed, after burying a filling material into the through-holes and planarizing a surface of the substrate. The filling material may be a conductive material, and a portion of the conductive material may be removed after the wiring pattern is formed. Removal of the portion of the conductive material may be carried out after a protective film, which protects the wiring pattern, is formed. The filling material may be a conductive material and a sacrificial material, and the sacrificial material may be removed after the wiring pattern is formed.

    摘要翻译： 本发明提供一种在具有多个通孔的基板上形成布线图案的基板的制造方法。 在该方法中，在将填充材料埋入通孔中并且平坦化基板的表面之后，形成布线图案。 填充材料可以是导电材料，并且可以在形成布线图案之后去除导电材料的一部分。 导电材料部分的去除可以在形成保护布线图案的保护膜之后进行。 填充材料可以是导电材料和牺牲材料，并且可以在形成布线图案之后去除牺牲材料。

    Inkjet recording head and inkjet recording device
    26.
    发明申请
    Inkjet recording head and inkjet recording device 有权
    喷墨记录头和喷墨记录装置

    公开(公告)号：US20050285903A1

    公开(公告)日：2005-12-29

    申请号：US11066369

    申请日：2005-02-25

    申请人： Michiaki Murata

    发明人： Michiaki Murata

    IPC分类号： B41J2/14 ,  B41J2/16 ,  B41J29/38

    CPC分类号： B41J2/161 ,  B41J2/14233 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1635 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1646 ,  B41J2002/14459 ,  B41J2002/14491 ,  B41J2202/18

    摘要： An inkjet recording head having: a nozzle ejecting ink drops; a pressure chamber which communicates with the nozzle and in which ink is filled; a vibrating plate structuring a portion of the pressure chamber; an ink pooling chamber pooling ink to be supplied to the pressure chamber via an ink flow path; and a piezoelectric element displacing the vibrating plate. The ink pooling chamber is provided at a side of the vibrating plate opposite the side at which the pressure chamber is provided. A driving IC, which applies voltage to the piezoelectric element, is mounted on a piezoelectric element substrate which is formed so as to include the vibrating plate. Accordingly, there is provided the inkjet recording head which realizes a higher density of nozzles and an accompanying formation of wires at a fine pitch to realize higher resolution, and which can be compact.

    摘要翻译： 一种喷墨记录头，具有：喷嘴喷射墨滴; 与喷嘴连通并且填充有油墨的压力室; 构成压力室的一部分的振动板; 墨水池将油墨通过油墨流路供给到压力室; 以及使振动板移位的压电元件。 墨水室设置在振动板的与设置压力室的一侧相对的一侧。 向压电元件施加电压的驱动IC安装在形成为包括振动板的压电元件基板上。 因此，提供了实现更高密度的喷嘴的喷墨记录头和以细间距的伴随形成的线以实现更高的分辨率，并且其可以是紧凑的。

    Light-emitting element and light-emitting element fabrication method
    28.
    发明授权
    Light-emitting element and light-emitting element fabrication method 有权
    发光元件和发光元件的制造方法

    公开(公告)号：US08278667B2

    公开(公告)日：2012-10-02

    申请号：US12701743

    申请日：2010-02-08

    申请人： Michiaki Murata ,  Shuichi Yamada ,  Hiroyuki Usami ,  Takahiro Hashimoto

    发明人： Michiaki Murata ,  Shuichi Yamada ,  Hiroyuki Usami ,  Takahiro Hashimoto

    IPC分类号： H01L27/15

    CPC分类号： H01L33/40 ,  H01L27/15 ,  H01L33/0041 ,  H01L33/44

    摘要： According to an aspect of the invention, a light-emitting element includes a semiconductor layer, a gold electrode layer, an insulator, a barrier metal layer, and an aluminum wiring layer. The gold electrode layer is formed on a part of the semiconductor layer and is electrically connected to the semiconductor layer. The gold electrode layer being made of metal including gold. The insulator film covers the semiconductor layer and has a contact opening corresponding to the gold electrode layer. The barrier metal layer covers a an upper face of the gold electrode layer and the insulator film in a vicinity of the contact opening. The aluminum wiring layer is formed on the barrier metal layer and electrically connected to the barrier metal layer.

    摘要翻译： 根据本发明的一个方面，发光元件包括半导体层，金电极层，绝缘体，阻挡金属层和铝布线层。 金电极层形成在半导体层的一部分上并与半导体层电连接。 金电极层由包括金的金属制成。 绝缘膜覆盖半导体层并具有与金电极层对应的接触开口。 阻挡金属层覆盖金电极层的上表面和接触开口附近的绝缘膜。 铝布线层形成在阻挡金属层上并与阻挡金属层电连接。

    METHOD OF MANUFACTURING SUBSTRATE AND SUBSTRATE, METHOD OF MANUFACTURING LIQUID DROP EJECTING HEAD AND LIQUID DROP EJECTING HEAD, AND LIQUID DROP EJECTING DEVICE
    29.
    发明申请
    METHOD OF MANUFACTURING SUBSTRATE AND SUBSTRATE, METHOD OF MANUFACTURING LIQUID DROP EJECTING HEAD AND LIQUID DROP EJECTING HEAD, AND LIQUID DROP EJECTING DEVICE 有权
    制造基板和基板的方法，制造液滴喷射头和液滴喷射头的方法和液滴喷射装置

    公开(公告)号：US20120194617A1

    公开(公告)日：2012-08-02

    申请号：US13443980

    申请日：2012-04-11

    申请人： Regan Nayve ,  Michiaki Murata

    发明人： Regan Nayve ,  Michiaki Murata

    IPC分类号： B41J2/14 ,  H05K3/22 ,  H05K1/11

    CPC分类号： B41J2/1631 ,  B41J2/161 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1642 ,  H05K3/4602 ,  H05K3/467 ,  H05K2201/09063 ,  H05K2203/308 ,  Y10T29/49002 ,  Y10T29/49155 ,  Y10T29/49401

    摘要： The present invention provides a method of manufacturing a substrate which forms a wiring pattern on a substrate having a plurality of through-holes. In the method, the wiring pattern is formed, after burying a filling material into the through-holes and planarizing a surface of the substrate. The filling material may be a conductive material, and a portion of the conductive material may be removed after the wiring pattern is formed. Removal of the portion of the conductive material may be carried out after a protective film, which protects the wiring pattern, is formed. The filling material may be a conductive material and a sacrificial material, and the sacrificial material may be removed after the wiring pattern is formed.

    摘要翻译： 本发明提供一种在具有多个通孔的基板上形成布线图案的基板的制造方法。 在该方法中，在将填充材料埋入通孔中并平面化基板的表面之后，形成布线图案。 填充材料可以是导电材料，并且可以在形成布线图案之后去除导电材料的一部分。 导电材料部分的去除可以在形成保护布线图案的保护膜之后进行。 填充材料可以是导电材料和牺牲材料，并且可以在形成布线图案之后去除牺牲材料。

    Method of manufacturing substrate and substrate, method of manufacturing liquid drop ejecting head and liquid drop ejecting head, and liquid drop ejecting device
    30.
    发明授权
    Method of manufacturing substrate and substrate, method of manufacturing liquid drop ejecting head and liquid drop ejecting head, and liquid drop ejecting device 有权
    制造基板和基板的方法，液滴喷射头和液滴喷射头的制造方法以及液滴喷射装置

    公开(公告)号：US08177334B2

    公开(公告)日：2012-05-15

    申请号：US11704668

    申请日：2007-02-09

    申请人： Regan Nayve ,  Michiaki Murata

    发明人： Regan Nayve ,  Michiaki Murata

    IPC分类号： B41J2/045

    CPC分类号： B41J2/1631 ,  B41J2/161 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1642 ,  H05K3/4602 ,  H05K3/467 ,  H05K2201/09063 ,  H05K2203/308 ,  Y10T29/49002 ,  Y10T29/49155 ,  Y10T29/49401

    摘要： The present invention provides a method of manufacturing a substrate which forms a wiring pattern on a substrate having a plurality of through-holes. In the method, the wiring pattern is formed, after burying a filling material into the through-holes and planarizing a surface of the substrate. The filling material may be a conductive material, and a portion of the conductive material may be removed after the wiring pattern is formed. Removal of the portion of the conductive material may be carried out after a protective film, which protects the wiring pattern, is formed. The filling material may be a conductive material and a sacrificial material, and the sacrificial material may be removed after the wiring pattern is formed.

    摘要翻译： 本发明提供一种在具有多个通孔的基板上形成布线图案的基板的制造方法。 在该方法中，在将填充材料埋入通孔中并平面化基板的表面之后，形成布线图案。 填充材料可以是导电材料，并且可以在形成布线图案之后去除导电材料的一部分。 导电材料部分的去除可以在形成保护布线图案的保护膜之后进行。 填充材料可以是导电材料和牺牲材料，并且可以在形成布线图案之后去除牺牲材料。