公开(公告)号：US20230268712A1

公开(公告)日：2023-08-24

申请号：US18310106

申请日：2023-05-01

申请人： NICHIA CORPORATION ,  SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Takuya Hashimoto ,  Eiichiro Okahisa ,  Katsuya Nakazawa ,  Shigeru Matsushita ,  Sumio Uehara ,  Suguru Kobayashi ,  Kazuhito Yumoto

IPC分类号： H01S5/0235 ,  H01S5/40 ,  H01S5/024 ,  H01S5/02208 ,  H01S5/02355

CPC分类号： H01S5/0235 ,  H01S5/40 ,  H01S5/02469 ,  H01S5/02208 ,  H01S5/02355 ,  H01S5/02255

摘要： A method of manufacturing a semiconductor device includes: preparing a bottom plate having an upper surface and a lower surface, wherein the lower surface of the bottom plate comprises a reference part and one or more inclined surfaces that are inclined with respect to the reference part, an upper portion of the one or more inclined surfaces being positioned above the reference part, and wherein a thickness of the bottom plate at the reference part is greater than a thickness of the bottom plate at the upper portion of the one or more inclined surfaces; joining a frame member to the bottom plate, at least a part of the frame member being disposed directly above the one or more inclined surfaces, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the bottom plate.

公开(公告)号：US11677211B2

公开(公告)日：2023-06-13

申请号：US17063140

申请日：2020-10-05

申请人： NICHIA CORPORATION ,  SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Takuya Hashimoto ,  Eiichiro Okahisa ,  Katsuya Nakazawa ,  Shigeru Matsushita ,  Sumio Uehara ,  Suguru Kobayashi ,  Kazuhito Yumoto

IPC分类号： H01S5/02208 ,  H01S5/0235 ,  H01S5/40 ,  H01S5/024 ,  H01S5/02355 ,  H01S5/02255

CPC分类号： H01S5/0235 ,  H01S5/02208 ,  H01S5/02355 ,  H01S5/02469 ,  H01S5/40 ,  H01S5/02255

摘要： A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to the upper surface of the bottom plate and comprising a first through-hole that penetrates the frame; a plate jointed to the outside or inside surface of the frame, the plate comprising a second through-hole that penetrates the plate in a same direction as that of the first through-hole, a thickness of the plate being greater than a thickness of the frame; a lead terminal inserted into the first through-hole and the second through-hole; a fixing member provided in the second through-hole and fixing the lead terminal; and a semiconductor element fixed to the inside part.