公开(公告)号：US20240006843A1

公开(公告)日：2024-01-04

申请号：US18467534

申请日：2023-09-14

申请人： Nuvoton Technology Corporation Japan

发明人： Masanori HIROKI ,  Hiroki SHIROZONO ,  Shigeo HAYASHI

IPC分类号： H01S5/024 ,  H01S5/02315 ,  H01S5/02325 ,  H01S5/02355

CPC分类号： H01S5/02469 ,  H01S5/02315 ,  H01S5/02325 ,  H01S5/02355

摘要： A semiconductor laser light-emitting device includes: a mounting base (mounting substrate); a submount disposed above the mounting base; a connecting member that connects the mounting base and the submount and is composed of a porous metal material; and a semiconductor laser disposed above the submount. The submount includes a front face that is a face on the light emission side of the semiconductor laser. The connecting member includes a peripheral portion that continuously covers at least part of the front face of the submount and the peripheral area of a first area of the top surface of the mounting base, where the first area corresponds to the submount. The top surface of the peripheral portion is straight or recessed at a cross section that intersects the front face of the submount and the top surface of the mounting base.

公开(公告)号：US11942757B2

公开(公告)日：2024-03-26

申请号：US17152026

申请日：2021-01-19

申请人： Waymo LLC

发明人： Paul Karplus ,  Matthew Last

IPC分类号： H01S5/022 ,  H01S5/02 ,  H01S5/02234 ,  H01S5/02253 ,  H01S5/02326 ,  H01S5/02355 ,  H01S5/042 ,  H01S5/02345

CPC分类号： H01S5/02326 ,  H01S5/0206 ,  H01S5/02234 ,  H01S5/02253 ,  H01S5/02355 ,  H01S5/042 ,  H01S5/02345

摘要： The present disclosure relates to optical systems and methods for their manufacture. An example method includes coupling a first surface of a light-emitter substrate to a reference surface of a carrier substrate. The method also includes registering a mold structure with respect to the reference surface of the carrier substrate. Furthermore, the method includes using the mold structure to form an optical material over at least a portion of the light-emitter substrate. The optical material is shaped according to a shape of the mold structure and includes at least one registration feature. The method also includes coupling an optical lens element to the optical material such that the optical lens element is registered to the at least one registration feature.

公开(公告)号：US20230344194A1

公开(公告)日：2023-10-26

申请号：US18304103

申请日：2023-04-20

申请人： NICHIA CORPORATION

发明人： Hidenori MATSUO

IPC分类号： H01S5/02325 ,  H01S5/40 ,  H01S5/02257 ,  H01S5/00 ,  H01S5/02253 ,  H01S5/02355 ,  H01S5/02255

CPC分类号： H01S5/02325 ,  H01S5/4093 ,  H01S5/02257 ,  H01S5/0014 ,  H01S5/4031 ,  H01S5/02253 ,  H01S5/02355 ,  H01S5/02255

摘要： A laser light source includes: a substrate having an upper face and a lower face; one or more semiconductor laser devices configured to emit laser light, the one or more semiconductor laser devices being supported by the upper face of the substrate; a plurality of optical members configured to reflect or transmit the laser light; a supporting member secured to the substrate, the supporting member supporting at least one of the plurality of optical members; and a bonding layer located between the at least one of the plurality of optical members and the supporting member, the bonding layer bonding together the at least one of the plurality of optical members and the supporting member. A thermal conductivity of the supporting member is lower than that of the substrate.

公开(公告)号：US20230344196A1

公开(公告)日：2023-10-26

申请号：US18338467

申请日：2023-06-21

申请人： NICHIA CORPORATION

发明人： Hideyuki FUJIMOTO

IPC分类号： H01S5/02355 ,  H01S5/024 ,  H01S5/02345

CPC分类号： H01S5/02355 ,  H01S5/02469 ,  H01S5/02345 ,  H01S5/02212

摘要： A semiconductor laser device includes: a housing including: a first upper upward-facing surface, a mounting surface below the first upper upward-facing surface, inner lateral surfaces including a first inner lateral surface and a second inner lateral surface facing the first inner lateral surface, wherein the first upper upward-facing surface and the mounting surface are formed inward of the inner lateral surfaces, and a first wiring part disposed on the first upper upward-facing surface; a semiconductor laser element including: a light output surface, a first lateral surface extending from the light output surface and facing the first inner lateral surface, and a second lateral surface extending from the light output surface and opposite to the first lateral surface; and a first wire connected to the first wiring part for electrical connection of the semiconductor laser element.

公开(公告)号：US11749961B2

公开(公告)日：2023-09-05

申请号：US17697897

申请日：2022-03-17

申请人： NICHIA CORPORATION

发明人： Masatoshi Nakagaki ,  Soichiro Miura

IPC分类号： H01S5/02355 ,  H01S5/0239 ,  H01S5/40 ,  H01S5/0233 ,  H01S5/022 ,  H01S5/02345

CPC分类号： H01S5/0239 ,  H01S5/022 ,  H01S5/0233 ,  H01S5/02355 ,  H01S5/40 ,  H01S5/4031 ,  H01S5/02345

摘要： A light emitting device includes first to third semiconductor laser elements. Each of the semiconductor laser elements includes at least two emitters, and configured to emit red-color light, green-color light, or blue-color light. The mount member includes first to third conduction parts, each including a plurality of metal films including mounting regions that are aligned in a predetermined direction. The first to third semiconductor laser elements are respectively mounted on the first to third conduction parts of the mount member in a junction-down configuration.

公开(公告)号：US11728618B2

公开(公告)日：2023-08-15

申请号：US17456827

申请日：2021-11-29

申请人： Cisco Technology, Inc.

发明人： Frederick W. Warning, Jr.

IPC分类号： H01S5/024 ,  H01S5/40 ,  H01S5/02325 ,  H01S5/02355 ,  H01S5/02218 ,  H01S5/02253

CPC分类号： H01S5/02469 ,  H01S5/02218 ,  H01S5/02325 ,  H01S5/02355 ,  H01S5/4025 ,  H01S5/02253

摘要： An optoelectronic assembly and methods of fabrication thereof are provided. The assembly includes a sub-mount, one or more micro-devices attached to the sub-mount, and a lid attached to the sub-mount. The lid includes a dispense channel and a gel groove which allows for a thermal gel to be dispensed between the lid and the micro-device in a manner that mitigates the thermal gel dispersing and/or flowing onto components of the micro-devices.

公开(公告)号：US20230178961A1

公开(公告)日：2023-06-08

申请号：US18155019

申请日：2023-01-16

申请人： Analog Devices International Unlimited Company

发明人： Jonathan Ephraim David Hurwitz ,  David Neil

IPC分类号： H01S5/042 ,  H01S5/02325 ,  H01S5/02345 ,  H01S5/02355 ,  H03K17/687

CPC分类号： H01S5/0428 ,  H01S5/02325 ,  H01S5/02345 ,  H01S5/02355 ,  H03K17/6871

摘要： The present disclosure relates to a light source system suitable for use in a time of flight camera. The light source system includes a light source, such as a laser, and a driver arranged to supply a drive current to the light source to turn the light source on to emit light. The driver includes two transistors coupled to the light source in series, such that when both transistors are turned on, a drive circuit is completed, current flows and the light source turns on. A very short pulse of light emission may be achieved efficiently by switching one of the transistors to the on-state to complete the drive circuit and a short time later turning off the other transistor in order to break the drive circuit. In this way, a pulse of light in the order of less than 1 nanosecond or less than 500 picoseconds may be achieved.

公开(公告)号：US12113332B2

公开(公告)日：2024-10-08

申请号：US18358019

申请日：2023-07-24

申请人： NICHIA CORPORATION

发明人： Masatoshi Nakagaki ,  Soichiro Miura

IPC分类号： H01S5/02355 ,  H01S5/022 ,  H01S5/0233 ,  H01S5/0239 ,  H01S5/40 ,  H01S5/02345

CPC分类号： H01S5/0239 ,  H01S5/022 ,  H01S5/0233 ,  H01S5/02355 ,  H01S5/40 ,  H01S5/4031 ,  H01S5/02345

摘要： A light emitting device includes first and second semiconductor laser elements, first and second light-reflective members, and a basal part. The light emitted from the first semiconductor laser element irradiates a first light-reflective surface of the first light-reflective member at a first position. The light emitted from the second semiconductor laser element irradiates a second light-reflective surface of the second light-reflective member at a second position. A height of the first position is different from a height of the second position. With respect to a virtual axis extending along the prescribed direction, the first position and the second position have the same coordinates. A mounting position of the first light-reflective member and a mounting position of the second light-reflective member are different with respect to the prescribed direction.

公开(公告)号：US12100928B2

公开(公告)日：2024-09-24

申请号：US18310106

申请日：2023-05-01

申请人： NICHIA CORPORATION ,  SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Takuya Hashimoto ,  Eiichiro Okahisa ,  Katsuya Nakazawa ,  Shigeru Matsushita ,  Sumio Uehara ,  Suguru Kobayashi ,  Kazuhito Yumoto

IPC分类号： H01S5/0235 ,  H01S5/02208 ,  H01S5/02255 ,  H01S5/02355 ,  H01S5/024 ,  H01S5/40

CPC分类号： H01S5/0235 ,  H01S5/02208 ,  H01S5/02355 ,  H01S5/02469 ,  H01S5/40 ,  H01S5/02255

摘要： A method of manufacturing a semiconductor device includes: preparing a bottom plate having an upper surface and a lower surface, wherein the lower surface of the bottom plate comprises a reference part and one or more inclined surfaces that are inclined with respect to the reference part, an upper portion of the one or more inclined surfaces being positioned above the reference part, and wherein a thickness of the bottom plate at the reference part is greater than a thickness of the bottom plate at the upper portion of the one or more inclined surfaces; joining a frame member to the bottom plate, at least a part of the frame member being disposed directly above the one or more inclined surfaces, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the bottom plate.

公开(公告)号：US20240106190A1

公开(公告)日：2024-03-28

申请号：US18273369

申请日：2022-01-21

申请人： KYOCERA Corporation

发明人： Kentaro MURAKAWA

IPC分类号： H01S5/02355 ,  H01S5/02315 ,  H01S5/028 ,  H01S5/042 ,  H01S5/22

CPC分类号： H01S5/02355 ,  H01S5/02315 ,  H01S5/028 ,  H01S5/04257 ,  H01S5/2201 ,  H01S5/32341

摘要： A light-emitting element includes a laminate and a first insulating film. The laminate has a plurality of semiconductor layers, and includes a first end surface, a second end surface opposed to the first end surface, and a pair of side surfaces connecting the first end surface and the second end surface. The first insulating film is located over at least one of the pair of side surfaces from the first end surface.