公开(公告)号：US12100928B2

公开(公告)日：2024-09-24

申请号：US18310106

申请日：2023-05-01

Applicant: NICHIA CORPORATION ,  SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Takuya Hashimoto ,  Eiichiro Okahisa ,  Katsuya Nakazawa ,  Shigeru Matsushita ,  Sumio Uehara ,  Suguru Kobayashi ,  Kazuhito Yumoto

IPC: H01S5/0235 ,  H01S5/02208 ,  H01S5/02255 ,  H01S5/02355 ,  H01S5/024 ,  H01S5/40

CPC classification number: H01S5/0235 ,  H01S5/02208 ,  H01S5/02355 ,  H01S5/02469 ,  H01S5/40 ,  H01S5/02255

Abstract: A method of manufacturing a semiconductor device includes: preparing a bottom plate having an upper surface and a lower surface, wherein the lower surface of the bottom plate comprises a reference part and one or more inclined surfaces that are inclined with respect to the reference part, an upper portion of the one or more inclined surfaces being positioned above the reference part, and wherein a thickness of the bottom plate at the reference part is greater than a thickness of the bottom plate at the upper portion of the one or more inclined surfaces; joining a frame member to the bottom plate, at least a part of the frame member being disposed directly above the one or more inclined surfaces, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the bottom plate.

公开(公告)号：US11784459B2

公开(公告)日：2023-10-10

申请号：US17539882

申请日：2021-12-01

Applicant: KYOCERA Corporation

Inventor： Sentarou Yamamoto ,  Youji Furukubo ,  Masanori Okamoto ,  Toshifumi Higashi

IPC: H01S5/02315 ,  H01L23/13 ,  H01S5/022 ,  H01L23/12 ,  H01L23/36 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235 ,  H01L23/15 ,  H01L23/498 ,  H01S5/024 ,  H01S5/40 ,  H01S5/02345

CPC classification number: H01S5/02315 ,  H01L23/12 ,  H01L23/13 ,  H01L23/15 ,  H01L23/36 ,  H01L23/49827 ,  H01L23/49838 ,  H01S5/022 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/02469 ,  H01S5/4093 ,  H01L2224/48091 ,  H01L2924/15192 ,  H01S5/02345 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light emitting element mounting package includes a plate-like substrate and a base that protrudes from a front surface of the substrate and has a mounting surface on which a light emitting element is mounted. A power supply terminal is provided on the front surface of the substrate, and the power supply terminal is arranged in a direction that is opposite to a direction where an emitting surface of the light emitting element is oriented. The light emitting element mounting package further includes a wiring conductor inside the substrate, wherein the wiring conductor extends to a side of the power supply terminal where one end thereof is positioned at a side of the power supply terminal with respect to the emitting surface of the light emitting element and the other end thereof is electrically connected to the power supply terminal.

公开(公告)号：US20230268712A1

公开(公告)日：2023-08-24

申请号：US18310106

申请日：2023-05-01

Applicant: NICHIA CORPORATION ,  SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Takuya Hashimoto ,  Eiichiro Okahisa ,  Katsuya Nakazawa ,  Shigeru Matsushita ,  Sumio Uehara ,  Suguru Kobayashi ,  Kazuhito Yumoto

IPC: H01S5/0235 ,  H01S5/40 ,  H01S5/024 ,  H01S5/02208 ,  H01S5/02355

CPC classification number: H01S5/0235 ,  H01S5/40 ,  H01S5/02469 ,  H01S5/02208 ,  H01S5/02355 ,  H01S5/02255

Abstract: A method of manufacturing a semiconductor device includes: preparing a bottom plate having an upper surface and a lower surface, wherein the lower surface of the bottom plate comprises a reference part and one or more inclined surfaces that are inclined with respect to the reference part, an upper portion of the one or more inclined surfaces being positioned above the reference part, and wherein a thickness of the bottom plate at the reference part is greater than a thickness of the bottom plate at the upper portion of the one or more inclined surfaces; joining a frame member to the bottom plate, at least a part of the frame member being disposed directly above the one or more inclined surfaces, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the bottom plate.

公开(公告)号：US11677211B2

公开(公告)日：2023-06-13

申请号：US17063140

申请日：2020-10-05

Applicant: NICHIA CORPORATION ,  SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Takuya Hashimoto ,  Eiichiro Okahisa ,  Katsuya Nakazawa ,  Shigeru Matsushita ,  Sumio Uehara ,  Suguru Kobayashi ,  Kazuhito Yumoto

IPC: H01S5/02208 ,  H01S5/0235 ,  H01S5/40 ,  H01S5/024 ,  H01S5/02355 ,  H01S5/02255

CPC classification number: H01S5/0235 ,  H01S5/02208 ,  H01S5/02355 ,  H01S5/02469 ,  H01S5/40 ,  H01S5/02255

Abstract: A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to the upper surface of the bottom plate and comprising a first through-hole that penetrates the frame; a plate jointed to the outside or inside surface of the frame, the plate comprising a second through-hole that penetrates the plate in a same direction as that of the first through-hole, a thickness of the plate being greater than a thickness of the frame; a lead terminal inserted into the first through-hole and the second through-hole; a fixing member provided in the second through-hole and fixing the lead terminal; and a semiconductor element fixed to the inside part.

公开(公告)号：US11646549B2

公开(公告)日：2023-05-09

申请号：US16178478

申请日：2018-11-01

Applicant: Nuburu, Inc.

Inventor： Mark Zediker ,  Jean Philippe Feve ,  Matthew Silva Sa ,  Michael Jansen

IPC: H01S5/40 ,  H01S5/024 ,  H01S5/30 ,  H01S5/028 ,  G02B26/00 ,  H01S5/02251 ,  H01S5/02253 ,  H01S5/02326 ,  H01S3/094 ,  H01S3/0941 ,  H01S5/00 ,  H01S5/323 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/14 ,  H01S5/068 ,  H01S5/12

CPC classification number: H01S5/4012 ,  G02B26/00 ,  H01S3/09415 ,  H01S3/094046 ,  H01S3/094053 ,  H01S5/028 ,  H01S5/02251 ,  H01S5/02253 ,  H01S5/02326 ,  H01S5/02469 ,  H01S5/3013 ,  H01S5/4062 ,  H01S5/005 ,  H01S5/0071 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/02423 ,  H01S5/06821 ,  H01S5/12 ,  H01S5/141 ,  H01S5/143 ,  H01S5/146 ,  H01S5/32341 ,  H01S5/4031 ,  H01S5/4087

Abstract: The invention may be embodied in other forms than those specifically disclosed herein without departing from itMulti-kW-class blue (400-495 nm) fiber-delivered lasers and module configurations. In embodiments, the lasers propagate laser beams having beam parameter products of

公开(公告)号：US11644178B2

公开(公告)日：2023-05-09

申请号：US17082912

申请日：2020-10-28

Applicant: NICHIA CORPORATION

Inventor： Soichiro Miura

IPC: F21V13/00 ,  F21V5/04 ,  F21V7/00 ,  F21V13/04 ,  H01S5/00 ,  H01S5/40 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/02255 ,  H01S5/02315 ,  F21Y115/30

CPC classification number: F21V5/04 ,  F21V5/045 ,  F21V7/0066 ,  F21V13/04 ,  H01S5/005 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/02255 ,  H01S5/02315 ,  H01S5/4093 ,  F21Y2115/30

Abstract: A light emitting device includes a base, a first light emitting element and a first light reflecting member disposed on the base and a lens member. The first light reflecting member is positioned with respect to the first light emitting element so that emitted light from the first light emitting element is divided into a portion of the emitted light from the first light emitting element irradiating onto the light reflecting face and a portion of the emitted light from the first light emitting element traveling outside of the light reflecting face by having an edge of the light reflecting face serve as a boundary. The lens member includes a reflected light passing region having a first lens shape configured to control the travelling direction of reflected light, and a non-reflected light passing region having a second lens shape configured to control a travelling direction of non-reflected light.

公开(公告)号：US20240154385A1

公开(公告)日：2024-05-09

申请号：US18414180

申请日：2024-01-16

Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： Hirohisa YASUKAWA

IPC: H01S5/026 ,  H01S5/02345

CPC classification number: H01S5/0261 ,  H01S5/02345 ,  H01S5/026 ,  H01S5/0262 ,  H01S5/0235

Abstract: In a semiconductor laser drive device, a wiring inductance in electrically connecting a semiconductor laser and a laser driver is reduced. The semiconductor laser drive device includes a substrate, the laser driver, and the semiconductor laser. The laser driver is built in the substrate. The semiconductor laser is mounted on one surface of the substrate of the semiconductor laser drive device. Connection wiring electrically connects the laser driver and the semiconductor laser by a wiring inductance of 0.5 nanohenries or less.

公开(公告)号：US11973308B2

公开(公告)日：2024-04-30

申请号：US17103587

申请日：2020-11-24

Applicant: KYOCERA SLD Laser, Inc.

Inventor： James W. Raring ,  Paul Rudy ,  Eric Goutain ,  Troy Trottier ,  Melvin McLaurin ,  James Harrison ,  Sten Heikman ,  Michael Cantore

IPC: H01S5/00 ,  F21K9/64 ,  H01S5/02212 ,  H01S5/02257 ,  H01S5/023 ,  H01S5/02315 ,  H01S5/02326 ,  H01S5/0233 ,  H01S5/32 ,  H01S5/343 ,  H01L33/00 ,  H01S5/02 ,  H01S5/02345 ,  H01S5/0235 ,  H01S5/22 ,  H01S5/40

CPC classification number: H01S5/0087 ,  F21K9/64 ,  H01S5/02257 ,  H01S5/023 ,  H01S5/02315 ,  H01S5/02326 ,  H01S5/0233 ,  H01S5/32 ,  H01S5/3203 ,  H01S5/34333 ,  H01L33/0045 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01S5/0202 ,  H01S5/0216 ,  H01S5/0217 ,  H01S5/02212 ,  H01S5/02345 ,  H01S5/0235 ,  H01S5/2201 ,  H01S5/320225 ,  H01S5/32025 ,  H01S5/320275 ,  H01S5/4056 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: The embodiments described herein provide a device and method for an integrated white colored electromagnetic radiation source using a combination of laser diode excitation sources based on gallium and nitrogen containing materials and light emitting source based on phosphor materials. A violet, blue, or other wavelength laser diode source based on gallium and nitrogen materials may be closely integrated with phosphor materials, such as yellow phosphors, to form a compact, high-brightness, and highly-efficient, white light source. The phosphor material is provided with a plurality of scattering centers scribed on an excitation surface or inside bulk of a plate to scatter electromagnetic radiation of a laser beam from the excitation source incident on the excitation surface to enhance generation and quality of an emitted light from the phosphor material for outputting a white light emission either in reflection mode or transmission mode.

公开(公告)号：US11967803B2

公开(公告)日：2024-04-23

申请号：US17985997

申请日：2022-11-14

Applicant: NICHIA CORPORATION

Inventor： Kazuma Kozuru ,  Takuya Hashimoto

IPC: H01S5/40 ,  G03B21/20 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/0237 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02325

CPC classification number: H01S5/4087 ,  G03B21/2013 ,  G03B21/2033 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/0237 ,  H01S5/4093 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02325

Abstract: A light emitting module includes: a first light emitting device including: a first package, a plurality of first semiconductor laser elements mounted in the first package, and a first lens member having lens portions, a number of the lens portion is the same as a number of the first semiconductor laser elements; and a second light emitting device including: a second package, a plurality of second semiconductor laser elements mounted in the second package, wherein a quantity of the second semiconductor laser elements is fewer than a quantity of the first semiconductor laser elements, and a second lens member which is structured the same as the first lens member; and one or more mounting substrates in which the first light emitting device and the second light emitting device are mounted.

公开(公告)号：US11940533B2

公开(公告)日：2024-03-26

申请号：US16556621

申请日：2019-08-30

Applicant: Rohm Co., Ltd.

Inventor： Yoshitsugu Uedaira

IPC: G01S17/04 ,  G01S7/481 ,  G01S7/4865 ,  G01S7/497 ,  G01S17/06 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0683 ,  H01S5/183 ,  H01S5/02257 ,  H01S5/0235

CPC classification number: G01S17/04 ,  G01S7/4813 ,  G01S7/4816 ,  G01S7/4865 ,  G01S7/497 ,  G01S17/06 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0683 ,  H01S5/02257 ,  H01S5/0235 ,  H01S5/183

Abstract: The present disclosure relates to a proximity sensor. The proximity sensor includes: a light emitter (for example, a vertical cavity surface emitting LASER (VCSEL)) configured to irradiate light to a target to be inspected; a first light receiver having a first crosstalk characteristic, configured to detect an external reflected light from a target to be inspected within a first detection region (for example, 0˜5 cm approximately); and a second light receiver having a second crosstalk characteristic different from the first crosstalk characteristic, configured to detect an external reflected light from a target to be inspected within a second detection region (for example, 3˜60 cm approximately) relatively further than the first detection region.