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公开(公告)号：US12100928B2
公开(公告)日：2024-09-24
申请号：US18310106
申请日：2023-05-01
发明人： Takuya Hashimoto , Eiichiro Okahisa , Katsuya Nakazawa , Shigeru Matsushita , Sumio Uehara , Suguru Kobayashi , Kazuhito Yumoto
IPC分类号： H01S5/0235 , H01S5/02208 , H01S5/02255 , H01S5/02355 , H01S5/024 , H01S5/40
CPC分类号： H01S5/0235 , H01S5/02208 , H01S5/02355 , H01S5/02469 , H01S5/40 , H01S5/02255
摘要： A method of manufacturing a semiconductor device includes: preparing a bottom plate having an upper surface and a lower surface, wherein the lower surface of the bottom plate comprises a reference part and one or more inclined surfaces that are inclined with respect to the reference part, an upper portion of the one or more inclined surfaces being positioned above the reference part, and wherein a thickness of the bottom plate at the reference part is greater than a thickness of the bottom plate at the upper portion of the one or more inclined surfaces; joining a frame member to the bottom plate, at least a part of the frame member being disposed directly above the one or more inclined surfaces, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the bottom plate.
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公开(公告)号：US20210021097A1
公开(公告)日：2021-01-21
申请号：US17063140
申请日：2020-10-05
发明人： Takuya Hashimoto , Eiichiro Okahisa , Katsuya Nakazawa , Shigeru Matsushita , Sumio Uehara , Suguru Kobayashi , Kazuhito Yumoto
摘要： A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to the upper surface of the bottom plate and comprising a first through-hole that penetrates the frame; a plate jointed to the outside or inside surface of the frame, the plate comprising a second through-hole that penetrates the plate in a same direction as that of the first through-hole, a thickness of the plate being greater than a thickness of the frame; a lead terminal inserted into the first through-hole and the second through-hole; a fixing member provided in the second through-hole and fixing the lead terminal; and a semiconductor element fixed to the inside part.
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公开(公告)号：US20230268712A1
公开(公告)日：2023-08-24
申请号：US18310106
申请日：2023-05-01
发明人： Takuya Hashimoto , Eiichiro Okahisa , Katsuya Nakazawa , Shigeru Matsushita , Sumio Uehara , Suguru Kobayashi , Kazuhito Yumoto
IPC分类号： H01S5/0235 , H01S5/40 , H01S5/024 , H01S5/02208 , H01S5/02355
CPC分类号： H01S5/0235 , H01S5/40 , H01S5/02469 , H01S5/02208 , H01S5/02355 , H01S5/02255
摘要： A method of manufacturing a semiconductor device includes: preparing a bottom plate having an upper surface and a lower surface, wherein the lower surface of the bottom plate comprises a reference part and one or more inclined surfaces that are inclined with respect to the reference part, an upper portion of the one or more inclined surfaces being positioned above the reference part, and wherein a thickness of the bottom plate at the reference part is greater than a thickness of the bottom plate at the upper portion of the one or more inclined surfaces; joining a frame member to the bottom plate, at least a part of the frame member being disposed directly above the one or more inclined surfaces, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the bottom plate.
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公开(公告)号：US11677211B2
公开(公告)日：2023-06-13
申请号：US17063140
申请日：2020-10-05
发明人： Takuya Hashimoto , Eiichiro Okahisa , Katsuya Nakazawa , Shigeru Matsushita , Sumio Uehara , Suguru Kobayashi , Kazuhito Yumoto
IPC分类号： H01S5/02208 , H01S5/0235 , H01S5/40 , H01S5/024 , H01S5/02355 , H01S5/02255
CPC分类号： H01S5/0235 , H01S5/02208 , H01S5/02355 , H01S5/02469 , H01S5/40 , H01S5/02255
摘要： A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to the upper surface of the bottom plate and comprising a first through-hole that penetrates the frame; a plate jointed to the outside or inside surface of the frame, the plate comprising a second through-hole that penetrates the plate in a same direction as that of the first through-hole, a thickness of the plate being greater than a thickness of the frame; a lead terminal inserted into the first through-hole and the second through-hole; a fixing member provided in the second through-hole and fixing the lead terminal; and a semiconductor element fixed to the inside part.
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公开(公告)号：US10833473B2
公开(公告)日：2020-11-10
申请号：US16365580
申请日：2019-03-26
发明人： Takuya Hashimoto , Eiichiro Okahisa , Katsuya Nakazawa , Shigeru Matsushita , Sumio Uehara , Suguru Kobayashi , Kazuhito Yumoto
摘要： A method of manufacturing a semiconductor device includes, in this order: preparing a bottom plate having an upper surface and a lower surface, wherein the upper surface includes an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part, and wherein the lower surface of the bottom plate includes a reference part and a recess positioned above the reference part, at least a part of the recess being disposed directly below the outer peripheral part; joining a frame member to the outer peripheral part of the bottom plate, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the inside part of the bottom plate.
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公开(公告)号：US10522969B2
公开(公告)日：2019-12-31
申请号：US16164588
申请日：2018-10-18
摘要： A light-emitting device includes: a package body; a lid body connected to the package body, wherein the package body and the lid body together form a sealed space; and a plurality of light-emitting elements disposed in the sealed space. The lid body includes: a non-transmissive member including an outer frame, and one or more inner frames connected to the outer frame, wherein the outer frame and the one or more inner frames define a plurality of openings, a transmissive member integrally covering the plurality of openings and configured to allow light emitted from the plurality of light-emitting elements to be transmitted through the plurality of openings, and an adhesive member fixing the transmissive member to the non-transmissive member. The adhesive member is located on the outer frame and is not located on the one or more inner frames.
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公开(公告)号：US11967803B2
公开(公告)日：2024-04-23
申请号：US17985997
申请日：2022-11-14
申请人： NICHIA CORPORATION
发明人： Kazuma Kozuru , Takuya Hashimoto
IPC分类号： H01S5/40 , G03B21/20 , H01S5/023 , H01S5/0233 , H01S5/0235 , H01S5/0237 , H01S5/02253 , H01S5/02255 , H01S5/02257 , H01S5/02325
CPC分类号： H01S5/4087 , G03B21/2013 , G03B21/2033 , H01S5/023 , H01S5/0233 , H01S5/0235 , H01S5/0237 , H01S5/4093 , H01S5/02253 , H01S5/02255 , H01S5/02257 , H01S5/02325
摘要： A light emitting module includes: a first light emitting device including: a first package, a plurality of first semiconductor laser elements mounted in the first package, and a first lens member having lens portions, a number of the lens portion is the same as a number of the first semiconductor laser elements; and a second light emitting device including: a second package, a plurality of second semiconductor laser elements mounted in the second package, wherein a quantity of the second semiconductor laser elements is fewer than a quantity of the first semiconductor laser elements, and a second lens member which is structured the same as the first lens member; and one or more mounting substrates in which the first light emitting device and the second light emitting device are mounted.
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公开(公告)号：US11670733B2
公开(公告)日：2023-06-06
申请号：US17473375
申请日：2021-09-13
申请人： NICHIA CORPORATION
发明人： Takuya Hashimoto , Soichiro Miura
IPC分类号： H01L31/12 , H01L31/0232 , H01L31/0203 , H01L31/0216 , H01L27/15
CPC分类号： H01L31/12 , H01L27/15 , H01L31/0203 , H01L31/02162 , H01L31/02327
摘要： A light emitting device includes: a first light emitting element having a light emitting surface; an optical member having a lower surface, a first reflecting surface inclined to the lower surface, transmitting part of a first light emitted from the light emitting surface, and reflecting the rest upward, and a second reflecting surface located farther from the light emitting surface than the first reflecting surface and reflecting part or all of the first light passing through the first reflecting surface; and a photodetector located below the optical member and having a top surface provided with one or a plurality of light receiving regions including a first light receiving region configured to receive the first light reflected by the second reflecting surface. In a top view, part or all of the first light receiving region overlaps part or all of the first reflecting surface.
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公开(公告)号：US11644179B2
公开(公告)日：2023-05-09
申请号：US17476941
申请日：2021-09-16
申请人： NICHIA CORPORATION
发明人： Takuya Hashimoto
IPC分类号： F21V5/00 , F21V5/04 , F21Y113/10 , F21Y103/10
CPC分类号： F21V5/04 , F21Y2103/10 , F21Y2113/10
摘要： A light emitting device includes: a lens member having at least one lens surface; a submount; and a plurality of light emitting elements arranged in a row on an upper face of the submount, including a first light emitting element configured to emit first light having an emission peak at a first wavelength and a second light emitting element configured to emit second light having an emission peak at a second wavelength from a second light emission point, the second wavelength being different from the first wavelength, and the second light emission point being located farther from the lens member than a first plane that is perpendicular to an optical axis of the lens surface and that passes through the first light emission point.
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公开(公告)号：US10608406B2
公开(公告)日：2020-03-31
申请号：US16203477
申请日：2018-11-28
申请人： NICHIA CORPORATION
发明人： Takuya Hashimoto , Eiichiro Okahisa
摘要： A light emitting device includes: a base including: a main body, and a frame disposed on an upper surface of the main body; one or more laser elements disposed on the upper surface of the main body inward of the frame; a cover comprising: a support member that is fixed on an upper surface of the frame and has an opening inside the frame, and a light transmissive portion disposed so as to close the opening; and a lens body disposed above the light transmissive portion. The support member includes; a first portion fixed on the upper surface of the frame, a second portion on which the lens body is disposed, the second portion being positioned inward of and lower than the first portion, and a third portion on which the light transmissive portion is disposed, the third portion being disposed inward of and lower than the second portion.
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