公开(公告)号：US12100928B2

公开(公告)日：2024-09-24

申请号：US18310106

申请日：2023-05-01

Applicant: NICHIA CORPORATION ,  SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Takuya Hashimoto ,  Eiichiro Okahisa ,  Katsuya Nakazawa ,  Shigeru Matsushita ,  Sumio Uehara ,  Suguru Kobayashi ,  Kazuhito Yumoto

IPC: H01S5/0235 ,  H01S5/02208 ,  H01S5/02255 ,  H01S5/02355 ,  H01S5/024 ,  H01S5/40

CPC classification number: H01S5/0235 ,  H01S5/02208 ,  H01S5/02355 ,  H01S5/02469 ,  H01S5/40 ,  H01S5/02255

Abstract: A method of manufacturing a semiconductor device includes: preparing a bottom plate having an upper surface and a lower surface, wherein the lower surface of the bottom plate comprises a reference part and one or more inclined surfaces that are inclined with respect to the reference part, an upper portion of the one or more inclined surfaces being positioned above the reference part, and wherein a thickness of the bottom plate at the reference part is greater than a thickness of the bottom plate at the upper portion of the one or more inclined surfaces; joining a frame member to the bottom plate, at least a part of the frame member being disposed directly above the one or more inclined surfaces, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the bottom plate.

公开(公告)号：US20210021097A1

公开(公告)日：2021-01-21

申请号：US17063140

申请日：2020-10-05

Applicant: NICHIA CORPORATION ,  SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Takuya Hashimoto ,  Eiichiro Okahisa ,  Katsuya Nakazawa ,  Shigeru Matsushita ,  Sumio Uehara ,  Suguru Kobayashi ,  Kazuhito Yumoto

IPC: H01S5/022 ,  H01S5/40 ,  H01S5/024

Abstract: A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to the upper surface of the bottom plate and comprising a first through-hole that penetrates the frame; a plate jointed to the outside or inside surface of the frame, the plate comprising a second through-hole that penetrates the plate in a same direction as that of the first through-hole, a thickness of the plate being greater than a thickness of the frame; a lead terminal inserted into the first through-hole and the second through-hole; a fixing member provided in the second through-hole and fixing the lead terminal; and a semiconductor element fixed to the inside part.

公开(公告)号：US20230268712A1

公开(公告)日：2023-08-24

申请号：US18310106

申请日：2023-05-01

Applicant: NICHIA CORPORATION ,  SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Takuya Hashimoto ,  Eiichiro Okahisa ,  Katsuya Nakazawa ,  Shigeru Matsushita ,  Sumio Uehara ,  Suguru Kobayashi ,  Kazuhito Yumoto

IPC: H01S5/0235 ,  H01S5/40 ,  H01S5/024 ,  H01S5/02208 ,  H01S5/02355

CPC classification number: H01S5/0235 ,  H01S5/40 ,  H01S5/02469 ,  H01S5/02208 ,  H01S5/02355 ,  H01S5/02255

Abstract: A method of manufacturing a semiconductor device includes: preparing a bottom plate having an upper surface and a lower surface, wherein the lower surface of the bottom plate comprises a reference part and one or more inclined surfaces that are inclined with respect to the reference part, an upper portion of the one or more inclined surfaces being positioned above the reference part, and wherein a thickness of the bottom plate at the reference part is greater than a thickness of the bottom plate at the upper portion of the one or more inclined surfaces; joining a frame member to the bottom plate, at least a part of the frame member being disposed directly above the one or more inclined surfaces, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the bottom plate.

公开(公告)号：US11677211B2

公开(公告)日：2023-06-13

申请号：US17063140

申请日：2020-10-05

Applicant: NICHIA CORPORATION ,  SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Takuya Hashimoto ,  Eiichiro Okahisa ,  Katsuya Nakazawa ,  Shigeru Matsushita ,  Sumio Uehara ,  Suguru Kobayashi ,  Kazuhito Yumoto

IPC: H01S5/02208 ,  H01S5/0235 ,  H01S5/40 ,  H01S5/024 ,  H01S5/02355 ,  H01S5/02255

CPC classification number: H01S5/0235 ,  H01S5/02208 ,  H01S5/02355 ,  H01S5/02469 ,  H01S5/40 ,  H01S5/02255

Abstract: A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to the upper surface of the bottom plate and comprising a first through-hole that penetrates the frame; a plate jointed to the outside or inside surface of the frame, the plate comprising a second through-hole that penetrates the plate in a same direction as that of the first through-hole, a thickness of the plate being greater than a thickness of the frame; a lead terminal inserted into the first through-hole and the second through-hole; a fixing member provided in the second through-hole and fixing the lead terminal; and a semiconductor element fixed to the inside part.

公开(公告)号：US10833473B2

公开(公告)日：2020-11-10

申请号：US16365580

申请日：2019-03-26

Applicant: NICHIA CORPORATION ,  SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Takuya Hashimoto ,  Eiichiro Okahisa ,  Katsuya Nakazawa ,  Shigeru Matsushita ,  Sumio Uehara ,  Suguru Kobayashi ,  Kazuhito Yumoto

IPC: H01S5/022 ,  H01S5/40 ,  H01S5/024

Abstract: A method of manufacturing a semiconductor device includes, in this order: preparing a bottom plate having an upper surface and a lower surface, wherein the upper surface includes an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part, and wherein the lower surface of the bottom plate includes a reference part and a recess positioned above the reference part, at least a part of the recess being disposed directly below the outer peripheral part; joining a frame member to the outer peripheral part of the bottom plate, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the inside part of the bottom plate.

公开(公告)号：US10522969B2

公开(公告)日：2019-12-31

申请号：US16164588

申请日：2018-10-18

Applicant: NICHIA CORPORATION ,  SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Takuya Hashimoto ,  Kazuma Kozuru ,  Eiichiro Okahisa ,  Katsuya Nakazawa ,  Makoto Kubota

IPC: H01S5/40 ,  H01S5/022 ,  H01S5/042

Abstract: A light-emitting device includes: a package body; a lid body connected to the package body, wherein the package body and the lid body together form a sealed space; and a plurality of light-emitting elements disposed in the sealed space. The lid body includes: a non-transmissive member including an outer frame, and one or more inner frames connected to the outer frame, wherein the outer frame and the one or more inner frames define a plurality of openings, a transmissive member integrally covering the plurality of openings and configured to allow light emitted from the plurality of light-emitting elements to be transmitted through the plurality of openings, and an adhesive member fixing the transmissive member to the non-transmissive member. The adhesive member is located on the outer frame and is not located on the one or more inner frames.

公开(公告)号：US12224387B2

公开(公告)日：2025-02-11

申请号：US17556530

申请日：2021-12-20

Applicant: NICHIA CORPORATION

Inventor： Takuya Hashimoto ,  Soichiro Miura

IPC: H01L21/00 ,  H01L25/16 ,  H01L27/15 ,  H01L33/58 ,  H01L33/62

Abstract: A light emitting device includes: a first light-emitting element; a second light-emitting element; a photodetector having a light-receiving surface at an upper face thereof, the light-receiving surface including: a first light-receiving region configured to receive a portion of light emitted from the first light-emitting element, and a second light-receiving region configured to receive a portion of light emitted from the second light-emitting element; and at least one lens member having: at least one incident surface on which a portion of the light emitted from the first light-emitting element and/or a portion of the light emitted from the second light-emitting element are incident, and at least one exiting surface through which the portion of the light incident on the incident surface is emitted. In a top view, the lens member is disposed so as to overlap the upper face of the photodetector in part or in whole.

公开(公告)号：US11967803B2

公开(公告)日：2024-04-23

申请号：US17985997

申请日：2022-11-14

Applicant: NICHIA CORPORATION

Inventor： Kazuma Kozuru ,  Takuya Hashimoto

IPC: H01S5/40 ,  G03B21/20 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/0237 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02325

CPC classification number: H01S5/4087 ,  G03B21/2013 ,  G03B21/2033 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/0237 ,  H01S5/4093 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02325

Abstract: A light emitting module includes: a first light emitting device including: a first package, a plurality of first semiconductor laser elements mounted in the first package, and a first lens member having lens portions, a number of the lens portion is the same as a number of the first semiconductor laser elements; and a second light emitting device including: a second package, a plurality of second semiconductor laser elements mounted in the second package, wherein a quantity of the second semiconductor laser elements is fewer than a quantity of the first semiconductor laser elements, and a second lens member which is structured the same as the first lens member; and one or more mounting substrates in which the first light emitting device and the second light emitting device are mounted.

公开(公告)号：US11670733B2

公开(公告)日：2023-06-06

申请号：US17473375

申请日：2021-09-13

Applicant: NICHIA CORPORATION

Inventor： Takuya Hashimoto ,  Soichiro Miura

IPC: H01L31/12 ,  H01L31/0232 ,  H01L31/0203 ,  H01L31/0216 ,  H01L27/15

CPC classification number: H01L31/12 ,  H01L27/15 ,  H01L31/0203 ,  H01L31/02162 ,  H01L31/02327

Abstract: A light emitting device includes: a first light emitting element having a light emitting surface; an optical member having a lower surface, a first reflecting surface inclined to the lower surface, transmitting part of a first light emitted from the light emitting surface, and reflecting the rest upward, and a second reflecting surface located farther from the light emitting surface than the first reflecting surface and reflecting part or all of the first light passing through the first reflecting surface; and a photodetector located below the optical member and having a top surface provided with one or a plurality of light receiving regions including a first light receiving region configured to receive the first light reflected by the second reflecting surface. In a top view, part or all of the first light receiving region overlaps part or all of the first reflecting surface.

公开(公告)号：US11644179B2

公开(公告)日：2023-05-09

申请号：US17476941

申请日：2021-09-16

Applicant: NICHIA CORPORATION

Inventor： Takuya Hashimoto

IPC: F21V5/00 ,  F21V5/04 ,  F21Y113/10 ,  F21Y103/10

CPC classification number: F21V5/04 ,  F21Y2103/10 ,  F21Y2113/10

Abstract: A light emitting device includes: a lens member having at least one lens surface; a submount; and a plurality of light emitting elements arranged in a row on an upper face of the submount, including a first light emitting element configured to emit first light having an emission peak at a first wavelength and a second light emitting element configured to emit second light having an emission peak at a second wavelength from a second light emission point, the second wavelength being different from the first wavelength, and the second light emission point being located farther from the lens member than a first plane that is perpendicular to an optical axis of the lens surface and that passes through the first light emission point.