公开(公告)号：US20040174092A1

公开(公告)日：2004-09-09

申请号：US10691238

申请日：2003-10-22

申请人： Toyo Communication Equipment Co., Ltd.

发明人： Hirokazu Iwata

IPC分类号： H01L041/04

CPC分类号： H03H9/0547 ,  H03H3/04 ,  H03H9/1021 ,  H03H9/17 ,  H03H2003/022 ,  H03H2003/0485

摘要： In the case where an ultraminiature piezoelectric substrate, which has a resonating portion formed by making a concavity by etching in the surface of the piezoelectric substrate made of an anisotropic crystal material, is mass-produced by batch operation using a large-area piezoelectric substrate wafer, an annular portion surrounding each concavity is formed sufficiently thick to prevent cracking from occurring when the wafer is severed. A piezoelectric substrate 2 of an anisotropic piezoelectric crystal material has a thin resonating portion 4 and a thick annular portion 5 integrally surrounding the outer marginal edge of the resonating portion to form a concavity 3 in at least one of major surfaces of the substrate; the inner wall 5a of the annular portion in the one crystal orientation slopes gently more than the inner wall in the other crystal orientation perpendicular to said one crystal orientation, and the piezoelectric substrate is longer in said one crystal orientation than in the other crystal orientation.

摘要翻译： 在通过使用大面积压电基板晶片的批量操作来批量生产具有通过在由各向异性晶体材料制成的压电基板的表面中通过蚀刻形成凹陷而形成的谐振部分的超微压电基板的情况下 围绕每个凹部的环形部分形成得足够厚以防止当晶片断开时发生裂纹。 各向异性压电晶体材料的压电基片2具有薄的谐振部分4和一个围绕谐振部分的外边缘的厚的环形部分5，以在基片的至少一个主表面中形成凹陷3; 一个晶体取向中的环形部分的内壁5a在垂直于所述一个晶体取向的另一个晶体取向中比内壁轻轻地倾斜，并且压电基片在所述一个晶体取向上比在另一个晶体取向上更长。

公开(公告)号：US20040070462A1

公开(公告)日：2004-04-15

申请号：US10268867

申请日：2002-10-10

发明人： Iyad Alhayek ,  Jaroslaw Adamski ,  Marc Black ,  Craig Ernsberger ,  Jason B. Langhorn

IPC分类号： H03B005/32

CPC分类号： H03H9/1021 ,  H01L2224/16225 ,  H01L2924/16195 ,  H01L2924/181 ,  H03H3/02 ,  H03H3/04 ,  H03H9/0552 ,  H03H9/132 ,  H03H2003/022 ,  H03H2003/0485 ,  H01L2924/00012

摘要： An oscillator package with an improved crystal mount. The oscillator package has substrate with a top cavity and a bottom cavity. Vias extend through the substrate between the top and bottom cavities. A semiconductor die is located in the bottom cavity and is covered by a sealant. A crystal is located in the top cavity. The crystal is mounted in the top cavity using a thermosonically deposited gold bump. The gold bump is attached between an electrode pad and a contact pad. The gold bump provides an electrical connection between the crystal and the substrate and supports the crystal. A cover and seal ring are attached to substrate to hermetically seal the top cavity.

摘要翻译： 具有改进晶体安装的振荡器封装。 振荡器封装具有具有顶腔和底腔的衬底。 通孔在顶部和底部腔之间延伸通过基底。 半导体管芯位于底部空腔中并被密封剂覆盖。 晶体位于顶部腔体中。 使用热沉积的金凸块将晶体安装在顶腔中。 金凸块连接在电极垫和接触垫之间。 金凸块在晶体和衬底之间提供电连接并支撑晶体。 将盖和密封环连接到基板上以气密地密封顶部空腔。