RESISTANCE SPOT WELDING METHOD AND METHOD OF MANUFACTURING WELD JOINT

    公开(公告)号:US20230256534A1

    公开(公告)日:2023-08-17

    申请号:US18005057

    申请日:2021-05-26

    IPC分类号: B23K11/11 B23K31/02 B23K31/12

    摘要: Provided is a resistance spot welding method suitable for manufacturing a weld joint exhibiting excellent delayed fracture resistance. The resistance spot welding method includes sandwiching two or more overlapped steel sheets between a pair of welding electrodes, applying current to the steel sheets while pressing the steel sheets, forming a nugget on overlapping surfaces of the steel sheets to join the steel sheets, and after the joining, directly or indirectly irradiating the nugget with sound waves having a frequency of 10 Hz or more and 100000 Hz or less so that a sound pressure level on a surface of the steel sheet is 30 dB or more.

    Dual metal adapter
    23.
    发明授权

    公开(公告)号:US11668414B2

    公开(公告)日:2023-06-06

    申请号:US16711517

    申请日:2019-12-12

    IPC分类号: F16L13/08 B23K31/02

    CPC分类号: F16L13/08 B23K31/027

    摘要: An assembly includes at least one member having first and second ends. A dual metal adapter for connecting to the at least one member includes an inner tube for receiving and contacting the first end of the at least one member and being formed from a first metal having a first resistivity. An outer tube extends over the inner tube and is secured thereto. The outer tube is formed from a second metal having a second resistivity greater than the first resistivity. The first end of the at least one member is metallurgically bonded to the inner tube.

    Methods of bonding of semiconductor elements to substrates, and related bonding systems

    公开(公告)号:US11616042B2

    公开(公告)日:2023-03-28

    申请号:US17458082

    申请日:2021-08-26

    摘要: A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a substrate oxide reduction chamber configured to receive a substrate. The substrate includes a plurality of first electrically conductive structures. The substrate oxide reduction chamber is configured to receive a reducing gas to contact each of the plurality of first electrically conductive structures. The bonding system also includes a substrate oxide prevention chamber for receiving the substrate after the reducing gas contacts the plurality of first electrically conductive structures. The substrate oxide prevention chamber has an inert environment when receiving the substrate. The bonding system also includes a reducing gas delivery system for providing a reducing gas environment during bonding of a semiconductor element to the substrate.

    Soldering apparatus, computer-readable medium, and soldering method

    公开(公告)号:US11577334B2

    公开(公告)日:2023-02-14

    申请号:US16205942

    申请日:2018-11-30

    申请人: Hakko Corporation

    摘要: Gerber data for a substrate includes coordinates for physical features on the substrate. The coordinates are relative to a substrate origin point on the substrate. The gerber data allows a user to specify any of the physical features as soldering targets of a soldering apparatus that includes a motor for moving a soldering iron according to coordinates relative to a system origin point of the soldering apparatus. When the substrate is placed on the soldering apparatus, its substrate origin point differs from the system origin point of the soldering apparatus. The user may input coordinates for the substrate origin point, which are used by the soldering apparatus to derive coordinates, usable by soldering apparatus, from coordinates in the gerber data. In this way, it is possible to reduce the workload of the user when programming the soldering apparatus to perform a soldering process.

    BEAD APPEARANCE INSPECTION DEVICE AND BEAD APPEARANCE INSPECTION SYSTEM

    公开(公告)号:US20220410322A1

    公开(公告)日:2022-12-29

    申请号:US17901482

    申请日:2022-09-01

    IPC分类号: B23K31/02 B23K9/095

    摘要: A bead appearance inspection device includes an acquisition unit that acquires input data related to a welding bead, a storage unit that stores a first determination standard and a second determination standard used for an inspection of a defect of the welding bead, a first determination unit that executes a first inspection determination on the welding bead, and k second determination units, where k is an integer of 1 or more, that execute a second inspection determination on the welding bead. An appearance inspection result of the welding bead is created and output by using a determination result indicating whether a first inspection result acquired by the first inspection determination satisfies the first determination standard and a determination result indicating whether a second inspection result satisfies the second determination standard.

    BEAM ROTATION DEVICE AND SYSTEM
    29.
    发明申请

    公开(公告)号:US20220395932A1

    公开(公告)日:2022-12-15

    申请号:US17526860

    申请日:2021-11-15

    IPC分类号: B23K31/02 B23K37/04

    摘要: The beam rotation device described herein has a base support with a first vertical jaw arm, a second vertical jaw arm, and a support arm. The second vertical jaw arm may be pivotally coupled to the device so as to go from a first, closed position to a second, opened position to receive a steel beam (e.g., I-beam). Once the steel beam is placed within the device, the support arm may hold the beam stationary to allow a worker to weld or perform other tasks. It will be appreciated that multiple beam rotation devices may be coupled together and work in tandem to receive and rotate a beam. The beam rotation device creates a safer working environment than the rotators found in the art by having a pivotable second vertical jaw arm that may open to receive a beam and a support arm to hold the beam during fabrication.

    Method for orienting solder balls on a BGA device

    公开(公告)号:US11528809B2

    公开(公告)日:2022-12-13

    申请号:US17187262

    申请日:2021-02-26

    摘要: A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a circuit board and a package mounted thereon. The larger solder balls are accommodated by recessing each ball in the package substrate, the circuit board, or both the package substrate and the circuit board. Additionally, a ball attach method for mounting a plurality of solder balls having different average diameters is disclosed.