摘要:
Apparatus is described for controlling the crystallization of semi-conductor materials involving the use of a shape forming member or die having a passage within which the crystallization interface is located and kept during the growth process. Techniques are disclosed for reducing the angle of contact measured outside the liquid between the melt liquid within the passage and the material forming the wall of the passage. The basic technique involves the formation of a rough surface typically by machining ridges in the surface of the passage. Formulae are derived for determining the maximum elemental spacing between ridges and the minimum depth of the grooves therebetween so that a liquid melt surface is supported wholly by surface tension forces between the ridges.Examples of spacing and depth parameters for various melt/die material combinations are given.Differential elemental spacing from one region of a die surface to another is employed so as to reduce the surface working requirements to the minimum.Composite dies in which a fluid under pressure additionally supports the melt liquid surface are also described.
摘要:
Thin strip crystals are grown by pulling the growing crystal from the melt, through a thin slit, the walls of which are not wetted by the melt. The stability of growth at the edges of the strip is achieved by maintaining the pressure of the melt adjacent the interface between crystal and melt above a critical level which is such as to cause the meniscus of the melt to be convex on all sides of the growing crystal. The critical pressure is defined as2S/b+.sqroot.2SzgwhereS is the surface tension of the crystallizable materialb is the thickness of the slitz is the density of the meltg is the acceleration due to gravity;and the depth of the slit is at least (2S/zg).sup.1/2, preferably (32S/zg).sup.1/2 to ensure that a pressure exceeding the critical pressure can be developed and maintained without the liquid spilling out of the slit. The walls of the slit can be parallel or divergent in the direction in which the crystal is pulled, this divergence being necessary with certain materials. An arrangement is disclosed containing a head of the melt for creating the required pressure. An alternative arrangement is disclosed in which actuating devices, such as hydraulic piston and cylinder arrangements, create the pressure.
摘要:
Apparatus for pulling a ribbon shaped crystal from a melt of the same downwardly through a shaping guide having a "V" shaped longitudinal trough for containing the melt. The inner wall of the trough is a die set having a longitudinal slit at the apex of the "V".
摘要:
Mechanical components, e.g. die and/or crucible or the like structures with which single silicon crystals are grown from the melt as shaped articles in thin sheet or ribbon geometry, are advantageously comprised, for their material of construction, of a suitable thermally stable and inert foundation substrate coated or provided on at least the silicon-contacting surface(s) thereof with a thin, uniform, integral surface layer deposit of pyrolitic silicon nitride (Si.sub.3 N.sub.4) obtained by the chemical vapor deposition (i.e., "CVD") technique.
摘要翻译:机械部件,例如 将具有单晶硅晶体的模具和/或坩埚或类似结构从具有薄片或带状几何形状的成形制品的熔体生长出来,有利地包括用于其结构材料的合适的热稳定和惰性基底基底的涂层或 在其至少一个或多个硅接触表面上提供通过化学气相沉积(即“CVD”)技术获得的薄层均匀的整体表面沉积的热解硅氮化物(Si 3 N 4)。
摘要:
Method and apparatus for forming an elongated silicon crystalline body using a capillary action shaping technique. The means for growing and pulling the body from the capillary of the die includes a {211}oriented seed crystal.
摘要:
A method of producing monocrystalline semiconductor material in web form which provides the steps of providing a web of polycrystalline semiconductor material having a width which is much greater than its thickness, providing a monocrystalline semiconductor material seed having the same relative dimensions as the polycrystalline material source, providing one or more semiconductor material shaping members, contacting the source, the seed and the shaping member and heating the interface therebetween preferentially to produce a molten zone, moving said monocrystalline semiconductor material seed away from said molten zone as monocrystalline semiconductor material is formed thereon.