公开(公告)号：US20240387218A1

公开(公告)日：2024-11-21

申请号：US18788701

申请日：2024-07-30

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Ren-Hau Wu ,  Cheng-Kang Hu ,  Chieh-Chun Lin ,  Jia-Hong Liao ,  Cheng-Yi Liu

IPC: H01L21/677 ,  H01L21/673

Abstract: A cart for wafer transportation includes a cart body, a separator disposed between first and second wafer holders, an airtight lock configured to seal the cart body. A wafer transfer system includes a cart including a space for holding a wafer holder, a first workstation configured to load the wafer holder into the space and pressurize the space, and a second workstation configured to depressurize the space and unload the wafer holder from the space, wherein the cart is transportable between the first workstation and the second workstation. A method for transporting wafers includes docking a cart in a workstation; loading a wafer holder into a space of the cart; pressurizing the space to cause a pressure of the space to be greater than an atmospheric pressure; maintaining the pressure of the space at the pressure; and moving the cart carrying the wafer holder away from the workstation.

公开(公告)号：US20240387216A1

公开(公告)日：2024-11-21

申请号：US18319735

申请日：2023-05-18

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： HSU TUNG YEN ,  BO HSIANG HUANG ,  CHEN-CHIEH CHIANG ,  LING-SUNG WANG

IPC: H01L21/673 ,  B65D25/02 ,  B65D25/14 ,  B65D25/20 ,  G01N21/25

Abstract: A container for receiving a semiconductor device is provided. In one embodiment, the container includes an interior space, a first light reflecting coating in the interior space, a light emitter configured to emit a light from an outside of the interior space into the interior space and toward the first light reflecting coating, and a detector configured to detect the light emitted from the light emitter and reflected by the first light reflecting coating.

公开(公告)号：US20240387215A1

公开(公告)日：2024-11-21

申请号：US18784956

申请日：2024-07-26

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Ping-Cheng Lin ,  Pin-Yi Hsin ,  Ching Shun Lee ,  Bo-Han Huang ,  cheng-tsung Tu

IPC: H01L21/673 ,  H01L21/67 ,  H01L21/677

Abstract: A method for collecting residues of curable material includes: performing a curing process on a semiconductor wafer in a chamber, where the semiconductor wafer is held by a wafer cassette, and residues of curable material is formed in the chamber; and collecting the residues of curable material. A first portion of the residues dripping from a ceiling of the chamber is directed toward a tray using a flow-directing structure, where the flow-directing structure is below the ceiling of the chamber, the flow-directing structure includes a central opening and a slanted surface sloped to direct the first portion of the residues toward the central opening. The first portion of the residues is collected on a collecting surface of the tray which covers the central opening of the flow-directing structure.

公开(公告)号：US20240383082A1

公开(公告)日：2024-11-21

申请号：US18787220

申请日：2024-07-29

Applicant: Taiwan Semiconductor Manufacturing Company, LTD.

Inventor： Yu-Chen Chen ,  Chih-Hung Huang ,  Cheng-Lung Wu ,  Yang-Ann Chu ,  Jiun-Rong Pai

IPC: B23P19/06 ,  B23P11/00 ,  B25B23/10 ,  B25J15/00 ,  H01L21/673

Abstract: The present disclosure relates to systems and methods for affixing and/or removing a fastener from a wafer-carrying pod. The system includes a robotic arm with a screw tool assembly disposed at the far end of the robotic arm. The screw tool assembly includes a lower sleeve configured to receive a fastener. A screwdriver is disposed within an upper sleeve of the screw tool assembly, and a motor is provided to rotate the screwdriver. In use, the screw tool assembly is positioned over the fastener so the lower sleeve surrounds the fastener and the screwdriver engages the fastener. The screwdriver unscrews the fastener from the pod, and the fastener head is received within the lower sleeve.

公开(公告)号：US12142500B2

公开(公告)日：2024-11-12

申请号：US18116759

申请日：2023-03-02

Applicant: Applied Materials, Inc.

Inventor： Devendra Channappa Holeyannavar ,  Sandesh Doddamane Ramappa ,  Dean C. Hruzek ,  Michael R. Rice ,  Jeffrey A. Brodine

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/677

Abstract: A platform is of a side storage pod. The platform includes an upper surface and kinematic pins extending from the upper surface within a chamber of the side storage pod to engage a lower surface of a side storage container in the chamber to level the side storage container in the chamber.

公开(公告)号：US12142482B2

公开(公告)日：2024-11-12

申请号：US17603056

申请日：2020-02-07

Applicant: SUMCO CORPORATION

Inventor： Naoyuki Wada ,  Yu Minamide

IPC: H01L21/02 ,  C23C16/44 ,  C23C16/54 ,  H01L21/67 ,  H01L21/673

Abstract: Using the first robot, the carrier standing by in the load lock chamber is deposited into the reaction chamber without mounting the wafer before processing, and cleaning gas is supplied while the reaction chamber is maintained at a predetermined cleaning temperature, and the carrier that has been cleaned in the reaction chamber is transferred to the load lock chamber using the first robot. The carrier and susceptor are cleaned at a predetermined frequency. After that, the carrier is carried out from the reaction chamber, and the reaction gas is supplied to the reaction chamber to form a polysilicon film on the surface of the susceptor.

公开(公告)号：US12125726B2

公开(公告)日：2024-10-22

申请号：US17657799

申请日：2022-04-04

Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.

Inventor： Chuang Shan ,  Xiaoling Wang

IPC: H01L21/673

CPC classification number: H01L21/67359 ,  H01L21/67376 ,  H01L21/67386 ,  H01L21/67393

Abstract: The present disclosure relates to the technical field of semiconductors, and provides a mask pod and a semiconductor device. The mask pod includes: a body, wherein the body has an accommodation space configured to accommodate a mask, the accommodation space has a first opening, and the first opening is located on a circumferential side of the body; and a shielding member, wherein the shielding member is provided on the body and is movably provided relative to the body, to shield or release the first opening.

公开(公告)号：US20240347359A1

公开(公告)日：2024-10-17

申请号：US18298503

申请日：2023-04-11

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： CHI JIA WANG ,  CHI-CHUNG JEN ,  KAI-HUNG HSIAO ,  HUI AN LI ,  WEN-CHIH CHIANG

IPC: H01L21/673 ,  G02F1/1334 ,  G06T7/00 ,  H01L21/67

CPC classification number: H01L21/67386 ,  G02F1/1334 ,  G06T7/001 ,  H01L21/67288 ,  G06T2207/30148 ,  H01L21/67733

Abstract: A method includes: receiving at least one semiconductor wafer to a wafer carrier, wherein the wafer carrier has an inspection window arranged on a side of the wafer carrier; transporting the wafer carrier between a plurality of semiconductor tools; and in response to an emergent event, switching the inspection window to a transparent mode for a predetermined period.

公开(公告)号：US20240347358A1

公开(公告)日：2024-10-17

申请号：US18608524

申请日：2024-03-18

Applicant: Viavi Solutions Suzhou Co., Ltd.

Inventor： Liang ZHOU ,  Ling LIU

IPC: H01L21/673

CPC classification number: H01L21/67353

Abstract: In some implementations, a cover for a wafer that is on a wafer frame includes a top portion configured to span an entirety of a top surface of the wafer; and a side portion configured to span an entirety of a side surface of the wafer, wherein the side portion extends at a non-zero angle from the top portion to allow the cover to enclose the wafer on the wafer frame. In some implementations, a carrier for a wafer includes the wafer, the wafer frame, and the cover.

公开(公告)号：US20240339553A1

公开(公告)日：2024-10-10

申请号：US18297352

申请日：2023-04-07

Applicant: Solaires Entreprises Inc.

Inventor： Alfonso Fabian de la Fuente Sanchez ,  Mahsid SAM ,  Furui TAN ,  Chen DONG ,  Wanlong WANG ,  Yuhao SONG

IPC: H01L31/18 ,  H01L21/67 ,  H01L21/673 ,  H01L21/677

CPC classification number: H01L31/18 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67326 ,  H01L21/67766

Abstract: A system for manufacturing thin-film devices is provided, the system comprising: a computing device; robotic arm or conveyor system; holder which is configured to retain a first substrate; dispenser which configured to dispense a solution onto an upper surface of the first substrate; an X-Y press, which includes a base, a vertically disposed member which is attached to the base, a horizontal arm which is moveably attached to the vertically disposed member, a vertical actuator which is configured to urge the horizontal arm up and down and is attached to the vertically disposed member, a horizontal actuator which is attached to the horizontal arm, a block which is attached to the horizontal actuator, wherein the horizontal actuator is configured to urge the block horizontally; and a dryer, wherein the robotic arm or the conveyor system, the dispenser, the X-Y press and the dryer are under control of the computing device.