Drive method for MEMS devices
    292.
    发明申请
    Drive method for MEMS devices 有权
    MEMS器件的驱动方法

    公开(公告)号:US20060044928A1

    公开(公告)日:2006-03-02

    申请号:US11118612

    申请日:2005-04-29

    Abstract: Embodiments of exemplary MEMS interferometric modulators are arranged at intersections of rows and columns of electrodes. In certain embodiments, the column electrode has a lower electrical resistance than the row electrode. A driving circuit applies a potential difference of a first polarity across electrodes during a first phase and then quickly transition to applying a bias voltage having a polarity opposite to the first polarity during a second phase. In certain embodiments, an absolute value of the difference between the voltages applied to the row electrode is less than an absolute value of the difference between the voltages applied to the column electrode during the first and second phases.

    Abstract translation: 示例性MEMS干涉式调制器的实施例布置在电极的行和列的交叉处。 在某些实施例中,列电极具有比行电极更低的电阻。 驱动电路在第一阶段期间在电极之间施加第一极性的电位差,然后在第二阶段期间快速转换到施加极性与第一极性相反的偏置电压。 在某些实施例中,施加到行电极的电压之差的绝对值小于在第一和第二相期间施加到列电极的​​电压之差的绝对值。

    Packaging for an interferometric modulator
    293.
    发明申请
    Packaging for an interferometric modulator 有权
    用于干涉式调制器的包装

    公开(公告)号:US20050254115A1

    公开(公告)日:2005-11-17

    申请号:US10844819

    申请日:2004-05-12

    CPC classification number: G02B26/001

    Abstract: A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package

    Abstract translation: 封装由具有干涉式调制器和背板的透明基板制成。 非气密密封件将背板连接到基板以形成包装,并且干燥剂驻留在包装内。 封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。 设置背板,并将干燥剂施加到背板上。 背板在环境条件下用背密封件密封到基板的背面,由此形成封装

    Modifying the electro-mechanical behavior of devices
    294.
    发明申请
    Modifying the electro-mechanical behavior of devices 有权
    修改设备的机电性能

    公开(公告)号:US20050247477A1

    公开(公告)日:2005-11-10

    申请号:US10839307

    申请日:2004-05-04

    CPC classification number: G02B26/001 B81B7/0038

    Abstract: A device has a first surface. A second surface is offset from a first surface to form a package. At least one movable element is within the package having a movable surface to contact another surface. An environmental control material is included inside the package to affect an operation of the movable element.

    Abstract translation: 设备具有第一表面。 第二表面偏离第一表面以形成包装。 至少一个可移动元件在封装内具有可移动的表面以接触另一表面。 包装内包含环境控制材料以影响可移动元件的操作。

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