公开(公告)号：US20250123032A1

公开(公告)日：2025-04-17

申请号：US18923068

申请日：2024-10-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jimin HONG ,  Jungwoo YOO ,  Insub LEE

IPC: F25B21/02

Abstract: Disclosed is a thermoelectric element cooling device including: a thermoelectric element having an endothermic surface and an exothermic surface; a first heat dissipation plate connected to the endothermic surface and configured to dissipate heat to the endothermic surface; a first heat exchanger configured to transfer heat to the first heat dissipation plate; a second heat dissipation plate configured to dissipate heat received from the exothermic surface to a second heat exchanger; the second heat exchanger configured to release heat received from the second heat dissipation plate to the outside; and a thermoconductive member disposed at at least one position between the endothermic surface of the thermoelectric element and the first heat dissipation plate or between the exothermic surface and the second heat dissipation plate, wherein the thermoconductive member has: one side in contact with one of the surfaces of the thermoelectric element; and the other side in contact with the first heat dissipation plate or the second heat dissipation plate, the thermoconductive member includes a plurality of anisotropic, thermoconductive fillers, and at least one of the plurality of anisotropic, thermoconductive fillers is located adjacent to the one side and the other side.

公开(公告)号：US20250123004A1

公开(公告)日：2025-04-17

申请号：US18999481

申请日：2024-12-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeong Jin JANG ,  Sang-Jin LEE ,  Jung Hak LEE ,  Myoung Keun KWON ,  Sang Jun PARK ,  Eung Ryeol SEO ,  Han Jun SUNG

IPC: F24C15/00 ,  F24C7/04 ,  F24C7/08 ,  F24C15/32 ,  F27D21/02

Abstract: An oven includes a main body, a cooking compartment provided in the main body and having a front surface thereof is opened, the cooking compartment having an opening, a camera provided above the cooking compartment and configured to capture an inside of the cooking compartment through the opening, a camera cooling fan disposed above the camera and configured to cool the camera by suctioning external air, a first glass provided at the opening of the cooking compartment so that the camera captures the inside of the cooking compartment and configured to block transmission of heat in the cooking compartment to the camera, and a second glass provided between the camera and the first glass and configured to additionally block the transmission of heat to the camera.

公开(公告)号：US20250122662A1

公开(公告)日：2025-04-17

申请号：US18934852

申请日：2024-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hidekazu FUNAKOSHI ,  Hiroshi KATSUMOTO ,  Osamu KAZAMA ,  Yasuo IKEDA ,  Koichi HOSOMI

IPC: D06F37/30 ,  D06F23/06 ,  D06F33/36 ,  D06F33/40 ,  D06F33/48 ,  D06F34/16 ,  D06F37/04 ,  D06F37/20 ,  D06F39/08 ,  D06F103/24 ,  D06F103/26 ,  D06F105/08 ,  D06F105/48 ,  D06F105/52

Abstract: A washing machine including a fixed tank; a rotary drum accommodated in the fixed tank and into which laundry is loadable; a drain configured to discharge water collected in the fixed tank; a ball balancer installed in the rotary drum; a controller; and a driver configured to rotate the rotary drum, the driver including a shaft fixed to the rotary drum, and configured to be rotatable to rotate the rotary drum, a motor including a stator and a rotor, a reducer, and a clutch configured to be switched between a first mode in which rotation of the rotor is transmitted to the shaft through the reducer, and a second mode in which the rotation of the rotor is transmitted to the shaft without passing through the reducer.

公开(公告)号：USD1070900S1

公开(公告)日：2025-04-15

申请号：US29883970

申请日：2023-02-06

Applicant: Samsung Electronics Co., Ltd.

Designer： Soryang Ban ,  Taehyun Kang ,  Chanpyo Park

公开(公告)号：USD1070896S1

公开(公告)日：2025-04-15

申请号：US29776397

申请日：2021-03-30

Applicant: Samsung Electronics Co., Ltd.

Designer： Younjung Kim ,  Hayoung Kim

公开(公告)号：USD1070372S1

公开(公告)日：2025-04-15

申请号：US29891939

申请日：2023-05-11

Applicant: Samsung Electronics Co., Ltd.

Designer： Dahwe Park ,  Jinsun Park ,  Sung-Kyung Lee ,  Gerhardt Georg Kellermann ,  Ana Cristina Ferreira Relvao

公开(公告)号：US12279462B2

公开(公告)日：2025-04-15

申请号：US18312851

申请日：2023-05-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sookyoung Roh ,  Seokho Yun

IPC: H01L27/146 ,  H01L27/148 ,  H04N25/13 ,  H10F39/00 ,  H10F39/15 ,  H10F39/18

Abstract: Provided are a color separation element and an image sensor including the same. The color separation element includes a spacer layer; and a color separation lens array, which includes at least one nano-post arranged in the spacer layer and is configured to form a phase distribution for splitting and focusing incident light according to wavelengths, wherein periodic regions in which color separation lens arrays are repeatedly arranged are provided, and the color separation lens array is configured to interrupt phase distribution at the boundary of the periodic regions.

公开(公告)号：US12279433B2

公开(公告)日：2025-04-15

申请号：US17721574

申请日：2022-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changbum Kim ,  Sunghoon Kim

IPC: H10B43/40 ,  G11C16/24 ,  H10B41/27 ,  H10B41/41 ,  H10B43/27

Abstract: A semiconductor device includes a cell region and a peripheral circuit region. The cell region includes gate electrode layers stacked on a substrate, channel structures extending in a first direction, extending through the gate electrode layers, and connected to the substrate, and bit lines extending in a second direction and connected to the channel structures above the gate electrode layers. The peripheral circuit region includes page buffers connected to the bit lines. Each page buffer includes a first and second elements adjacent to each other in the second direction and sharing a common active region between a first gate structure of the first element and a second gate structure of the second element in the second direction. Boundaries of the common active region include an oblique boundary extending in an oblique direction forming an angle between 0 and 90 degrees with the second direction.

公开(公告)号：US12279415B2

公开(公告)日：2025-04-15

申请号：US18337134

申请日：2023-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minsu Choi ,  Myeong-Dong Lee ,  Hyeon-Woo Jang ,  Keunnam Kim ,  Sooho Shin ,  Yoosang Hwang

IPC: H10B12/00 ,  G11C5/12

Abstract: Disclosed are a semiconductor memory device and a method of fabricating the same. The device includes a substrate including an active pattern with doped regions, a gate electrode crossing the active pattern between the doped regions, a bit line crossing the active pattern and being electrically connected to one of the doped regions, a spacer on a side surface of the bit line, a first contact coupled to another of the doped regions and spaced apart from the bit line with the spacer interposed therebetween, a landing pad on the first contact, and a data storing element on the landing pad. The another of the doped regions has a top surface, an upper side surface, and a curved top surface that extends from the top surface to the upper side surface. The first contact is in contact with the curved top surface and the upper side surface.

公开(公告)号：US12279408B2

公开(公告)日：2025-04-15

申请号：US18405736

申请日：2024-01-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Shaofeng Ding ,  Jeong Hoon Ahn ,  Yun Ki Choi

IPC: H10B10/00 ,  H01L21/02 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/06 ,  H01L29/08 ,  H01L29/417 ,  H01L29/423 ,  H01L29/66 ,  H01L29/78 ,  H01L29/786 ,  H10B12/00

Abstract: A semiconductor device includes a substrate including a logic cell region and a connection region, a dummy transistor on the connection region, an intermediate connection layer on the dummy transistor, the intermediate connection layer including a connection pattern electrically connected to the dummy transistor, a first metal layer on the intermediate connection layer, an etch stop layer between the intermediate connection layer and the first metal layer, the etch stop layer covering a top surface of the connection pattern, and a penetration contact extended from the first metal layer toward a bottom surface of the substrate penetrating the connection region.