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    Methods and apparatus for media communication services using network slicing
    311.
    发明授权
    Methods and apparatus for media communication services using network slicing 有权

    公开(公告)号：US12284601B2

    公开(公告)日：2025-04-22

    申请号：US17845877

    申请日：2022-06-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Prakash Kolan

    IPC: H04W48/08 ,  H04W24/02 ,  H04W28/02 ,  H04W48/16 ,  H04W72/54

    Abstract: An apparatus for an application function (AF) includes a communication interface and a processor operably coupled to the communication interface. The processor is configured to receive, via the communication interface, network slice identification and media service identification across slices for a media service. The processor is also configured to manage a service corresponding to the network slice identification to a user equipment (UE). The processor is further configured to receive, via the communication interface, expected media service policy information from the UE. In addition, the processor is configured to identify policy information corresponding to each of the slices, respectively. The processor is also configured to transmit, via the communication interface, the policy information corresponding to each of the slices, respectively.

    Method and UE for handling handover in wireless communication system
    313.
    发明授权
    Method and UE for handling handover in wireless communication system 有权

    公开(公告)号：US12284557B2

    公开(公告)日：2025-04-22

    申请号：US17552934

    申请日：2021-12-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jajohn Mathew Mattam ,  Shreyas Sreenivasa ,  Shanthossh Nagarajan ,  Fasil Abdul Latheef ,  Manasi Ekkundi ,  Kailash Kumar Jha ,  Nishant Sinha

    IPC: H04W36/00 ,  H04W36/08 ,  H04W36/14 ,  H04W36/30

    Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). A method for handling handover by a UE (400) is provided. The method includes determining, by User Equipment (UE), whether a measurement identity (ID) of a first neighboring cell and a measurement ID of a second neighboring cell are same. If the measurement ID of the first neighboring cell and the measurement ID of the second neighboring cell are different, the method includes prioritizing sending of a measurement report of the first neighboring cell over a measurement report of the second neighboring cell to a serving cell. If the measurement ID of the first neighboring cell and the measurement ID of the second neighboring cell are same, the method includes splitting a measurement report for the first neighboring cell and a measurement report of the second neighboring cell and sending the measurement report of the first neighboring cell before the measurement report of the second neighboring cell.

    Fan-out semiconductor package
    318.
    发明授权
    Fan-out semiconductor package 有权

    公开(公告)号：US12283577B2

    公开(公告)日：2025-04-22

    申请号：US17862482

    申请日：2022-07-12

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Joonsung Kim ,  Seokwon Lee

    IPC: H01L25/18 ,  H01L23/00 ,  H01L23/13 ,  H01L23/48 ,  H01L23/498 ,  H01L23/538 ,  H01L25/16 ,  H01L49/02

    Abstract: A fan-out semiconductor package includes: a package body including a fan-in area corresponding to a through-hole located therein, a fan-out area surrounding the fan-in area, and a body interconnect structure arranged in the package body corresponding to the fan-out area; a fan-in chip structure located in the through-hole, the fan-in chip structure comprising a first chip, a capacitor chip arranged to be apart from the first chip, and a second chip disposed on both the first chip and the capacitor chip; a redistribution structure arranged on a bottom surface of the package body and a bottom surface of the fan-in chip structure and including a redistribution element extending to the fan-out area; and an interconnect via arranged on a top surface of the package body and electrically connected to the redistribution element in the fan-out area.

    Method of repairing through-electrodes, repair device performing the same and semiconductor device including the same
    319.
    发明授权
    Method of repairing through-electrodes, repair device performing the same and semiconductor device including the same 有权

    公开(公告)号：US12283529B2

    公开(公告)日：2025-04-22

    申请号：US17660920

    申请日：2022-04-27

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sungho Kang ,  Youngkwang Lee

    IPC: H01L21/66 ,  H01L23/48 ,  H03K17/00

    Abstract: In a method of repairing through-electrodes, a plurality of through-electrodes are grouped into a plurality of through-electrode groups. A plurality of redundant through-electrodes are grouped into a plurality of redundant through-electrode groups. Repair paths for the plurality of through-electrodes are searched. When searching the repair paths, in response to a Y-th through-electrode included in an X-th through-electrode group being a defective through-electrode or in response to receiving a first signal from an (X−1)-th through-electrode group, it is determined whether a y-th redundant through-electrode included in an x-th redundant through-electrode group is available for performing signal transmission thereto. In response to the y-th redundant through-electrode being available for performing signal transmission thereto, a second signal input to the Y-th through-electrode is transmitted to the y-th redundant through-electrode. In response to the y-th redundant through-electrode being unavailable for performing signal transmission thereto, the second signal input to the Y-th through-electrode is transmitted to an (X+1)-th through-electrode group.

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