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公开(公告)号：US12283577B2
公开(公告)日：2025-04-22
申请号：US17862482
申请日：2022-07-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Joonsung Kim , Seokwon Lee
IPC: H01L25/18 , H01L23/00 , H01L23/13 , H01L23/48 , H01L23/498 , H01L23/538 , H01L25/16 , H01L49/02
Abstract: A fan-out semiconductor package includes: a package body including a fan-in area corresponding to a through-hole located therein, a fan-out area surrounding the fan-in area, and a body interconnect structure arranged in the package body corresponding to the fan-out area; a fan-in chip structure located in the through-hole, the fan-in chip structure comprising a first chip, a capacitor chip arranged to be apart from the first chip, and a second chip disposed on both the first chip and the capacitor chip; a redistribution structure arranged on a bottom surface of the package body and a bottom surface of the fan-in chip structure and including a redistribution element extending to the fan-out area; and an interconnect via arranged on a top surface of the package body and electrically connected to the redistribution element in the fan-out area.
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公开(公告)号：US10511271B2
公开(公告)日：2019-12-17
申请号：US15862213
申请日：2018-01-04
Inventor： Jihoon Kim , Bumman Kim , Kyunghoon Moon , Seokwon Lee , Daechul Jeong , Byungjoon Park , Juho Son
Abstract: The method and system for converging a 5th-generation (5G) communication system for supporting higher data rates beyond a 4th-generation (4G) system with a technology for internet of things (IoT) are provided. The method includes intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. The system includes a power amplification device capable of minimizing the effect of envelope impedance. The power amplification device may be incorporated in a terminal and a base station.
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公开(公告)号：US11038476B2
公开(公告)日：2021-06-15
申请号：US16715502
申请日：2019-12-16
Inventor： Jihoon Kim , Bumman Kim , Kyunghoon Moon , Seokwon Lee , Daechul Jeong , Byungjoon Park , Juho Son
Abstract: The method and system for converging a 5th-generation (5G) communication system for supporting higher data rates beyond a 4th-generation (4G) system with a technology for internet of things (IoT) are provided. The method includes intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. The system includes a power amplification device capable of minimizing the effect of envelope impedance. The power amplification device may be incorporated in a terminal and a base station.
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公开(公告)号：US20230187424A1
公开(公告)日：2023-06-15
申请号：US17862482
申请日：2022-07-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Joonsung Kim , Seokwon Lee
IPC: H01L25/16 , H01L23/00 , H01L23/498 , H01L23/538 , H01L23/13 , H01L49/02
CPC classification number: H01L25/16 , H01L24/08 , H01L24/16 , H01L23/49838 , H01L23/5386 , H01L23/13 , H01L28/90 , H01L25/162 , H01L2924/3511 , H01L2924/1438 , H01L2924/1436 , H01L2924/1437 , H01L2924/1431 , H01L24/48 , H01L2224/48225 , H01L2224/16227 , H01L2224/16238 , H01L2924/19041 , H01L2224/08146 , H01L2224/08225 , H01L2224/08265 , H01L2924/3011 , H01L23/49816 , H01L23/49833 , H01L2924/182
Abstract: A fan-out semiconductor package includes: a package body including a fan-in area corresponding to a through-hole located therein, a fan-out area surrounding the fan-in area, and a body interconnect structure arranged in the package body corresponding to the fan-out area; a fan-in chip structure located in the through-hole, the fan-in chip structure comprising a first chip, a capacitor chip arranged to be apart from the first chip, and a second chip disposed on both the first chip and the capacitor chip; a redistribution structure arranged on a bottom surface of the package body and a bottom surface of the fan-in chip structure and including a redistribution element extending to the fan-out area; and an interconnect via arranged on a top surface of the package body and electrically connected to the redistribution element in the fan-out area.
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