公开(公告)号：US12072397B2

公开(公告)日：2024-08-27

申请号：US17946838

申请日：2022-09-16

申请人： TDK CORPORATION

发明人： Keisuke Takasugi ,  Kenzo Makino

IPC分类号： G01R33/09

CPC分类号： G01R33/093

摘要： A magnetic field detection apparatus includes first and second projections that are provided on a flat surface of a substrate and that each include first and second inclined surfaces. First and second MR films are provided on the first and second inclined surfaces, respectively. A first wiring line couples the first MR films provided on the respective first inclined surfaces of the first and second projections. A second wiring line couples the second MR films provided on the respective second inclined surfaces of the first and second projections. The first and second projections are adjacent in a first direction, with the first inclined surface of the first projection and the second inclined surface of the second projection opposed to each other in the first direction. One or more patterns are provided on the first inclined surface of the first projection, the second inclined surface of the second projection, or both.

公开(公告)号：US20240282510A1

公开(公告)日：2024-08-22

申请号：US18583170

申请日：2024-02-21

申请人： TDK CORPORATION

发明人： Kazunori ARIMITSU ,  Kiichi FUJISAWA ,  Masashi HAMA ,  Nobuo KITAJIMA ,  Fuyuki MIURA ,  Takehiko NARISAWA ,  Masanori SATO

IPC分类号： H01F27/29 ,  H01F27/28

CPC分类号： H01F27/292 ,  H01F27/2828

摘要： A coil device has a wound portion, a leadout portion led out from the wound portion, a terminal including a wire connecting portion connected to the leadout portion, and an element body covering the wound portion, the leadout portion and the wire connecting portion. A winding axis of the wound portion is perpendicular to a mounting facing surface of the element body. The leadout portion has a bent portion bent so as to protrude inward when viewed along the winding axis, and an inner angle of the bent portion is an obtuse angle.

公开(公告)号：US12068099B2

公开(公告)日：2024-08-20

申请号：US17109426

申请日：2020-12-02

申请人： TDK CORPORATION

发明人： Masataro Saito ,  Masazumi Arata ,  Hokuto Eda ,  Kohei Takahashi ,  Takamasa Iwasaki

IPC分类号： H01F27/28 ,  H01F27/24 ,  H01F27/29

CPC分类号： H01F27/2804 ,  H01F27/24 ,  H01F27/29 ,  H01F2027/2809

摘要： In a coil component, a first planar coil and a second planar coil are wound around a common magnetic core and are magnetically coupled to each other. However, the first planar coil and the second planar coil are not electrically connected to each other and form coil structures which are separate from each other. Thus, as compared with a case in which the first planar coil and the second planar coil form one coil structure, the first planar coil and the second planar coil are less likely to affect each other's characteristics.

公开(公告)号：US12057791B2

公开(公告)日：2024-08-06

申请号：US17959120

申请日：2022-10-03

申请人： TDK CORPORATION

发明人： Ryan Griswold ,  John Sze ,  Vibhu Vivek

IPC分类号： H02N2/18 ,  B60B27/00 ,  B60C7/00 ,  B60C23/04 ,  B60R16/03

CPC分类号： H02N2/18 ,  B60B27/0015 ,  B60C23/0411 ,  B60C23/0486 ,  B60C7/00 ,  B60R16/0307

摘要： Systems and methods for an energy harvester proximate to a rotatable component of a vehicle's wheel are disclosed. In some embodiments, an energy harvester system includes: a plurality of energy harvesting components configured to be coupled to a rotatable component in a ring formation along a circumference of the rotatable component, wherein each of the plurality of energy harvesting components includes: a substrate configured to be attached to a surface of the rotatable component; a piezoelectric component coupled to a surface of the substrate, wherein the piezoelectric component is configured to deform in response to a mechanical strain imparted on the piezoelectric component as the rotatable component rotates and generate an electric signal; and an interconnect coupled to the piezoelectric components and configured to conduct the electric signal from the piezoelectric components to a device coupled to the rotatable component.

公开(公告)号：USD1037158S1

公开(公告)日：2024-07-30

申请号：US29809239

申请日：2021-09-27

申请人： TDK CORPORATION

设计人： Kyosuke Inui ,  Terumasa Toyoda ,  Toru Tonogai ,  Yuichi Oyanagi

摘要： FIG. 1 is a front view of the coil component showing our new design.
FIG. 2 is a back view of the design.
FIG. 3 is a left-side view of the design.
FIG. 4 is a right-side view of the design.
FIG. 5 is a plan view of the design.
FIG. 6 is a bottom view of the design.
FIG. 7 is a perspective view of the design.
FIG. 8 is a cross section view of the design taken along line 8-8 shown in FIG. 5; and,
FIG. 9 is a cross section view of the design taken along line 9-9 shown in FIG. 8.
The evenly spaced broken lines depict portions of the coil component that form no part of the claimed design. The dot-dash chain lines depict a boundary of the claimed subject matter and form no part of the claimed design.

公开(公告)号：US12046524B2

公开(公告)日：2024-07-23

申请号：US17696253

申请日：2022-03-16

申请人： TDK Corporation

发明人： Yongfu Cai ,  Shuhei Miyazaki

IPC分类号： H01L23/29 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L23/295 ,  H01L21/56 ,  H01L24/19 ,  H01L24/20

摘要： In an assembly in which a space between two elements is filled with a filler containing resin, a configuration that can limit both the size of the assembly and the cost of the fillers is provided. An assembly of stacked elements has: first element having first surface; resin layer that is arranged on first surface and that contains a plurality of fillers; and second element that is arranged on resin layer and that has second surface that is in contact with resin layer. In a section that is perpendicular to second surface, the average flattening ratio of fillers that are in contact with second surface is larger than the average flattening ratio of fillers that are not in contact with second surface. Here, the flattening ratio is a ratio of the maximum length of the filler in a direction parallel to second surface to the maximum thickness of the filler in a direction perpendicular to second surface.

公开(公告)号：US12044754B2

公开(公告)日：2024-07-23

申请号：US17947770

申请日：2022-09-19

申请人： TDK CORPORATION

发明人： Hidekazu Kojima ,  Hiromichi Umehara

IPC分类号： G01R33/09

CPC分类号： G01R33/093

摘要： A magnetic sensor includes a substrate including a top surface, an insulating layer including an inclined surface, an MR element disposed on the inclined surface, a first insulating portion of an insulating material disposed on a part of the MR element, and a second insulating portion of an insulating material disposed on another part of the MR element at a position forward of the first insulating portion in a direction along the inclined surface, the direction being a direction away from the top surface of the substrate.

公开(公告)号：US12044753B2

公开(公告)日：2024-07-23

申请号：US17945485

申请日：2022-09-15

申请人： TDK CORPORATION

发明人： Hiromichi Umehara ,  Keisuke Takasugi ,  Takehiro Isoda ,  Kenji Inage

IPC分类号： G01R33/09 ,  G01R33/00 ,  G01R33/02

CPC分类号： G01R33/093 ,  G01R33/0005 ,  G01R33/0206

摘要： A magnetic sensor includes an insulating layer including a flat portion and a protruding portion, a first MR element, and a second MR element. The protruding portion includes a first inclined surface and a second inclined surface. The first MR element is disposed on the first inclined surface. The second MR element is disposed on the second inclined surface. The protruding portion extends in a first direction parallel to a top surface of a substrate, and includes a plurality of recess portions each recessed in a direction parallel to the top surface of the substrate at an end of the protruding portion in the first direction.

公开(公告)号：US20240242883A1

公开(公告)日：2024-07-18

申请号：US18410188

申请日：2024-01-11

申请人： TDK Corporation

发明人： Yuya ISHIMA ,  Kenji KOMORITA ,  Shingo HATTORI ,  Yoji TOZAWA ,  Masaki TAKAHASHI ,  Hidenobu UMEDA ,  Yusuke NAGAI ,  Akihiko OIDE

IPC分类号： H01F41/076 ,  H01F41/12

CPC分类号： H01F41/076 ,  H01F41/122

摘要： A method for manufacturing a coil component including an element body, and a coil disposed inside the element body and including a first coil conductor and a second coil conductor having different shapes, the method comprises: applying a first photosensitive conductive paste on a substrate and exposing the first photosensitive conductive paste to light with a pattern corresponding to the first coil conductor to form a first curing pattern; after the forming of the first curing pattern, applying a second photosensitive conductive paste on the first photosensitive conductive paste and exposing the second photosensitive conductive paste to light with a pattern corresponding to the second coil conductor to form a second curing pattern; after the forming of the second curing pattern, developing portions of the first photosensitive conductive paste and the second photosensitive conductive paste that were not exposed; and after the developing, adding an insulating material on the substrate.

公开(公告)号：US12040116B2

公开(公告)日：2024-07-16

申请号：US17342051

申请日：2021-06-08

申请人： TDK Corporation

发明人： Kosuke Kunitsuka ,  Keigo Higashida ,  Emi Ito

IPC分类号： H01F17/04 ,  H01F17/00 ,  H01F27/28 ,  H01F27/29 ,  H01F27/30

CPC分类号： H01F17/045 ,  H01F27/2828 ,  H01F27/292 ,  H01F27/306 ,  H01F2017/0093

摘要： Disclosed herein is a common mode filter that includes a core having a winding core part and first and second wires wound in a same direction around the winding core part. The first and second wires have a first crossing portion at which first turns thereof counted from one ends thereof cross each other and a second crossing portion at which first turns thereof counted from the other ends thereof cross each other. The first and second wires are wound by layer winding in an aligned state with one of the first and second wires positioned in a lower layer and other one thereof positioned in an upper layer in at least parts of the first and second wires between second turns thereof counted from the one ends thereof and second turns thereof counted from the other ends thereof.