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公开(公告)号:US10977540B2
公开(公告)日:2021-04-13
申请号:US16427864
申请日:2019-05-31
Applicant: CompoSecure, LLC
Inventor: Adam Lowe
IPC: G06K19/077
Abstract: A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and disposing a non-conductive material about the electronic component. A transaction card includes a molded electronic component.
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公开(公告)号:US10748049B2
公开(公告)日:2020-08-18
申请号:US16739211
申请日:2020-01-10
Applicant: CompoSecure, LLC
Inventor: John Herslow , Adam Lowe , Luis Dasilva , Brian Nester
IPC: G06K19/077 , G06K19/07
Abstract: A smart card having a metal layer, an opening in the metal layer and a dual interface integrated circuit (IC) module and a plug non-RF-impeding material mounted in the opening, with at least one at least one additional layer stacked relative to the plug.
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公开(公告)号:USD864293S1
公开(公告)日:2019-10-22
申请号:US29648137
申请日:2018-05-18
Applicant: CompoSecure, LLC
Designer: Adam Lowe , Michele Logan , Dori Skelding , Syeda Hussain
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公开(公告)号:US20190286961A1
公开(公告)日:2019-09-19
申请号:US16427864
申请日:2019-05-31
Applicant: CompoSecure, LLC
Inventor: Adam Lowe
IPC: G06K19/077
Abstract: A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and disposing a non-conductive material about the electronic component. A transaction card includes a molded electronic component.
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公开(公告)号:US10406734B2
公开(公告)日:2019-09-10
申请号:US16164322
申请日:2018-10-18
Applicant: COMPOSECURE, LLC
Inventor: Adam Lowe
IPC: B29C45/14 , G06K19/077 , H01Q13/10 , H05K1/18 , H05K3/28 , H05K3/30 , B22D19/00 , B29C45/17 , B29L17/00
Abstract: A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and molding a molding material about the electronic component. A transaction card includes a molded electronic component.
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公开(公告)号:US10395153B2
公开(公告)日:2019-08-27
申请号:US15637092
申请日:2017-06-29
Applicant: COMPOSECURE, LLC
Inventor: John Herslow
IPC: G06K19/02 , G06K19/077 , B32B37/00 , B32B37/18
Abstract: Cards embodying the invention include a core subassembly whose elements define the functionality of the card and a hard coat subassembly attached to the top and/or bottom sides of the core subassembly to protect the core subassembly from wear and tear and being scratched. The core subassembly may be formed solely of plastic layers or of different combinations of plastic and metal layers and may include all the elements of a smart card enabling contactless RF communication and/or direct contact communication. The hard coat subassembly includes a hard coat layer, which typically includes nanoparticles, and a buffer or primer layer formed so as to be attached between the hard coat layer and the core subassembly for enabling the lasering of the core subassembly without negatively impacting the hard coat layer and/or for imparting color to the card.
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公开(公告)号:US10332846B2
公开(公告)日:2019-06-25
申请号:US15355018
申请日:2016-11-17
Applicant: COMPOSECURE, LLC
Inventor: John Herslow
IPC: B42D25/435 , H01L23/00 , B32B37/12 , B32B38/06 , G06K19/077 , H01L21/56 , B42D25/41 , B42D25/328 , B42D25/425 , B32B7/12 , B32B15/04 , G06K19/06 , H01L23/498 , B42D25/373 , B42D25/47 , B32B38/10 , B32B38/00
Abstract: Composite cards formed in accordance with the invention include a security layer comprising a hologram or diffraction grating formed at or in the center, or core layer of the card. The hologram may be formed by embossing a designated area of the core layer with a diffraction pattern and depositing a thin layer of metal on the embossed layer. Additional layers may be selectively and symmetrically attached to the top and bottom surfaces of the core layer. A laser may be used to remove selected portions of the metal formed on the embossed layer, at selected stages of forming the card, to impart a selected pattern or information to the holographic region. The cards may be “lasered’ when the cards being processed are attached to, and part of, a large sheet of material, or after the sheets are die-cut into cards.
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公开(公告)号:US10311346B2
公开(公告)日:2019-06-04
申请号:US14178436
申请日:2014-02-12
Applicant: COMPOSECURE, LLC
Inventor: John Herslow
IPC: G06K19/077 , G06K19/02 , B32B37/00 , B32B37/18 , G06K17/00
Abstract: Cards embodying the invention include a core subassembly whose elements define the functionality of the card and a hard coat subassembly attached to the top and/or bottom sides of the core subassembly to protect the core subassembly from wear and tear and being scratched. The core subassembly may be formed solely of plastic layers or of different combinations of plastic and metal layers and may include all the elements of a smart card enabling contactless RF communication and/or direct contact communication. The hard coat subassembly includes a hard coat layer, which typically includes nanoparticles, and a buffer or primer layer formed so as to be attached between the hard coat layer and the core subassembly for enabling the lasering of the core subassembly without negatively impacting the hard coat layer and/or for imparting color to the card.
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公开(公告)号:US20190050706A1
公开(公告)日:2019-02-14
申请号:US16164322
申请日:2018-10-18
Applicant: COMPOSECURE, LLC
Inventor: Adam Lowe
IPC: G06K19/077 , H05K3/30 , H05K3/28 , H05K1/18 , H01Q13/10
CPC classification number: B29C45/14647 , B22D19/00 , B29C45/14 , B29C45/14639 , B29C45/17 , B29L2017/006 , G06K19/077 , G06K19/07749 , G06K19/07777 , H01Q13/10 , H05K1/18 , H05K3/284 , H05K3/285 , H05K3/301 , H05K2201/1003 , H05K2203/1316 , H05K2203/1327
Abstract: A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and molding a molding material about the electronic component. A transaction card includes a molded electronic component.
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公开(公告)号:US09898699B2
公开(公告)日:2018-02-20
申请号:US14977553
申请日:2015-12-21
Applicant: COMPOSECURE, LLC
Inventor: John Herslow , Adam Lowe , Luis Dasilva
CPC classification number: G06K19/07773 , G06K19/02 , G06K19/07771 , H01Q1/2225 , H01Q1/526 , H01Q7/06
Abstract: Ferrite material utilized in a smart metal card as a shield between a metal layer and an antenna does not occupy a complete layer. Instead, only sufficient ferrite material is utilized to track and conform to the antenna.
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