公开(公告)号：US08863779B2

公开(公告)日：2014-10-21

申请号：US13595641

申请日：2012-08-27

Applicant: David Hong

Inventor： David Hong

IPC: F16K11/074 ,  B29C73/02 ,  B60C1/00

CPC classification number: B60C1/0041 ,  B29C73/166 ,  B29L2030/00 ,  Y10T137/86863 ,  Y10T137/8782

Abstract: The present invention discloses an integrated supplying apparatus for gas and sizing. It comprises a sizing barrel, a gas supply unit and a switching unit. The sizing barrel and the gas supply unit are both connected with the switching unit. When the switching unit is fixed in a first state by a safety component, the gas supply unit can only output high pressure gas through the switching unit. When the switching unit is converted into a second state by releasing the safety component, the gas supply unit in turn outputs some high pressure air into the sizing barrel through the switching unit, so that the sizing inside the sizing barrel is output under the action of the gas pressure and the gas inside the sizing barrel is then output when completing the output of the sizing.

Abstract translation: 本发明公开了一种用于气体和上浆的综合供应装置。 它包括定型桶，气体供应单元和开关单元。 定型桶和气体供应单元都与开关单元连接。 当开关单元通过安全部件固定在第一状态时，气体供给单元仅能够通过开关单元输出高压气体。 当通过释放安全部件将开关单元转换为第二状态时，气体供给单元又通过开关单元将一些高压空气输入到定型筒中，从而在定型筒内定尺寸在 然后在完成上胶料的输出时输出气体压力和定型筒内的气体。

公开(公告)号：US20140234620A1

公开(公告)日：2014-08-21

申请号：US14233074

申请日：2011-08-31

Applicant: Journey Lu Zhu ,  David Hong Fei Guo ,  Lei Ying ,  Bin Li ,  Yongyong Yang

Inventor： Journey Lu Zhu ,  David Hong Fei Guo ,  Lei Ying ,  Bin Li ,  Yongyong Yang

IPC: D01F8/16 ,  D01F8/06

CPC classification number: H01B7/295 ,  C08K5/49 ,  C08K5/5205 ,  C08K5/523 ,  C08K2003/2227 ,  C08K2201/014 ,  C08L75/04 ,  H01B3/302 ,  H01B3/441 ,  Y10T428/2942 ,  C08L29/04 ,  C08L75/08

Abstract: The present disclosure provides a wire or cable comprising a flame retardant-free thermoplastic inner sheath and an outer sheath composition comprising, based on the weight of the composition, (a) 10 wt % to 90 wt % of a TPU based resin, (b) 5 wt % to 90 wt % of a metal hydrate, (c) 2 wt % to 50 wt % of a nitrogen-based phosphorus flame retardant, and (d) 2 wt % to 50 wt % liquid phosphate modifier, wherein the outer sheath is in contact with the insulation covering, and wherein the outer sheath has a thickness from greater than zero to 0.8 mm.

Abstract translation: 本公开内容提供了包含无阻燃剂的热塑性内护套和外护套组合物的电线或电缆，其包含基于组合物的重量，（a）10重量％至90重量％的TPU基树脂，（b ）5重量％〜90重量％的金属水合物，（c）2重量％〜50重量％的氮系磷阻燃剂，和（d）2重量％〜50重量％的液体磷酸盐改性剂，其中， 护套与绝缘覆盖层接触，并且其中外护套具有大于零至0.8mm的厚度。

公开(公告)号：US08720495B2

公开(公告)日：2014-05-13

申请号：US13616082

申请日：2012-09-14

Applicant: David Hong

Inventor： David Hong

IPC: B65B31/00 ,  B65B1/04 ,  E03B5/00 ,  E03B11/16 ,  F16K15/20

CPC classification number: B60S5/04 ,  B29C73/166 ,  B29L2030/00 ,  Y10T137/3584 ,  Y10T137/85978 ,  Y10T137/87925

Abstract: The present invention discloses an integrated supplying apparatus for gas and sizing. It comprises a sizing barrel, a gas supply unit and a switching unit. The sizing barrel and the gas supply unit are both connected with the switching unit. When the switching unit is fixed in a first state by a safety cover, the gas supply unit can only output high pressure gas through the switching unit. When the switching unit is converted into a second state by releasing the safety cover, the gas supply unit in turn outputs some high pressure air into the sizing barrel through the switching unit, so that the sizing inside the sizing barrel is output under the action of the gas pressure and the gas inside the sizing barrel is then output when completing the output of the sizing.

Abstract translation: 本发明公开了一种用于气体和上浆的综合供应装置。 它包括定型桶，气体供应单元和开关单元。 定型桶和气体供应单元都与开关单元连接。 当开关单元通过安全盖固定在第一状态时，气体供应单元只能通过开关单元输出高压气体。 当通过释放安全盖将开关单元转换为第二状态时，气体供应单元又通过开关单元将一些高压空气输入到定型筒中，使得定型筒内的尺寸在 然后在完成上胶料的输出时输出气体压力和定型筒内的气体。

公开(公告)号：US08113191B2

公开(公告)日：2012-02-14

申请号：US12553606

申请日：2009-09-03

Applicant: David Hong

Inventor： David Hong

IPC: A47J37/07

CPC classification number: A47J37/0786 ,  A47J37/0713

Abstract: Flame tamers for bridging on a barbeque burner box above heat sources of a barbeque grill to distribute heat energy evenly over the barbeque cooking surface have protruding openings extending toward one more of the peripheral walls of the barbeque burner box so that foods on the cooking surface can be cooked evenly and efficiently, thus saving much energy consumption.

Abstract translation: 用于在烧烤炉的热源上方的烧烤炉上桥接的火焰锤将热能均匀地分布在烧烤烹饪表面上，具有朝向烧烤炉箱的多个周壁延伸的突出开口，使得烹饪表面上的食物可以 煮均匀高效，节省了大量的能源消耗。

公开(公告)号：US08097957B2

公开(公告)日：2012-01-17

申请号：US12702207

申请日：2010-02-08

Applicant: Ben Wei Chen ,  David Hong-Dien Chen ,  Jason Jajen Chen

Inventor： Ben Wei Chen ,  David Hong-Dien Chen ,  Jason Jajen Chen

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L25/18 ,  H01L23/5387 ,  H01L23/5388 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05553 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49175 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/15173 ,  H01L2924/15192 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A Flash memory card is disclosed comprising a substrate, a Flash memory die on top of the substrate, a controller die on top of the Flash memory die, and an interposer coupled to with the controller die and on top of the Flash memory die wherein the interposer results in substantial reduced wire bonding to the substrate. The interposer can surround or be placed side by side with the controller die. A system and method in accordance with the present invention achieves the following objectives: (1) takes advantage of as large of a Flash memory die as possible, to increase the density of the Flash card by reducing the number of wire bond pads on the substrate and enabling insertion of the largest die possible that can fit inside a given card interior boundary; (2) more efficiently stacks Flash memory dies to increase density of the Flash card; and (3) has a substantially less number of bonding wires to the substrate as possible, to improve production yield.

Abstract translation: 公开了一种闪存卡，其包括衬底，在衬底顶部的闪存存储器管芯，在闪存存储器管芯的顶部上的控制器管芯，以及与控制器管芯连接并在闪存管芯的顶部上的插入器，其中， 插入器导致大大减少了与基板的引线接合。 插入器可以围绕或与控制器管芯并排放置。 根据本发明的系统和方法实现了以下目的：（1）尽可能地利用尽可能大的闪存存储器管芯，通过减少衬底上的引线接合焊盘的数量来增加闪存卡的密度 并且能够插入可以装配在给定卡内部边界内的最大的模具; （2）更有效地堆叠闪存芯片，增加闪存卡的密度; 和（3）尽可能少的与基板的接合线数量，以提高产量。

公开(公告)号：US20100133673A1

公开(公告)日：2010-06-03

申请号：US12702207

申请日：2010-02-08

Applicant: Ben Wei CHEN ,  David Hong-Dien CHEN ,  Jason Jajen CHEN

Inventor： Ben Wei CHEN ,  David Hong-Dien CHEN ,  Jason Jajen CHEN

IPC: H01L23/52

CPC classification number: H01L25/18 ,  H01L23/5387 ,  H01L23/5388 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05553 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49175 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/15173 ,  H01L2924/15192 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A Flash memory card is disclosed comprising a substrate, a Flash memory die on top of the substrate, a controller die on top of the Flash memory die, and an interposer coupled to with the controller die and on top of the Flash memory die wherein the interposer results in substantial reduced wire bonding to the substrate. The interposer can surround or be placed side by side with the controller die. A system and method in accordance with the present invention achieves the following objectives: (1) takes advantage of as large of a Flash memory die as possible, to increase the density of the Flash card by reducing the number of wire bond pads on the substrate and enabling insertion of the largest die possible that can fit inside a given card interior boundary; (2) more efficiently stacks Flash memory dies to increase density of the Flash card; and (3) has a substantially less number of bonding wires to the substrate as possible, to improve production yield.

Abstract translation: 公开了一种闪存卡，其包括衬底，在衬底顶部的闪存存储器管芯，在闪存存储器管芯的顶部上的控制器管芯，以及与控制器管芯连接并在闪存管芯的顶部上的插入器，其中， 插入器导致大大减少了与基板的引线接合。 插入器可以围绕或与控制器管芯并排放置。 根据本发明的系统和方法实现了以下目的：（1）尽可能地利用尽可能大的闪存存储器管芯，通过减少衬底上的引线接合焊盘的数量来增加闪存卡的密度 并且能够插入可以装配在给定卡内部边界内的最大的模具; （2）更有效地堆叠闪存芯片，增加闪存卡的密度; 和（3）尽可能少的与基板的接合线数量，以提高产量。

公开(公告)号：US07626201B2

公开(公告)日：2009-12-01

申请号：US11543548

申请日：2006-10-04

Applicant: Hai Q. Chiang ,  Randy L. Hoffman ,  David Hong ,  Nicole L. Dehuff ,  John F. Wager

Inventor： Hai Q. Chiang ,  Randy L. Hoffman ,  David Hong ,  Nicole L. Dehuff ,  John F. Wager

IPC: H01L29/04 ,  H01L29/15

CPC classification number: H01L29/7869 ,  H01L29/78648

Abstract: A semiconductor device can include a channel including a zinc-indium oxide film.

公开(公告)号：US07601563B2

公开(公告)日：2009-10-13

申请号：US11624615

申请日：2007-01-18

Applicant: Ben Wei Chen ,  Jin S. Wang ,  David Hong-Dien Chen

Inventor： Ben Wei Chen ,  Jin S. Wang ,  David Hong-Dien Chen

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/02 ,  H01L23/34 ,  H01L29/68

CPC classification number: B29C45/14647 ,  B29C45/14655 ,  B29C45/14836 ,  B29C45/2708 ,  H01L21/565 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/117 ,  H05K3/284 ,  H05K2201/10159 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2203/1311 ,  H05K2203/1316 ,  H05K2203/304 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A shape-molding structure of a memory card comprises a circuit substrate, at least one chip, and an encapsulant covering. The upper and lower surfaces of the circuit substrate have a circuit layer and a plurality of electric contacts, respectively. The chip is located on the upper surface of the circuit substrate and electrically connected with the circuit layer. The encapsulant covering is formed by using a mold to press encapsulant entering at least one encapsulant inlet provided on at least one side surface of the circuit substrate. The encapsulant covering encapsulates all the above components with only the electric contacts exposed. A trace mark of the encapsulant inlet remaining on the encapsulant covering is then cut to obtain a shape-molding structure of memory card with an smooth and intact outer appearance.

Abstract translation: 存储卡的形状模制结构包括电路基板，至少一个芯片和密封剂覆盖物。 电路基板的上表面和下表面分别具有电路层和多个电触点。 芯片位于电路基板的上表面并与电路层电连接。 密封剂覆盖物通过使用模具来挤压进入设置在电路基板的至少一个侧表面上的至少一个密封剂入口的密封剂而形成。 密封剂覆盖物仅将电触头暴露在外，将所有上述组件封装起来。 然后切割保留在密封剂覆盖物上的密封剂入口的痕迹，以获得具有平滑和完整外观的存储卡的形状模制结构。

公开(公告)号：US20090088480A1

公开(公告)日：2009-04-02

申请号：US12209137

申请日：2008-09-11

Applicant: James T. DALTON ,  David A. Dickason ,  David Hong ,  Thomas G. Bird ,  Tai Ahn

Inventor： James T. DALTON ,  David A. Dickason ,  David Hong ,  Thomas G. Bird ,  Tai Ahn

IPC: A61K31/165 ,  C07C237/14 ,  A61P5/26

CPC classification number: C07C255/60 ,  C07B2200/13

Abstract: The present invention relates to solid forms of (S)—N-(4-cyano-3-(trifluoromethyl)phenyl)-3-(4-cyanophenoxy)-2-hydroxy-2-methylpropanamide and process for producing the same.

Abstract translation: 本发明涉及（S）-N-（4-氰基-3-（三氟甲基）苯基）-3-（4-氰基苯氧基）-2-羟基-2-甲基丙酰胺的固体形式及其制备方法。

公开(公告)号：US20070069374A1

公开(公告)日：2007-03-29

申请号：US11452805

申请日：2006-06-14

Applicant: Ben Chen ,  David Hong-Dien Chen ,  Jason Chen

Inventor： Ben Chen ,  David Hong-Dien Chen ,  Jason Chen

IPC: H01L23/34

CPC classification number: H01L25/18 ,  H01L23/5387 ,  H01L23/5388 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05553 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49175 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/15173 ,  H01L2924/15192 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A Flash memory card is disclosed comprising a substrate, a Flash memory die on top of the substrate, a controller die on top of the Flash memory die, and an interposer coupled to with the controller die and on top of the Flash memory die wherein the interposer results in substantial reduced wire bonding to the substrate. The interposer can surround or be placed side by side with the controller die. A system and method in accordance with the present invention achieves the following objectives: (1) takes advantage of as large of a Flash memory die as possible, to increase the density of the Flash card by reducing the number of wire bond pads on the substrate and enabling insertion of the largest die possible that can fit inside a given card interior boundary; (2) more efficiently stacks Flash memory dies to increase density of the Flash card; and (3) has a substantially less number of bonding wires to the substrate as possible, to improve production yield.

Abstract translation: 公开了一种闪存卡，其包括衬底，在衬底顶部的闪存存储器管芯，在闪存存储器管芯的顶部上的控制器管芯，以及与控制器管芯连接并在闪存管芯的顶部上的插入器，其中， 插入器导致大大减少了与基板的引线接合。 插入器可以围绕或与控制器管芯并排放置。 根据本发明的系统和方法实现了以下目的：（1）尽可能地利用尽可能大的闪存存储器管芯，通过减少衬底上的引线接合焊盘的数量来增加闪存卡的密度 并且能够插入可以装配在给定卡内部边界内的最大的模具; （2）更有效地堆叠闪存芯片，增加闪存卡的密度; 和（3）尽可能少的与基板的接合线数量，以提高产量。