摘要:
A micromachined structure includes a substrate and a suspended structure. The substrate has a cavity formed thereon. The suspended structure is formed on the cavity of the substrate. The suspended structure includes a first metal layer, a second metal layer, and a first dielectric layer positioned between the first and second metal layers, wherein the first dielectric layer has a first opening in communication with the cavity through an opening formed in the first metal layer.
摘要:
The invention provides a MEMS device with enhanced structural strength. The MEMS device includes a plurality of metal layers, including a top metal layer with a plurality of metal segments. The metal segments are individually connected to an adjacent metal layer immediately under the top metal layer through at least one supporting pillar, and there is no dielectric layer between the metal segments and the adjacent metal layer immediately under the top metal layer. The metal layers except the top metal layer are respectively connected to their adjacent metal layers through at least one supporting pillar and a dielectric layer filling in between.
摘要:
This invention provides a MEMS device, including: a mass structure having at least one anchor; at least one flexible structure connected with the mass structure at the at least one anchor; a plurality of top electrodes located above the mass structure and forming a top capacitor circuit with the mass structure; and a plurality of bottom electrodes located under the mass structure and forming a bottom capacitor circuit with the mass structure. The projections of the plural top electrodes on the mass structure along a normal direction of the mass structure are located at opposite sides of the anchor, and the projections of the plural bottom electrodes on the mass structure along a normal direction of the mass structure are located at opposite sides of the anchor. This invention also provides a MEMS compensation structure.
摘要:
The invention provides a micro-electro-mechanical device having differential capacitor of corresponding sizes, which includes a substrate; a top fixed electrode; a bottom fixed electrode; a mass, having a top electrode and a bottom electrode, wherein the top electrodes form a top capacitor with the top fixed electrode and the bottom electrodes form a bottom capacitor with the bottom fixed electrode; a top fixed electrode extension wall having an upper end connected to the top fixed electrode and a lower end connected to the substrate; and a bottom fixed electrode extension wall having a lower end connected to the substrate through the bottom electrode, wherein the bottom fixed electrode extension wall has no upper end connected to the top fixed electrode, and total areas of the top fixed electrode extension wall and the top fixed electrode facing the mass are substantially equal to total areas of the bottom fixed electrode extension wall and the bottom fixed electrode facing the mass.
摘要:
The present invention discloses a MEMS sensing device which comprises a substrate, a MEMS device region, a film, an adhesive layer, a cover, at least one opening, and a plurality of leads. The substrate has a first surface and a second surface opposite the first surface. The MEMS device region is on the first surface, and includes a chamber. The film is overlaid on the MEMS device region to seal the chamber as a sealed space. The cover is mounted on the MEMS device region and adhered by the adhesive layer. The opening is on the cover or the adhesive layer, allowing the pressure of the air outside the device to pressure the film. The leads are electrically connected to the MEMS device region, and extend to the second surface.
摘要:
A display panel includes a substrate, a pixel array, and a plurality of shift registers. The pixel array is disposed on the substrate. The shift registers are disposed on the substrate for sequentially outputting a plurality of scanning signals to drive the pixel array. Each of the shift registers includes a pull-up transistor and a first reserve transistor. The pull-up transistor raises the voltage level of the corresponding scanning signal. A control terminal of the first reserve transistor is coupled to a control terminal of the pull-up transistor, and a second terminal of the first reserve transistor is coupled to a second terminal of the pull-up transistor. When the pull-up transistor in each of the shift registers has insufficient output ability, a first terminal of the first reserve transistor is coupled to a first terminal of the pull-up transistor.
摘要:
A method for fabricating micromachined structures is provided. A structure including a dielectric layer, a metal layer and a passivation layer is formed, wherein the dielectric layer has a via thereon. An etching window is formed on the passivation layer. An etching solution is poured into the via through the etching window to perform a process of etching. After etching, the etching solution is removed and the passivation layer is removed. Finally, the structure is etched again to form the micromachined structure.
摘要:
The present invention discloses synthesis of 2,2′-disubstituted 9,9′-spirobifluorene-based triaryldiamine. First, 2,2′-diamino-9,9′-spirobifluorene, a Pd-catalyst as auxiliary and aryl halide BX are provided, wherein X is selected from the group consisting of: Cl, Br and I, B comprises one of the following group: aryl moiety, hetero cycle, multiple fused ring, multiple fused ring with hetero atom(s). Next, a substitution reaction is performed to react the 2,2′-diamino-9,9′-spirobifluorene with the aryl halide BX to produce the 2,2′-disubstituted 9,9′-spirobifluorene-based triaryldiamines. In addition, the present invention discloses organic light emitting devices comprising hole transporting material comprising 2,2′-bis(N,N-disubstituted amino)-9,9′-spirobifluorenes.
摘要:
The invention provides a MEMS device with enhanced structural strength. The MEMS device includes a plurality of metal layers, including a top metal layer with a plurality of metal segments. The metal segments are individually connected to an adjacent metal layer immediately under the top metal layer through at least one supporting pillar, and there is no dielectric layer between the metal segments and the adjacent metal layer immediately under the top metal layer. The metal layers except the top metal layer are respectively connected to their adjacent metal layers through at least one supporting pillar and a dielectric layer filling in between.
摘要:
A micromachined structure includes a substrate and a suspended structure. The substrate has a cavity formed thereon. The suspended structure is formed on the cavity of the substrate. The suspended structure includes a first metal layer, a second metal layer, and a first dielectric layer positioned between the first and second metal layers, wherein the first dielectric layer has a first opening in communication with the cavity through an opening formed in the first metal layer.