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公开(公告)号：US09493342B2
公开(公告)日：2016-11-15
申请号：US13924047
申请日：2013-06-21
Applicant: NextInput, Inc.
Inventor： Amnon Brosh
CPC classification number: B81B3/0072 , B81B3/0021 , B81C1/00158 , B81C1/00666 , G01L1/044 , G01L1/18 , G01L5/0028 , G01L5/0057 , G01L5/162
Abstract: A composite wafer level MEMS force dies including a spacer coupled to a sensor is described herein. The sensor includes at least one flexible sensing element, such as a beam or diaphragm, which have one or more sensor elements formed thereon. Bonding pads connected to the sensor elements are placed on the outer periphery of the sensor. The spacer, which protects the flexible sensing element and the wire bonding pads, is bonded to the sensor. For the beam version, the bond is implemented at the outer edges of the die. For the diaphragm version, the bond is implemented in the center of the die. An interior gap between the spacer and the sensor allows the flexible sensing element to deflect. The gap can also be used to limit the amount of deflection of the flexible sensing element in order to provide overload protection.
Abstract translation: 本文描述了包括耦合到传感器的间隔件的复合晶片级MEMS力模。 传感器包括至少一个柔性传感元件，例如梁或隔膜，其具有形成在其上的一个或多个传感器元件。 连接到传感器元件的接合垫放置在传感器的外周。 保护柔性感测元件和引线接合垫的间隔件被粘合到传感器上。 对于光束版本，焊接在裸片的外边缘处实现。 对于膜片版本，键合在芯片的中心实现。 间隔器和传感器之间的内部间隙允许柔性传感元件偏转。 该间隙也可用于限制柔性传感元件的偏转量，以提供过载保护。
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公开(公告)号：US09487388B2
公开(公告)日：2016-11-08
申请号：US13923998
申请日：2013-06-21
Applicant: NextInput, Inc.
Inventor： Amnon Brosh
CPC classification number: B81B3/0072 , B81B3/0021 , B81C1/00158 , B81C1/00666 , G01L1/044 , G01L1/18 , G01L5/0028 , G01L5/0057 , G01L5/162
Abstract: Described herein are ruggedized wafer level MEMS force dies composed of a platform and a silicon sensor. The silicon sensor employs multiple flexible sensing elements containing Piezoresistive strain gages and wire bonds.
Abstract translation: 这里描述的是由平台和硅传感器组成的坚固耐用的晶片级MEMS力模。 硅传感器采用多个灵活的感应元件，它们包含压阻应变片和引线键。
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公开(公告)号：US20140007705A1
公开(公告)日：2014-01-09
申请号：US13934900
申请日：2013-07-03
Applicant: NextInput, Inc.
Inventor： Ian Campbell , Ryan Diestelhorst
CPC classification number: G01L1/18 , B81B3/0018 , B81C1/00134 , G01L1/148 , G01L1/26 , G01L5/162
Abstract: A microelectromechanical (“MEMS”) load sensor device for measuring a force applied by a human user is described herein. In one aspect, the load sensor device has a contact surface in communication with a touch surface which communicates forces originating on the touch surface to a deformable membrane, on which load sensor elements are arranged, such that the load sensor device produces a signal proportional to forces imparted by a human user along the touch surface. In another aspect, the load sensor device has an overload protection ring to protect the load sensor device from excessive forces. In another aspect, the load sensor device has embedded logic circuitry to allow a microcontroller to individually address load sensor devices organized into an array. In another aspect, the load sensor device has electrical and mechanical connectors such as solder bumps designed to minimize cost of final component manufacturing.
Abstract translation: 本文描述了用于测量人类用户施加的力的微机电（“MEMS”）负载传感器装置。 在一个方面，负载传感器装置具有与触摸表面连通的接触表面，该接触表面将起始于触摸表面的力连接到可变形的膜上，负载传感器元件布置在其上，使得负载传感器装置产生与 由人类使用者沿着触摸表面施加的力。 在另一方面，负载传感器装置具有过载保护环以保护负载传感器装置免受过大的力。 在另一方面，负载传感器装置具有嵌入式逻辑电路，以允许微控制器分别地组织成阵列的负载传感器装置。 在另一方面，负载传感器装置具有电气和机械连接器，例如设计成最小化最终部件制造成本的焊料凸块。
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公开(公告)号：US20130096849A1
公开(公告)日：2013-04-18
申请号：US13649526
申请日：2012-10-11
Applicant: NextInput Inc.
Inventor： Ian Campbell , Ryan Diestelhorst
IPC: G06F19/00
CPC classification number: G06F3/0414 , G06F2203/04102 , G06F2203/04104
Abstract: An interface device for measuring forces applied to the interface device. The interface device has a flexible contact surface suspended above a rigid substrate. The interface device has at least one sensor in communication with the contact surface. The interface device has processing circuitry for receiving signals from the sensors and substantially instantaneously producing an output signal corresponding to the location and force applied in multiple locations across the contact surface.
Abstract translation: 一种用于测量施加到接口装置的力的接口装置。 接口装置具有悬挂在刚性基板上方的柔性接触表面。 接口装置具有与接触表面连通的至少一个传感器。 接口装置具有用于接收来自传感器的信号的处理电路，并基本上瞬间产生对应于穿过接触表面的多个位置施加的位置和力的输出信号。
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公开(公告)号：US20240133755A1
公开(公告)日：2024-04-25
申请号：US18535230
申请日：2023-12-11
Applicant: NextInput, Inc.
Inventor： Julius Minglin Tsai , Dan Benjamin
CPC classification number: G01L1/2281 , G01L1/16 , G01L1/18
Abstract: MEMS force sensors for providing temperature coefficient of offset (TCO) compensation are described herein. An example MEMS force sensor can include a TCO compensation layer to minimize the TCO of the force sensor. The bottom side of the force sensor can be electrically and mechanically mounted on a package substrate while the TCO compensation layer is disposed on the top side of the sensor. It is shown the TCO can be reduced to zero with the appropriate combination of Young's modulus, thickness, and/or thermal coefficient of expansion (TCE) of the TCO compensation layer.
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Patent Agency Ranking
公开(公告)号：US11953380B2
公开(公告)日：2024-04-09
申请号：US17613222
申请日：2020-05-21
Applicant: NEXTINPUT, INC.
Inventor： Ali Foughi , Julius Minglin Tsai , Christopher Edwards
CPC classification number: G01J5/20 , G01J5/0007 , G01J5/024 , G01J5/58
Abstract: Described herein is a sensor in chip scale package form factor. For example, a non-vacuum packaged sensor chip described herein includes a substrate, and a sensing element arranged on the substrate. The sensing element is configured to change resistance with temperature. Additionally, the non-vacuum packaged sensor chip includes an absorbing layer configured to absorb middle infrared (“MIR”) radiation.
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37.发明授权公开(公告)号：US11946816B2
公开(公告)日：2024-04-02
申请号：US18117156
申请日：2023-03-03
Applicant: NEXTINPUT, INC.
Inventor： Albert Bergemont , Julius Minglin Tsai
CPC classification number: G01L1/16 , G01L1/18 , H10N30/302
Abstract: Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor. The sensor employs piezoresistive or piezoelectric sensing elements for force sensing where the force is converted to strain and converted to electrical signal. In one aspect, both the piezoresistive and the piezoelectric sensing elements are formed on one substrate and later bonded to another substrate on which the integrated circuitry is formed. In another aspect, the piezoelectric sensing element is formed on one substrate and later bonded to another substrate on which both the piezoresistive sensing element and the integrated circuitry are formed.
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公开(公告)号：US11604104B2
公开(公告)日：2023-03-14
申请号：US17591715
申请日：2022-02-03
Applicant: NEXTINPUT, INC.
Inventor： Julius Minglin Tsai , Ryan Diestelhorst , Dan Benjamin
Abstract: Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor including both piezoresistive and piezoelectric sensing elements and integrated with complementary metal-oxide-semiconductor (“CMOS”) circuitry on the same chip. The sensor employs piezoresistive strain gauges for static force and piezoelectric strain gauges for dynamic changes in force. Both piezoresistive and piezoelectric sensing elements are electrically connected to integrated circuits provided on the same substrate as the sensing elements. The integrated circuits can be configured to amplify, digitize, calibrate, store, and/or communicate force values electrical terminals to external circuitry.
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公开(公告)号：US20220260436A1
公开(公告)日：2022-08-18
申请号：US17591715
申请日：2022-02-03
Applicant: NEXTINPUT, INC.
Inventor： Julius Minglin Tsai , Ryan Diestelhorst , Dan Benjamin
Abstract: Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor including both piezoresistive and piezoelectric sensing elements and integrated with complementary metal-oxide-semiconductor (“CMOS”) circuitry on the same chip. The sensor employs piezoresistive strain gauges for static force and piezoelectric strain gauges for dynamic changes in force. Both piezoresistive and piezoelectric sensing elements are electrically connected to integrated circuits provided on the same substrate as the sensing elements. The integrated circuits can be configured to amplify, digitize, calibrate, store, and/or communicate force values electrical terminals to external circuitry.
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公开(公告)号：US20220228936A1
公开(公告)日：2022-07-21
申请号：US17615208
申请日：2020-06-01
Applicant: NEXTINPUT, INC.
Inventor： Michael DUEWEKE , Allan LIU , Dan BENJAMIN
IPC: G01L5/00
Abstract: Described herein is a method and system for testing a force or strain sensor in a continuous fashion. The method employs a sensor, a test fixture, a load cell, a mechanical actuator and tester hardware and software to simultaneously record signal outputs from the sensor and load cell as functions of time. The method provides time synchronization events for recording data streams between, for example, a linear ramp of the force on, or displacement of, the sensor and for extracting performance characteristics from the data in post-test processing.
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