公开(公告)号：US20210225721A1

公开(公告)日：2021-07-22

申请号：US16746275

申请日：2020-01-17

Applicant: Allegro MicroSystems, LLC

Inventor： Shixi Louis Liu ,  Natasha Healey ,  Rishikesh Nikam

IPC: H01L23/31 ,  H01L23/495 ,  H01L27/07

Abstract: A power integrated circuit (IC) includes a lead frame comprising a signal lead, a power lead, and a paddle attached to one or more of the signal lead and the power lead, an electrical component supported by the paddle, and a mold material configured to enclose a portion of the lead frame and expose a surface of the paddle, wherein the power lead has a first portion extending from an edge of the mold material outside of the mold material in a first direction and a second portion enclosed by the mold material and extending from the edge of the mold material inside the mold material in a second direction to the paddle, wherein the second direction is substantially opposite to the first direction. In embodiments, the paddle is only attached to the second portion of the power lead. The first and second portions of the power lead meet at a junction between a first portion of the mold material and a second portion of the mold material, the junction positioned on a side surface of the mold material that extends from a first surface to a substantially parallel second surface of the mold material.

公开(公告)号：US20190277889A1

公开(公告)日：2019-09-12

申请号：US16426215

申请日：2019-05-30

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Shixi Louis Liu

IPC: G01R15/20 ,  G01R33/00 ,  G01R33/09 ,  G01R33/07 ,  H01L43/02 ,  H01L21/48 ,  H01L43/04 ,  H01L23/495 ,  H01L23/00 ,  G01R19/00 ,  H01L43/08 ,  H01L43/06

Abstract: A current sensor integrated circuit includes a lead frame having a primary conductor and at least one secondary lead, a semiconductor die disposed adjacent to the primary conductor, an insulation structure disposed between the primary conductor and the semiconductor die, and a non-conductive insulative material enclosing the semiconductor die, the insulation structure, a first portion of the primary conductor, and a first portion of the at least one secondary lead to form a package. The first portion of the at least one secondary lead (between a first end proximal to the primary conductor and a second end proximal to the second, exposed portion of the at least one secondary lead) has a thickness that is less than a thickness of the second, exposed portion of the least one secondary lead. A distance between the second, exposed portion of the primary conductor and the second, exposed portion of the at least one secondary lead is at least 7.2 mm.