Interlock arrangement for attaching a lens barrel to a lens carrier

    公开(公告)号:US10534154B2

    公开(公告)日:2020-01-14

    申请号:US15979765

    申请日:2018-05-15

    Applicant: Apple Inc.

    Abstract: Various embodiments include an interlock arrangement that may be used to attach a lens barrel to a lens carrier of a camera. In some embodiments, the interlock arrangement may restrict movement of the lens barrel relative to the lens carrier along at least an optical axis. In various examples, the interlock arrangement may include one or more grooves and one or more protrusions. For instance, a groove may be defined by the lens barrel or the lens carrier, and a protrusion may extend from the lens barrel or the lens carrier to at least partially into the groove. In some cases, the interlock arrangement may include an adhesive that at least partially fills gaps within the interlock arrangement between the lens barrel and the lens carrier. According to some embodiments, the interlock arrangement may include one or more recesses that provide inlets for the adhesive to be introduced to the gaps within the interlock arrangement.

    Passive damping solution to optical image stabilization for voice coil motors

    公开(公告)号:US10302961B2

    公开(公告)日:2019-05-28

    申请号:US15893530

    申请日:2018-02-09

    Applicant: Apple Inc.

    Abstract: In some embodiments, an apparatus includes an optics assembly housing an optics component. In some embodiments, the optics assembly is configured to move within the apparatus. In some embodiments, the optics assembly is suspended by a plurality of wires on a base component of the apparatus. In some embodiments, one or more passive dampers disposed around the plurality of wires. In some embodiments, the passive dampers are configured to passively dampen motions of the optics assembly within the apparatus, and each of the one or more passive dampers radially surrounds a portion of a length of a respective one of the plurality of wires over a portion of the length of the respective one of the plurality of wires.

    Welded bracket structure for a multi-camera system

    公开(公告)号:US12153278B2

    公开(公告)日:2024-11-26

    申请号:US18189167

    申请日:2023-03-23

    Applicant: Apple Inc.

    Abstract: Various embodiments include a welded bracket structure for camera modules and techniques for forming such a welded bracket structure. In some embodiments, the welded bracket structure may include a first bracket and a second bracket that are welded to each other. Some embodiments include a weld joint arrangement comprising one or more weld joints for attaching the first bracket to the second bracket. Furthermore, some embodiments include an epoxy arrangement for a multi-camera system that includes the welded bracket structure and multiple camera modules.

    Damper arrangement for actuator damping

    公开(公告)号:US11330182B2

    公开(公告)日:2022-05-10

    申请号:US16926526

    申请日:2020-07-10

    Applicant: Apple Inc.

    Abstract: Various embodiments include a damper arrangement that may be used to dampen motions of a dynamic component. In some embodiments, the damper arrangement may be used in a camera module that includes a stationary component and a dynamic component. For instance, the dynamic component may hold a lens such that the lens moves together with the dynamic component. In various examples, the damper arrangement may include an interface member that extends from the stationary component or the dynamic component to at least partially into a viscoelastic material within a pocket configured in the stationary component, the dynamic component, or both. The interface member may be configured to traverse within the viscoelastic material to dampen motion of the dynamic component, for example, during operation of a lens actuator to move the dynamic component along an optical axis of the lens.

    Camera With a Multi-Material Base Structure

    公开(公告)号:US20220091430A1

    公开(公告)日:2022-03-24

    申请号:US17480045

    申请日:2021-09-20

    Applicant: Apple Inc.

    Abstract: A camera may include a multi-material base structure having at least a first portion and a second portion. The first and second portions of the base structure may include different materials. The base structure may be used with one or more actuators of the camera to implement various optical image stabilization (OIS) and/or autofocus (AF) functions.

    Mobile zoom using multiple optical image stabilization cameras

    公开(公告)号:US11102416B2

    公开(公告)日:2021-08-24

    申请号:US16994341

    申请日:2020-08-14

    Applicant: Apple Inc.

    Abstract: Some embodiments include a camera system having a first camera unit and a second camera unit. The first camera unit may include a first actuator. The second camera unit may include a second actuator. In some embodiments, the first actuator may move one or more components of the first camera unit to provide autofocus and/or optical image stabilization functionality to the first camera unit. In some embodiments, the second actuator may move one or more components of the second camera unit to provide autofocus and/or optical image stabilization functionality to the second camera unit. In some examples, the first camera unit may be configured to capture a first image of a first visual field. The second camera unit may be configured to capture, simultaneously with the first camera unit capturing the first image, a second image of a second visual field.

    Hybrid Sensor Shift Platform
    40.
    发明申请

    公开(公告)号:US20210028216A1

    公开(公告)日:2021-01-28

    申请号:US16935094

    申请日:2020-07-21

    Applicant: Apple Inc.

    Abstract: A hybrid sensor shift platform for an optical image stabilization (OIS) actuator mechanism in compact camera modules includes two or more substrates. A top substrate is composed of an organic material (e.g., a resin) to reduce mass, reduce magnetic interaction with permanent magnets, and improve reliability. One or more lower substrates of the hybrid sensor shift platform are ceramic substrates that provide the benefits of ceramics for connection to the image sensor. The organic substrate is connected via a solder bond process to the lower ceramic substrate(s). The connection between the substrates is reinforced with an under-fill of epoxy that surrounds the solder bonds, thus creating a full interface between the substrates within the overlap.

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