公开(公告)号：US20150230342A1

公开(公告)日：2015-08-13

申请号：US14244299

申请日：2014-04-03

Applicant: Apple Inc.

Inventor： Jun Chung Hsu ,  Jun Zhai

IPC: H05K3/00 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K1/115 ,  H01L23/145 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/029 ,  H05K2201/09581 ,  Y10T29/49124 ,  H01L2924/00

Abstract: In some embodiments, a carrier substrate for an integrated circuit may include a core, a first plurality of openings, and a first insulating material. The core may include a first surface and a second surface substantially opposing the first surface. The first plurality of openings may extend from the first surface to the second surface of the core. In some embodiments, the first insulating material may be applied to a surface of the first plurality of openings. In some embodiments, the first plurality of openings may include a first conductor extending through each of the first plurality of openings from the first surface to the second surface. In some embodiments, at least a first subset of the first plurality of openings may include a first charge and at least a second subset of the first plurality of openings may include a second charge. The first charge and the second charge may be different.

Abstract translation: 在一些实施例中，用于集成电路的载体衬底可以包括芯，第一多个开口和第一绝缘材料。 芯可以包括基本上与第一表面相对的第一表面和第二表面。 第一多个开口可以从芯的第一表面延伸到第二表面。 在一些实施例中，第一绝缘材料可以施加到第一多个开口的表面。 在一些实施例中，第一多个开口可以包括延伸穿过第一多个开口中的每一个从第一表面到第二表面的第一导体。 在一些实施例中，第一多个开口的至少第一子集可以包括第一电荷，并且第一多个开口的至少第二子集可以包括第二电荷。 第一次充电和第二次充电可能不同。