公开(公告)号：US09911664B2

公开(公告)日：2018-03-06

申请号：US14312470

申请日：2014-06-23

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Zhihong Wang ,  Wen-Chiang Tu ,  Zhefu Wang ,  Hassan G. Iravani ,  Boguslaw A. Swedek ,  Fred C. Redeker ,  William H. McClintock

IPC: H01L23/58 ,  H01L21/66 ,  H01L21/321

CPC classification number: H01L22/14 ,  H01L21/3212 ,  H01L22/26 ,  H01L22/30

Abstract: A substrate for use in fabrication of an integrated circuit has a layer with a plurality of conductive interconnects. The substrate includes a semiconductor body, a dielectric layer disposed over the semiconductor body, a plurality of conductive lines of a conductive material disposed in first trenches in the dielectric layer to provide the conductive interconnects, and a closed conductive loop structure of the conductive material disposed in second trenches in the dielectric layer. The closed conductive loop is not electrically connected to any of the conductive lines.

公开(公告)号：US20150336236A1

公开(公告)日：2015-11-26

申请号：US14285545

申请日：2014-05-22

Applicant: Applied Materials, Inc.

Inventor： Hung Chen ,  Rajeev Bajaj ,  Brian J. Brown ,  Robert T. Lum ,  Fred C. Redeker

IPC: B24B53/017 ,  H01L21/306 ,  B26F3/00 ,  H01L21/268 ,  B24B37/26 ,  B23K26/36

CPC classification number: B24B53/017 ,  B23K26/36 ,  B24B37/26 ,  B26D3/06 ,  B26F3/004

Abstract: Among other things, a method comprises polishing a surface of a substrate by applying a pressure between the surface of a substrate and a surface of a polishing pad. The surface of the polishing pad defines one or more grooves separated by one or more partition regions. The one or more grooves have an initial depth before the polishing starts and extend from an initial outer surface of the one or more partition regions to an initial bottom of the one or more grooves. The method also comprises removing material below an initial bottom of the one or more grooves such that a distance between an outer surface of the one or more partition regions and a bottom of the one or more grooves remain substantially the same as the initial depth.

Abstract translation: 除其他之外，一种方法包括通过在基板的表面和抛光垫的表面之间施加压力来抛光基板的表面。 抛光垫的表面限定了一个或多个由一个或多个分隔区隔开的槽。 一个或多个凹槽在抛光开始之前具有初始深度并且从一个或多个分隔区域的初始外表面延伸到一个或多个凹槽的初始底部。 该方法还包括在一个或多个凹槽的初始底部下方移除材料，使得一个或多个分隔区域的外表面与一个或多个凹槽的底部之间的距离保持与初始深度基本相同。