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    SUBSTRATE FEATURES FOR INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH
    1.
    发明申请
    SUBSTRATE FEATURES FOR INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH 有权
    导电性深度深度感应监测的基底特征

    公开(公告)号：US20150371907A1

    公开(公告)日：2015-12-24

    申请号：US14312470

    申请日：2014-06-23

    申请人： Applied Materials, Inc.

    发明人： Wei Lu ,  Zhihong Wang ,  Wen-Chiang Tu ,  Zhefu Wang ,  Hassan G. Iravani ,  Boguslaw A. Swedek ,  Fred C. Redeker ,  William H. McClintock

    IPC分类号： H01L21/66 ,  H01L21/306

    CPC分类号： H01L22/14 ,  H01L21/3212 ,  H01L22/26 ,  H01L22/30

    摘要： A substrate for use in fabrication of an integrated circuit has a layer with a plurality of conductive interconnects. The substrate includes a semiconductor body, a dielectric layer disposed over the semiconductor body, a plurality of conductive lines of a conductive material disposed in first trenches in the dielectric layer to provide the conductive interconnects, and a closed conductive loop structure of the conductive material disposed in second trenches in the dielectric layer. The closed conductive loop is not electrically connected to any of the conductive lines.

    摘要翻译： 用于制造集成电路的衬底具有具有多个导电互连的层。 衬底包括半导体本体，设置在半导体本体上的电介质层，设置在电介质层中的第一沟槽中的导电材料的多条导电线，以提供导电互连，以及设置导电材料的闭合导电环结构 在介质层的第二沟槽中。 闭合的导电回路不与任何导电线电连接。

    INDUCTIVE MONITORING OF CONDUCTIVE LOOPS
    2.
    发明申请
    INDUCTIVE MONITORING OF CONDUCTIVE LOOPS 审中-公开

    公开(公告)号：US20190035699A1

    公开(公告)日：2019-01-31

    申请号：US16150009

    申请日：2018-10-02

    申请人： Applied Materials, Inc.

    发明人： Wei Lu ,  Zhefu Wang ,  Zhihong Wang ,  Hassan G. Iravani ,  Dominic J. Benvegnu ,  Ingemar Carlsson ,  Boguslaw A. Swedek ,  Wen-Chiang Tu

    IPC分类号： H01L21/66 ,  H01L21/321 ,  B24B37/04 ,  B24B37/013

    摘要： In fabrication of an integrated circuit having a layer with a plurality of conductive interconnects, a layer of a substrate is polished to provide the layer of the integrated circuit. The layer of the substrate includes conductive lines to provide the conductive interconnects. The layer of the substrate includes a closed conductive loop formed of a conductive material in a trench. A depth of the conductive material in the trench is monitored using an inductive monitoring system and a signal is generated. Monitoring includes generating a magnetic field that intermittently passes through the closed conductive loop. A sequence of values over time is extracted from the signal, the sequence of values representing the depth of the conductive material over time.

    INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH
    10.
    发明申请
    INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH 有权
    诱导性深层深度的诱导监测

    公开(公告)号：US20150371913A1

    公开(公告)日：2015-12-24

    申请号：US14312503

    申请日：2014-06-23

    申请人： Applied Materials, Inc.

    发明人： Wei Lu ,  Zhefu Wang ,  Zhihong Wang ,  Hassan G. Iravani ,  Dominic J. Benvegnu ,  Ingemar Carlsson ,  Boguslaw A. Swedek ,  Wen-Chiang Tu

    IPC分类号： H01L21/66 ,  B24B37/013 ,  B24B37/04 ,  H01L21/306 ,  H01L21/67

    CPC分类号： H01L22/26 ,  B24B37/013 ,  B24B37/04 ,  H01L21/3212 ,  H01L22/14

    摘要： In fabrication of an integrated circuit having a layer with a plurality of conductive interconnects, a layer of a substrate is polished to provide the layer of the integrated circuit. The layer of the substrate includes conductive lines to provide the conductive interconnects. The layer of the substrate includes a closed conductive loop formed of a conductive material in a trench. A depth of the conductive material in the trench is monitored using an inductive monitoring system and a signal is generated. Monitoring includes generating a magnetic field that intermittently passes through the closed conductive loop. A sequence of values over time is extracted from the signal, the sequence of values representing the depth of the conductive material over time.

    摘要翻译： 在具有具有多个导电互连层的集成电路的制造中，抛光衬底层以提供集成电路的层。 衬底的层包括提供导电互连的导线。 衬底层包括在沟槽中由导电材料形成的闭合导电环路。 使用感应监测系统监测沟槽中导电材料的深度，并产生信号。 监测包括产生间歇地通过闭合导电回路的磁场。 从信号中提取随时间变化的值序列，表示导电材料随着时间的深度的值序列。