公开(公告)号：US20150371907A1

公开(公告)日：2015-12-24

申请号：US14312470

申请日：2014-06-23

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Zhihong Wang ,  Wen-Chiang Tu ,  Zhefu Wang ,  Hassan G. Iravani ,  Boguslaw A. Swedek ,  Fred C. Redeker ,  William H. McClintock

IPC: H01L21/66 ,  H01L21/306

CPC classification number: H01L22/14 ,  H01L21/3212 ,  H01L22/26 ,  H01L22/30

Abstract: A substrate for use in fabrication of an integrated circuit has a layer with a plurality of conductive interconnects. The substrate includes a semiconductor body, a dielectric layer disposed over the semiconductor body, a plurality of conductive lines of a conductive material disposed in first trenches in the dielectric layer to provide the conductive interconnects, and a closed conductive loop structure of the conductive material disposed in second trenches in the dielectric layer. The closed conductive loop is not electrically connected to any of the conductive lines.

Abstract translation: 用于制造集成电路的衬底具有具有多个导电互连的层。 衬底包括半导体本体，设置在半导体本体上的电介质层，设置在电介质层中的第一沟槽中的导电材料的多条导电线，以提供导电互连，以及设置导电材料的闭合导电环结构 在介质层的第二沟槽中。 闭合的导电回路不与任何导电线电连接。

公开(公告)号：US20190035699A1

公开(公告)日：2019-01-31

申请号：US16150009

申请日：2018-10-02

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Zhefu Wang ,  Zhihong Wang ,  Hassan G. Iravani ,  Dominic J. Benvegnu ,  Ingemar Carlsson ,  Boguslaw A. Swedek ,  Wen-Chiang Tu

IPC: H01L21/66 ,  H01L21/321 ,  B24B37/04 ,  B24B37/013

Abstract: In fabrication of an integrated circuit having a layer with a plurality of conductive interconnects, a layer of a substrate is polished to provide the layer of the integrated circuit. The layer of the substrate includes conductive lines to provide the conductive interconnects. The layer of the substrate includes a closed conductive loop formed of a conductive material in a trench. A depth of the conductive material in the trench is monitored using an inductive monitoring system and a signal is generated. Monitoring includes generating a magnetic field that intermittently passes through the closed conductive loop. A sequence of values over time is extracted from the signal, the sequence of values representing the depth of the conductive material over time.

公开(公告)号：US20170365532A1

公开(公告)日：2017-12-21

申请号：US15694632

申请日：2017-09-01

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Zhefu Wang ,  Zhihong Wang ,  Hassan G. Iravani ,  Dominic J. Benvegnu ,  Ingemar Carlsson ,  Boguslaw A. Swedek ,  Wen-Chiang Tu

IPC: H01L21/66 ,  B24B37/04 ,  H01L21/321 ,  B24B37/013

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B37/04 ,  H01L21/3212 ,  H01L22/14

Abstract: In fabrication of an integrated circuit having a layer with a plurality of conductive interconnects, a layer of a substrate is polished to provide the layer of the integrated circuit. The layer of the substrate includes conductive lines to provide the conductive interconnects. The layer of the substrate includes a closed conductive loop formed of a conductive material in a trench. A depth of the conductive material in the trench is monitored using an inductive monitoring system and a signal is generated. Monitoring includes generating a magnetic field that intermittently passes through the closed conductive loop. A sequence of values over time is extracted from the signal, the sequence of values representing the depth of the conductive material over time.

公开(公告)号：US09754846B2

公开(公告)日：2017-09-05

申请号：US14312503

申请日：2014-06-23

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Zhefu Wang ,  Zhihong Wang ,  Hassan G. Iravani ,  Dominic J. Benvegnu ,  Ingemar Carlsson ,  Boguslaw A. Swedek ,  Wen-Chiang Tu

IPC: G06F19/00 ,  H01L21/8242 ,  H01L21/66 ,  B24B37/04 ,  B24B37/013 ,  H01L21/321

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B37/04 ,  H01L21/3212 ,  H01L22/14

Abstract: In fabrication of an integrated circuit having a layer with a plurality of conductive interconnects, a layer of a substrate is polished to provide the layer of the integrated circuit. The layer of the substrate includes conductive lines to provide the conductive interconnects. The layer of the substrate includes a closed conductive loop formed of a conductive material in a trench. A depth of the conductive material in the trench is monitored using an inductive monitoring system and a signal is generated. Monitoring includes generating a magnetic field that intermittently passes through the closed conductive loop. A sequence of values over time is extracted from the signal, the sequence of values representing the depth of the conductive material over time.

公开(公告)号：US10199281B2

公开(公告)日：2019-02-05

申请号：US15891290

申请日：2018-02-07

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Zhihong Wang ,  Wen-Chiang Tu ,  Zhefu Wang ,  Hassan G. Iravani ,  Boguslaw A. Swedek ,  Fred C. Redeker ,  William H. McClintock

IPC: H01L21/66 ,  H01L21/321

Abstract: A substrate for use in fabrication of an integrated circuit has a layer with a plurality of conductive interconnects. The substrate includes a semiconductor body, a dielectric layer disposed over the semiconductor body, a plurality of conductive lines of a conductive material disposed in first trenches in the dielectric layer to provide the conductive interconnects, and a closed conductive loop structure of the conductive material disposed in second trenches in the dielectric layer. The closed conductive loop is not electrically connected to any of the conductive lines.

公开(公告)号：US20180166347A1

公开(公告)日：2018-06-14

申请号：US15891290

申请日：2018-02-07

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Zhihong Wang ,  Wen-Chiang Tu ,  Zhefu Wang ,  Hassan G. Iravani ,  Boguslaw A. Swedek ,  Fred C. Redeker ,  William H. McClintock

IPC: H01L21/66 ,  H01L21/321

CPC classification number: H01L22/14 ,  H01L21/3212 ,  H01L22/26 ,  H01L22/30

Abstract: A substrate for use in fabrication of an integrated circuit has a layer with a plurality of conductive interconnects. The substrate includes a semiconductor body, a dielectric layer disposed over the semiconductor body, a plurality of conductive lines of a conductive material disposed in first trenches in the dielectric layer to provide the conductive interconnects, and a closed conductive loop structure of the conductive material disposed in second trenches in the dielectric layer. The closed conductive loop is not electrically connected to any of the conductive lines.

公开(公告)号：US10741459B2

公开(公告)日：2020-08-11

申请号：US16150009

申请日：2018-10-02

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Zhefu Wang ,  Zhihong Wang ,  Hassan G. Iravani ,  Dominic J. Benvegnu ,  Ingemar Carlsson ,  Boguslaw A. Swedek ,  Wen-Chiang Tu

IPC: B24B37/013 ,  B24B37/04 ,  H01L21/66 ,  H01L21/321 ,  H01L21/32

Abstract: In fabrication of an integrated circuit having a layer with a plurality of conductive interconnects, a layer of a substrate is polished to provide the layer of the integrated circuit. The layer of the substrate includes conductive lines to provide the conductive interconnects. The layer of the substrate includes a closed conductive loop formed of a conductive material in a trench. A depth of the conductive material in the trench is monitored using an inductive monitoring system and a signal is generated. Monitoring includes generating a magnetic field that intermittently passes through the closed conductive loop. A sequence of values over time is extracted from the signal, the sequence of values representing the depth of the conductive material over time.

公开(公告)号：US10103073B2

公开(公告)日：2018-10-16

申请号：US15694632

申请日：2017-09-01

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Zhefu Wang ,  Zhihong Wang ,  Hassan G. Iravani ,  Dominic J. Benvegnu ,  Ingemar Carlsson ,  Boguslaw A. Swedek ,  Wen-Chiang Tu

IPC: H01L21/00 ,  H01L21/302 ,  H01L21/66 ,  H01L21/321 ,  B24B37/013 ,  B24B37/04

Abstract: In fabrication of an integrated circuit having a layer with a plurality of conductive interconnects, a layer of a substrate is polished to provide the layer of the integrated circuit. The layer of the substrate includes conductive lines to provide the conductive interconnects. The layer of the substrate includes a closed conductive loop formed of a conductive material in a trench. A depth of the conductive material in the trench is monitored using an inductive monitoring system and a signal is generated. Monitoring includes generating a magnetic field that intermittently passes through the closed conductive loop. A sequence of values over time is extracted from the signal, the sequence of values representing the depth of the conductive material over time.

公开(公告)号：US09911664B2

公开(公告)日：2018-03-06

申请号：US14312470

申请日：2014-06-23

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Zhihong Wang ,  Wen-Chiang Tu ,  Zhefu Wang ,  Hassan G. Iravani ,  Boguslaw A. Swedek ,  Fred C. Redeker ,  William H. McClintock

IPC: H01L23/58 ,  H01L21/66 ,  H01L21/321

CPC classification number: H01L22/14 ,  H01L21/3212 ,  H01L22/26 ,  H01L22/30

Abstract: A substrate for use in fabrication of an integrated circuit has a layer with a plurality of conductive interconnects. The substrate includes a semiconductor body, a dielectric layer disposed over the semiconductor body, a plurality of conductive lines of a conductive material disposed in first trenches in the dielectric layer to provide the conductive interconnects, and a closed conductive loop structure of the conductive material disposed in second trenches in the dielectric layer. The closed conductive loop is not electrically connected to any of the conductive lines.

公开(公告)号：US20150371913A1

公开(公告)日：2015-12-24

申请号：US14312503

申请日：2014-06-23

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Zhefu Wang ,  Zhihong Wang ,  Hassan G. Iravani ,  Dominic J. Benvegnu ,  Ingemar Carlsson ,  Boguslaw A. Swedek ,  Wen-Chiang Tu

IPC: H01L21/66 ,  B24B37/013 ,  B24B37/04 ,  H01L21/306 ,  H01L21/67

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B37/04 ,  H01L21/3212 ,  H01L22/14

Abstract: In fabrication of an integrated circuit having a layer with a plurality of conductive interconnects, a layer of a substrate is polished to provide the layer of the integrated circuit. The layer of the substrate includes conductive lines to provide the conductive interconnects. The layer of the substrate includes a closed conductive loop formed of a conductive material in a trench. A depth of the conductive material in the trench is monitored using an inductive monitoring system and a signal is generated. Monitoring includes generating a magnetic field that intermittently passes through the closed conductive loop. A sequence of values over time is extracted from the signal, the sequence of values representing the depth of the conductive material over time.

Abstract translation: 在具有具有多个导电互连层的集成电路的制造中，抛光衬底层以提供集成电路的层。 衬底的层包括提供导电互连的导线。 衬底层包括在沟槽中由导电材料形成的闭合导电环路。 使用感应监测系统监测沟槽中导电材料的深度，并产生信号。 监测包括产生间歇地通过闭合导电回路的磁场。 从信号中提取随时间变化的值序列，表示导电材料随着时间的深度的值序列。