公开(公告)号：US20210159160A1

公开(公告)日：2021-05-27

申请号：US16886704

申请日：2020-05-28

Applicant: Applied Materials, Inc.

Inventor： Han-Wen CHEN ,  Steven VERHAVERBEKE ,  Giback PARK ,  Kyuil CHO ,  Kurtis LESCHKIES ,  Roman GOUK ,  Chintan BUCH ,  Vincent DICAPRIO ,  Bernhard STONAS ,  Jean DELMAS

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/14

Abstract: The present disclosure relates to semiconductor core assemblies and methods of forming the same. The semiconductor core assemblies described herein may be utilized to form semiconductor package assemblies, PCB assemblies, PCB spacer assemblies, chip carrier assemblies, intermediate carrier assemblies (e.g., for graphics cards), and the like. In one embodiment, a silicon substrate core is structured by direct laser patterning. One or more conductive interconnections are formed in the substrate core and one or more redistribution layers are formed on surfaces thereof. The silicon substrate core may thereafter be utilized as a core structure for a semiconductor package, PCB, PCB spacer, chip carrier, intermediate carrier, or the like.

公开(公告)号：US20200243432A1

公开(公告)日：2020-07-30

申请号：US16256809

申请日：2019-01-24

Applicant: Applied Materials, Inc.

Inventor： Han-Wen CHEN ,  Steven VERHAVERBEKE ,  Kyuil CHO ,  Prayudi LIANTO ,  Guan Huei SEE ,  Vincent DICAPRIO

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/14

Abstract: A method for producing an electrical component is disclosed using a molybdenum adhesion layer, connecting a polyimide substrate to a copper seed layer and copper plated attachment.

公开(公告)号：US20200159113A1

公开(公告)日：2020-05-21

申请号：US16192546

申请日：2018-11-15

Applicant: Applied Materials, Inc.

Inventor： Roman GOUK ,  Giback PARK ,  Kyuil CHO ,  Han-Wen CHEN ,  Chintan BUCH ,  Steven VERHAVERBEKE ,  Vincent DICAPRIO

IPC: G03F7/00 ,  G03F7/20 ,  H01L21/768

Abstract: A method and apparatus for forming a plurality of vias in panels for advanced packaging applications is disclosed, according to one embodiment. A redistribution layer is deposited on a substrate layer. The redistribution layer may be deposited using a spin coating process, a spray coating process, a drop coating process, or lamination. The redistribution layer is then micro-imprinted using a stamp inside a chamber. The redistribution layer and the stamp are then baked inside the chamber. The stamp is removed from the redistribution layer to form a plurality of vias in the redistribution layer. Excess residue built-up on the redistribution layer may be removed using a descumming process. A residual thickness layer disposed between the bottom of each of the plurality of vias and the top of the substrate layer may have thickness of less than about 1 μm.

公开(公告)号：US20190273002A1

公开(公告)日：2019-09-05

申请号：US16417124

申请日：2019-05-20

Applicant: Applied Materials, Inc.

Inventor： Roman GOUK ,  Han-Wen CHEN ,  Steven VERHAVERBEKE ,  Jean DELMAS

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/677 ,  B08B7/00 ,  H01L21/687 ,  F26B21/14 ,  C11D11/00

Abstract: Embodiments described herein generally relate to a processing chamber incorporating a small thermal mass which enable efficient temperature cycling for supercritical drying processes. The chamber generally includes a body, a liner, and an insulation element which enables the liner to exhibit a small thermal mass relative to the body. The chamber is also configured with suitable apparatus for generating and/or maintaining supercritical fluid within a processing volume of the chamber.

公开(公告)号：US20190139788A1

公开(公告)日：2019-05-09

申请号：US16171000

申请日：2018-10-25

Applicant: Applied Materials, Inc.

Inventor： Boyi FU ,  Han-Wen CHEN ,  Kyuil CHO ,  Sivapackia GANAPATHIAPPAN ,  Roman GOUK ,  Steven VERHAVERBEKE ,  Nag B. PATIBANDLA ,  Yan ZHAO ,  Hou T. NG ,  Ankit VORA ,  Daihua ZHANG

IPC: H01L21/56 ,  H01L21/67

Abstract: Aspects of the disclosure generally relate to methods of immobilizing die on a substrate. In one method one or more immobilization features are formed in a selected pattern on a substrate. A die is positioned in contact with the one or more immobilization features and the substrate. The one or more immobilization features are cured, and a mold layer is formed on top of the cured one or more immobilization features and the die so as to encapsulate the die.

公开(公告)号：US20170250094A1

公开(公告)日：2017-08-31

申请号：US15593197

申请日：2017-05-11

Applicant: Applied Materials, Inc.

Inventor： Steven VERHAVERBEKE ,  Han-Wen CHEN ,  Roman GOUK

IPC: H01L21/67 ,  B08B7/00 ,  B08B3/08 ,  H01L21/02 ,  H01L21/677

CPC classification number: H01L21/67034 ,  B08B3/08 ,  B08B7/0021 ,  H01L21/02057 ,  H01L21/02101 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/67126 ,  H01L21/67742

Abstract: Embodiments of the invention generally relate to a method of cleaning a substrate and a substrate processing apparatus that is configured to perform the method of cleaning the substrate. More specifically, embodiments of the present invention relate to a method of cleaning a substrate in a manner that reduces or eliminates the negative effects of line stiction between semiconductor device features. Other embodiments of the present invention relate to a substrate processing apparatus that allows for cleaning of the substrate in a manner that reduces or eliminates line stiction between semiconductor device features formed on the substrate.

公开(公告)号：US20170098542A1

公开(公告)日：2017-04-06

申请号：US15268180

申请日：2016-09-16

Applicant: Applied Materials, Inc.

Inventor： Roman GOUK ,  Han-Wen CHEN ,  Steven VERHAVERBEKE ,  Jean DELMAS

IPC: H01L21/02 ,  H01L21/687 ,  H01L21/67 ,  B08B3/04

CPC classification number: H01L21/02101 ,  H01L21/02057 ,  H01L21/67034 ,  H01L21/6719 ,  H01L21/68728 ,  H01L21/68785

Abstract: A substrate support apparatus is provided. The apparatus includes a circular base plate and one or more spacers disposed about a circumference of the base plate. The spacers may extend from a top surface of the base plate and a ring body may be coupled to the spacers. The ring body may be spaced from the base plate to define apertures between the base plate and the ring body. One or more support posts may be coupled to the base plate and extend therefrom. The support posts may be coupled to the base plate at positions radially inward from an inner surface of the ring body.

公开(公告)号：US20170098541A1

公开(公告)日：2017-04-06

申请号：US15268162

申请日：2016-09-16

Applicant: Applied Materials, Inc.

Inventor： Roman GOUK ,  Han-Wen CHEN ,  Steven VERHAVERBEKE ,  Jean DELMAS

IPC: H01L21/02 ,  F26B21/14 ,  B08B7/00 ,  F26B5/04

Abstract: A method for processing a substrate is disclosed. The method includes delivering a solvent to a processing chamber and delivering a substrate to the processing chamber. The amount of solvent present in the processing chamber may be configured to submerse the substrate. Liquid CO2 may be delivered to the processing chamber and the liquid CO2 may be mixed with the solvent. Additional liquid CO2 may be delivered to the processing chamber in an amount greater than a volume of the processing chamber to displace the solvent. The liquid CO2 may be phase transitioned to supercritical CO2 in the processing chamber and the substrate may be dried by isothermally depressurizing the processing chamber and exhausting gaseous CO2 from the processing chamber.

公开(公告)号：US20140144462A1

公开(公告)日：2014-05-29

申请号：US14078373

申请日：2013-11-12

Applicant: Applied Materials, Inc.

Inventor： Steven VERHAVERBEKE ,  Han-Wen CHEN ,  Roman GOUK

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/67034 ,  B08B3/08 ,  B08B7/0021 ,  H01L21/02057 ,  H01L21/02101 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/67126 ,  H01L21/67742

Abstract: Embodiments of the invention generally relate to a method of cleaning a substrate and a substrate processing apparatus that is configured to perform the method of cleaning the substrate. More specifically, embodiments of the present invention relate to a method of cleaning a substrate in a manner that reduces or eliminates the negative effects of line stiction between semiconductor device features. Other embodiments of the present invention relate to a substrate processing apparatus that allows for cleaning of the substrate in a manner that reduces or eliminates line stiction between semiconductor device features formed on the substrate.

Abstract translation: 本发明的实施例一般涉及一种清洁基板的方法和一种被配置为执行清洁基板的方法的基板处理装置。 更具体地，本发明的实施例涉及一种以减少或消除半导体器件特征之间的线状静电的负面影响的方式来清洁衬底的方法。 本发明的其他实施例涉及一种基板处理装置，其能够以减少或消除在基板上形成的半导体器件特征之间的线状静电的方式来清洁基板。