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公开(公告)号:US10705431B2
公开(公告)日:2020-07-07
申请号:US16509675
申请日:2019-07-12
Applicant: Applied Materials, Inc.
Inventor: Christopher Dennis Bencher , Joseph R. Johnson , David Markle , Mehdi Vaez-Iravani
Abstract: Embodiments of the present disclosure provide methods for producing images on substrates. The method includes providing a p-polarization beam to a first mirror cube having a first digital micromirror device (DMD), providing an s-polarization beam to a second mirror cube having a second DMD, and reflecting the p-polarization beam off the first DMD and reflecting the s-polarization beam off the second DMD such that the p-polarization beam and the s-polarization beam are reflected towards a light altering device configured to produce a plurality of superimposed images on the substrate.
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公开(公告)号:US10394130B2
公开(公告)日:2019-08-27
申请号:US15207991
申请日:2016-07-12
Applicant: Applied Materials, Inc.
Inventor: Christopher Dennis Bencher , Joseph R. Johnson , Dave Markle , Mehdi Vaez-Iravani
Abstract: The present disclosure provides a method for producing an image on a substrate. The method includes providing a single beam of light to a multiple DMD assembly, splitting the single beam of light into an s-polarization beam and a p-polarization beam, and reflecting the s-polarization beam and the p-polarization beam through the multiple DMD assembly such that the multiple DMD assembly produces a plurality of superimposed images on the substrate.
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公开(公告)号:US09823573B2
公开(公告)日:2017-11-21
申请号:US15188667
申请日:2016-06-21
Applicant: Applied Materials, Inc.
Inventor: Joseph R. Johnson , Christopher Dennis Bencher , Thomas L. Laidig
IPC: G03F7/20
CPC classification number: G03F7/70041 , G03F7/70291 , G03F7/70583
Abstract: An image correction application relating to the ability to apply maskless lithography patterns to a substrate in a manufacturing process is disclosed. The embodiments described herein relate to a software application platform which maintains the ability to correct non-uniform image patterns using time-shifted exposures of the substrate. The application exposes subsequent portions of a substrate to electromagnetic radiation at variable and alternating pulse frequencies using a time delay in order to correct interference patterns and increase exposure uniformity.
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