公开(公告)号：US11899379B2

公开(公告)日：2024-02-13

申请号：US18158293

申请日：2023-01-23

Applicant: Applied Materials, Inc.

Inventor： Uwe Hollerbach ,  Thomas L. Laidig

IPC: G03F7/20 ,  G03F7/00 ,  H01L21/027

CPC classification number: G03F7/70991 ,  G03F7/70291 ,  G03F7/70383 ,  G03F7/70508 ,  H01L21/0274

Abstract: Aspects of disclosure provide a method for attaching wiring connections to a component using both design and field measured data of the component to produce accurate wiring connections.

公开(公告)号：US10935892B2

公开(公告)日：2021-03-02

申请号：US15595497

申请日：2017-05-15

Applicant: Applied Materials, Inc.

Inventor： Tamer Coskun ,  Thomas L. Laidig ,  Jang Fung Chen

IPC: G03F7/20

Abstract: Methods and systems are provided that, in some embodiments, print and process a layer. The layer can be on a wafer or on an application panel. Thereafter, locations of the features that were actually printed and processed are measured. Based upon differences between the measured differences and designed locations for those features at least one distortion model is created. Each distortion model is inverted to create a corresponding correction model. When there are multiple sections, a distortion model and a correction model can be created for each section. Multiple correction models can be combined to create a global correction model.

公开(公告)号：US10678150B1

公开(公告)日：2020-06-09

申请号：US16192448

申请日：2018-11-15

Applicant: Applied Materials, Inc.

Inventor： Uwe Hollerbach ,  Thomas L. Laidig

IPC: G03F7/20 ,  H01L21/027

Abstract: Aspects of disclosure provide a method for attaching wiring connections to a component using both design and field measured data of the component to produce accurate wiring connections.

公开(公告)号：US10372042B2

公开(公告)日：2019-08-06

申请号：US15871302

申请日：2018-01-15

Applicant: Applied Materials, Inc.

Inventor： Thomas L. Laidig ,  Hwan J. Jeong

IPC: G03F7/20 ,  G02B26/08

Abstract: Embodiments of the present disclosure generally relate to methods and apparatus for processing one or more substrates, and more specifically to improved spatial light modulators for digital lithography systems and digital lithography methods using improved spatial light modulators. The spatial light modulator is configured such that there is a 180-degree phase shift between adjacent spatial light modulator pixels. The spatial light modulator is useful for pixel blending by forming a plurality of partially overlapping images, at least one of the plurality of partially overlapping images having at least two pixels formed by a first pair of adjacent spatial light modulator pixels having a 180-degree phase shift therebetween. The spatial light modulator results in improved resolution, depth of focus, and pixel blending.

公开(公告)号：US09927723B2

公开(公告)日：2018-03-27

申请号：US15080473

申请日：2016-03-24

Applicant: Applied Materials, Inc.

Inventor： Benjamin M. Johnston ,  Thomas L. Laidig ,  Jang Fung Chen ,  John White

IPC: G03B27/52 ,  G03B27/42 ,  G03F7/20 ,  G01B11/14

CPC classification number: G03F7/70775 ,  G01B11/14 ,  G03F7/70275 ,  G03F7/70733

Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for performing photolithography processes. In one embodiment, a system including multiple interferometers for accurately measuring the location of a substrate during operation is provided. The system may include two chucks, and the two chucks are aligned in a first direction. The interferometers are placed along the first direction to measure the location of the substrate with respect to the first direction. The reduced distance between the interferometers and the chuck improves the accuracy of the measurement of the location of the substrate. In another embodiment, mask pattern data is provided to the system, and the mask pattern data is modified based on location and position information of the substrate. By controlling the mask pattern data with the location and position information of the substrate, less positional errors of the pattern formed on the substrate can be achieved.

公开(公告)号：US12141517B2

公开(公告)日：2024-11-12

申请号：US18470717

申请日：2023-09-20

Applicant: Applied Materials, Inc.

Inventor： Aravind Inumpudi ,  Thomas L. Laidig

IPC: G06F30/30 ,  G03F1/72 ,  G03F7/00 ,  G06F30/398 ,  G06F119/18

Abstract: Embodiments described herein relate to a system, software, and a method of using the system to edit a design to be printed by a lithography system. The system and methods utilize a server of a maskless lithography device. The server includes a memory. The memory includes a virtual mask file. The virtual mask file includes cells and the cells include sub-cells that form one or more polygons. The server further includes a controller coupled to the memory. The controller is configured to receive a replacement table. The replacement table includes instructions to replace the cells of the virtual mask file. The controller is further configured to replace the cells with replacement cells according to the replacement table to create an edited virtual mask file.

公开(公告)号：US20230408807A1

公开(公告)日：2023-12-21

申请号：US17750751

申请日：2022-05-23

Applicant: Applied Materials, Inc.

Inventor： Thomas L. Laidig ,  Christopher Bencher ,  Hwan J. Jeong ,  Uwe Hollerbach

IPC: G02B26/08 ,  G02B27/30 ,  G03F7/20

CPC classification number: G02B26/0833 ,  G03F7/70258 ,  G03F7/70575 ,  G02B27/30

Abstract: A digital lithography system may adjust a wavelength of the light source to compensate for tilt errors in micromirrors while maintaining a perpendicular direction for the reflected light. Adjacent pixels may have a phase shift that is determined by an optical path difference between their respective light beams. This phase shift may be preselected to be any value by generating a corresponding wavelength at the light source based on the optical path difference. To generate a specific wavelength corresponding to the desired phase shift, the light source may produce multiple light components that have wavelengths that bracket the wavelength of the selected phase shift. The intensities of these components may then be controlled individually to produce an effect that approximates the selected phase shift on the substrate.

公开(公告)号：US10571809B1

公开(公告)日：2020-02-25

申请号：US16279875

申请日：2019-02-19

Applicant: Applied Materials, Inc.

Inventor： Christopher Dennis Bencher ,  Joseph R. Johnson ,  Thomas L. Laidig

IPC: G03F7/20 ,  G03F7/09

Abstract: Embodiments described herein provide a system, a software application, and a method of a lithography process, to write full tone portions and grey tone portions in a single pass. One embodiment of the system includes a controller configured to provide mask pattern data to a lithography system. The controller is configured to divide a plurality of spatial light modulator pixels temporally by grey tone shots and full tone shots of a multiplicity of shots, and the controller is configured to vary a second intensity of a light beam generated by a light source and vary a first intensity of the light beam generated by the light source of each image projection system at the full tone shots.

公开(公告)号：US10289003B2

公开(公告)日：2019-05-14

申请号：US15253379

申请日：2016-08-31

Applicant: Applied Materials, Inc.

Inventor： Thomas L. Laidig ,  Joseph R. Johnson ,  Christopher Dennis Bencher

IPC: G03F7/20

Abstract: An image correction application relating to the ability to apply maskless lithography patterns to a substrate in a manufacturing process is disclosed. The embodiments described herein relate to a software application platform, which corrects non-uniform image patterns on a substrate. The application platform method includes in a digital micromirror device (DMD) installed in an image projection system, the DMD having a plurality of columns, each column having a plurality of mirrors, disabling at least one entire column of the plurality of columns, exposing a first portion of the substrate to a first shot of electromagnetic radiation, exposing a second portion of the substrate to a second shot of electromagnetic radiation, and iteratively translating the substrate a step size and exposing another portion of the substrate to another shot of electromagnetic radiation until the substrate has been completely exposed to shots of electromagnetic radiation.

公开(公告)号：US10114297B2

公开(公告)日：2018-10-30

申请号：US15629183

申请日：2017-06-21

Applicant: Applied Materials, Inc.

Inventor： Thomas L. Laidig ,  Jeffrey Kaskey

IPC: G03B27/44 ,  G03B27/54 ,  G03F7/20

Abstract: Embodiments of the present disclosure generally relate to systems and methods for performing photolithography processes. In one embodiment, a photolithography system includes a plurality of image projection systems each having an extendable lens, and a plate having a plurality of openings. Each extendable lens is configured to be extended through a corresponding opening of the plurality of openings during operation. The plate includes one or more elements disposed adjacent each opening and each lens includes one or more elements formed thereon. The one or more elements formed on the plate and the one or more elements formed on the lens are utilized to measure one or more distances between the lens and the plate. Any deviation of the measured distance from a reference distance indicates that the lens has been shifted. Measures to compensate for the shifting of the lens will be performed.