-
公开(公告)号:US20240035967A1
公开(公告)日:2024-02-01
申请号:US18361586
申请日:2023-07-28
Applicant: Applied Materials, Inc.
Inventor: Joseph R. Johnson , Ang Li , Jean Marc Fan Chung Tsang Min Ching , Mehdi Vaez-Iravani
IPC: G01N21/47
CPC classification number: G01N21/4795
Abstract: An imaging system for capturing spatial-omic images of biological tissue samples may include an imaging chamber configured to secure a biological tissue sample placed in the imaging system; a Time Delay and Integration (TDI) imager comprising at least one scan line; a light source configured to illuminate an area on the biological tissue sample that is being captured by the TDI imager; and a controller configured to cause the TDI imager to scan the biological tissue sample using one or more TDI scans of the biological tissue sample.
-
公开(公告)号:US20230167933A1
公开(公告)日:2023-06-01
申请号:US17538407
申请日:2021-11-30
Applicant: Applied Materials, Inc.
Inventor: Joseph R. Johnson
CPC classification number: F16L41/03 , B01L3/502715 , B01L2200/027 , B01L2200/0647 , B01L2200/16 , B01L2300/0867 , B01L2300/0877 , B01L2400/0633
Abstract: Exemplary spatial genomics systems may include a flow cell and a fluid manifold. The flow cell may define an open interior, a fluid inlet to a first end of the open interior, and a fluid outlet to a second end of the open interior opposite the first end. The fluid manifold may include a body defining a plurality of fluid inlet lumens, a fluid outlet lumen, and a fluid waste lumen. Each of the plurality of fluid inlet lumens may be fluidly coupled with the fluid outlet lumen. The fluid outlet lumen may be fluidly coupled with the flow cell. The fluid manifold may include a plurality of fluid switches. Each of the plurality of fluid switches may be fluidly coupled with a respective one of the plurality of fluid inlet lumens. The fluid waste lumen may be fluidly coupled with the fluid outlet of the flow cell.
-
公开(公告)号:US10571809B1
公开(公告)日:2020-02-25
申请号:US16279875
申请日:2019-02-19
Applicant: Applied Materials, Inc.
Inventor: Christopher Dennis Bencher , Joseph R. Johnson , Thomas L. Laidig
Abstract: Embodiments described herein provide a system, a software application, and a method of a lithography process, to write full tone portions and grey tone portions in a single pass. One embodiment of the system includes a controller configured to provide mask pattern data to a lithography system. The controller is configured to divide a plurality of spatial light modulator pixels temporally by grey tone shots and full tone shots of a multiplicity of shots, and the controller is configured to vary a second intensity of a light beam generated by a light source and vary a first intensity of the light beam generated by the light source of each image projection system at the full tone shots.
-
公开(公告)号:US10289003B2
公开(公告)日:2019-05-14
申请号:US15253379
申请日:2016-08-31
Applicant: Applied Materials, Inc.
Inventor: Thomas L. Laidig , Joseph R. Johnson , Christopher Dennis Bencher
IPC: G03F7/20
Abstract: An image correction application relating to the ability to apply maskless lithography patterns to a substrate in a manufacturing process is disclosed. The embodiments described herein relate to a software application platform, which corrects non-uniform image patterns on a substrate. The application platform method includes in a digital micromirror device (DMD) installed in an image projection system, the DMD having a plurality of columns, each column having a plurality of mirrors, disabling at least one entire column of the plurality of columns, exposing a first portion of the substrate to a first shot of electromagnetic radiation, exposing a second portion of the substrate to a second shot of electromagnetic radiation, and iteratively translating the substrate a step size and exposing another portion of the substrate to another shot of electromagnetic radiation until the substrate has been completely exposed to shots of electromagnetic radiation.
-
公开(公告)号:US11691872B2
公开(公告)日:2023-07-04
申请号:US17713410
申请日:2022-04-05
Applicant: Applied Materials, Inc.
Inventor: Philip Allan Kraus , Joseph R. Johnson
IPC: B81C1/00 , H01L21/02 , G01N33/487 , G01N27/49 , H01L21/302
CPC classification number: B81C1/00087 , G01N27/49 , G01N33/48721 , H01L21/0228 , H01L21/302
Abstract: Methods are provided for manufacturing well-controlled, solid-state nanopores and arrays thereof. In one aspect, methods for manufacturing nanopores and arrays thereof exploit a physical seam. One or more etch pits are formed in a topside of a substrate and one or more trenches, which align with the one or more etch pits, are formed in a backside of the substrate. An opening is formed between the one or more etch pits and the one or more trenches. A dielectric material is then formed over the substrate to fill the opening. Contacts are then disposed on the topside and the backside of the substrate and a voltage is applied from the topside to the backside, or vice versa, through the dielectric material to form a nanopore. In another aspect, the nanopore is formed at or near the center of the opening at a seam, which is formed in the dielectric material.
-
公开(公告)号:US11536708B2
公开(公告)日:2022-12-27
申请号:US16738629
申请日:2020-01-09
Applicant: Applied Materials, Inc.
Inventor: Mark J. Saly , Keenan Navarre Woods , Joseph R. Johnson , Bhaskar Jyoti Bhuyan , William J. Durand , Michael Chudzik , Raghav Sreenivasan , Roger Quon
IPC: B82Y15/00 , B82Y40/00 , G01N33/487 , B01D67/00 , C12Q1/6869
Abstract: Embodiments of the present disclosure provide dual pore sensors and methods for producing these dual pore sensors. The method includes forming a film stack, where the film stack contains two silicon layers and two membrane layers, and then etching the film stack to produce a channel extending therethrough and having two reservoirs and two nanopores. The method also includes depositing a oxide layer on inner surfaces of the reservoirs and nanopores, depositing a dielectric layer on the oxide layer, and forming a metal contact extending through a portion of the stack. The method further includes etching the dielectric layers to form wells, etching the first silicon layer to reveal the protective oxide layer deposited on the inner surfaces of a reservoir, and etching the protective oxide layer deposited on the inner surfaces of the reservoirs and the nanopores.
-
公开(公告)号:US10921714B2
公开(公告)日:2021-02-16
申请号:US16895971
申请日:2020-06-08
Applicant: Applied Materials, Inc.
Inventor: Joseph R. Johnson , Thomas L. Laidig , Christopher Dennis Bencher
Abstract: Embodiments of the present disclosure generally provide improved photolithography systems and methods using a digital micromirror device (DMD). The DMD comprises columns and rows of micromirrors disposed opposite a substrate. Light beams reflect off the micromirrors onto the substrate, resulting in a patterned substrate. Certain subsets of the columns and rows of micromirrors may be positioned to the “off” position, such that they dump light, in order to correct for uniformity errors, i.e., features larger than desired, in the patterned substrate. Similarly, certain subsets of the columns and rows of micromirrors may be defaulted to the “off” position and selectively allowed to return to their programmed position in order to correct for uniformity errors, i.e., features smaller than desired, in the patterned substrate.
-
8.
公开(公告)号:US10761430B2
公开(公告)日:2020-09-01
申请号:US16512975
申请日:2019-07-16
Applicant: Applied Materials, Inc.
Inventor: Christopher Dennis Bencher , Joseph R. Johnson
IPC: G03F7/20
Abstract: The embodiments described herein relate to a software application platform, which enhances image patterns resolution on a substrate. The application platform method includes running an algorithm to provide different target polygons for forming a pattern on a target. A minimum feature size which may be formed by a DMD is determined. For each target polygons smaller than the minimum feature size determining to line bias or shot bias the one or more target polygons to achieve an acceptable exposure contrast at the target polygon boundary. The one or more target polygons smaller than the minimum feature size are biased to form a digitized pattern on the substrate. Electromagnetic radiation is delivered to reflect off of a first mirror of the DMD when the centroid for the first mirror is within the one or more target polygons.
-
公开(公告)号:US09791786B1
公开(公告)日:2017-10-17
申请号:US15188193
申请日:2016-06-21
Applicant: Applied Materials, Inc.
Inventor: Joseph R. Johnson , Christopher Dennis Bencher , Thomas L. Laidig
CPC classification number: G03F1/38 , G03F1/70 , G03F7/70291 , G03F7/70433 , G03F7/70508
Abstract: Embodiments disclosed herein relate to an exposure pattern alteration software application which manipulates exposure polygons having lines with angles substantially close to angles of symmetry of a hex close pack arrangement, which suffer from long jogs. Long jogs present themselves as high edge placement error regions. As such, the exposure pattern alteration software application provides for line wave reduction by serrating polygon edges at affected angles to reduce edge placement errors during maskless lithography patterning in a manufacturing process.
-
公开(公告)号:US09513052B2
公开(公告)日:2016-12-06
申请号:US15130751
申请日:2016-04-15
Applicant: Applied Materials, Inc.
Inventor: Joseph R. Johnson , Joseph M. Ranish
CPC classification number: F26B3/30 , F21K9/20 , H01L21/67115
Abstract: Apparatus for providing energy to a process chamber are provided herein. In one embodiment, the apparatus include a supporting substrate, a first plurality of solid state light sources disposed on a first surface of the supporting substrate, and a second plurality of solid state light sources disposed on the top surface of the supporting substrate, wherein the first and second plurality of solid state light sources are aligned and electrically isolated from each other, and the first plurality of solid state light sources is in physical contact with the second plurality of solid state light sources.
Abstract translation: 本文提供了用于向处理室提供能量的设备。 在一个实施例中,该装置包括支撑衬底,设置在支撑衬底的第一表面上的第一多个固态光源和设置在支撑衬底的顶表面上的第二多个固态光源,其中, 第一和第二多个固态光源彼此对准并电隔离,并且第一多个固态光源与第二多个固态光源物理接触。
-
-
-
-
-
-
-
-
-