公开(公告)号：US20220242706A1

公开(公告)日：2022-08-04

申请号：US17165427

申请日：2021-02-02

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Srinivasa Rao YEDLA

IPC: B66F3/36 ,  B66F3/24 ,  B66F13/00

Abstract: A method and apparatus for lifting a process station from a processing module is described herein. The apparatus includes a lift assembly disposed on the processing module, a lift cage, and one or more guide pins. The lift assembly is disposed to be capable of reaching each of the process stations disposed within the processing module. The lift assembly is used for replacement and maintenance of the process stations and further enables the automated removal and placement of the process stations within the processing module. Maintenance methods enabled by the lift assembly are additionally disclosed herein.

公开(公告)号：US20220235453A1

公开(公告)日：2022-07-28

申请号：US17159689

申请日：2021-01-27

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra SAVANDAIAH ,  Nagabhushana NANJUNDAPPA ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY

IPC: C23C14/56 ,  H01L21/67 ,  H01L21/687 ,  C23C14/34 ,  C23C14/50 ,  C23C14/35 ,  H01J37/32 ,  H01J37/34

Abstract: A substrate processing module includes a transfer chamber, an array of processing stations, at least one shutter disk assembly, and a substrate handling device. The array of processing stations is disposed within a transfer volume, and each of the processing stations within the array are configured to selectively process at least one substrate. The shutter disk assembly includes an actuator and a disk blade configured to support a shutter disk coupled thereto. The shutter disk is rotatable between a first position and a second position. In the first position, the disk blade is disposed between two of the plurality of processing stations. In the second position, the disk blade is located under one of the processing stations within the array. The substrate handling device is disposed centrally within the transfer volume and includes a plurality of arms each configured to support and position a substrate.

公开(公告)号：US20220223367A1

公开(公告)日：2022-07-14

申请号：US17147262

申请日：2021-01-12

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra SAVANDAIAH ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY ,  Nitin Bharadwaj SATYAVOLU

IPC: H01J37/16 ,  H01J37/32 ,  C23C16/455

Abstract: Aspects of the present disclosure relate to systems and apparatuses for a substrate processing assembly with a low processing volume. In disclosed embodiments, a processing volume may include a processing space adjacent to a substrate being processed on a substrate support as well as a volume of the processing chamber surrounding and below the substrate support. In some embodiments, the total processing volume is 15 liters or less in certain embodiments, resulting in lower gas usage and faster processing times than conventional approaches. In some embodiments, the distance between the substrate and a target, electrode, chamber lid, or showerhead face is 35 mm or less in certain embodiments. In certain embodiments, the processing chamber has a dedicated pump for pumping the chamber to a processing pressure as well as evacuating the chamber after processing of the substrate.

公开(公告)号：US20220216079A1

公开(公告)日：2022-07-07

申请号：US17143712

申请日：2021-01-07

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Thomas BREZOCZKY ,  Kirankumar Neelasandra SAVANDAIAH ,  Anubhav SRIVASTAVA

IPC: H01L21/67 ,  H01L21/683

Abstract: Embodiments described herein relate to methods and apparatus for detecting and/or monitoring, e.g., abnormalities in wafer transfer and handling. In an embodiment, a method for wafer dechucking verification is provided. The method includes initiating a wafer transfer operation to transfer a wafer between components of a semiconductor processing system, the semiconductor processing system comprising a motor coupled to a lift pin, the motor configured to adjust a height of the lift pin above a pedestal, the lift pin for raising or lowering the wafer. The method further includes measuring one or more first parameters during the wafer transfer operation, comparing the one or more first parameters to one or more first pre-determined parameter ranges, and changing a force applied to the lift pin based on the one or more first parameters. Apparatus for wafer dechucking verification and non-transitory computer-readable mediums storing instructions for wafer dechucking verification are also provided

公开(公告)号：US20220093439A1

公开(公告)日：2022-03-24

申请号：US17024802

申请日：2020-09-18

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Srinivasa Rao YEDLA ,  Nitin Bharadwaj SATYAVOLU ,  Hari Prasath RAJENDRAN ,  Lakshmikanth Krishnamurthy SHIRAHATTI ,  Thomas BREZOCZKY

IPC: H01L21/683 ,  H01L21/67

Abstract: In one example, an electrostatic chuck comprises a chuck body having a top surface configured to support a substrate and a bottom surface opposite the top surface. The chuck body comprises one or more chucking electrodes, and one or more heating elements. The chuck body further comprises first terminals disposed on the bottom surface of the chuck body and coupled with the one or more heating elements, second terminals disposed on the bottom surface of the chuck body and coupled with the one or more chucking electrodes, and third terminals disposed on the bottom first surface of the chuck body and coupled with the one or more chucking electrodes.

公开(公告)号：US20250163568A1

公开(公告)日：2025-05-22

申请号：US18517404

申请日：2023-11-22

Applicant: Applied Materials, Inc.

Inventor： Thomas BREZOCZKY ,  Kirankumar Neelasandra SAVANDAIAH ,  Arun RENGARAJ ,  Sivakumar RAMALINGAM

IPC: C23C14/56 ,  C23C14/54

Abstract: The present disclosure provides shutter disk systems. The shutter disk systems include a body including a plurality of faces, a base, and a top. The body includes an interior volume. The interior volume includes an interlock region configured to receive at least one shutter disk. The interior volume includes an operation region adjacent to the interlock region, where the operational region is separate from the interlock region by an isolator plate. A shutter disk stack is disposed in the operational region. The shutter disk stack includes at least a storage rack configured to receive two or more shutter disks. A first door is disposed on a face of the plurality of faces proximal to the operational region. A second door is disposed proximal to the interlock region. A third door is disposed proximal to a portion of the interlock region and a portion of the operational region.

公开(公告)号：US20250079137A1

公开(公告)日：2025-03-06

申请号：US18241840

申请日：2023-09-01

Applicant: Applied Materials, Inc.

Inventor： Thomas BREZOCZKY ,  Kirankumar Neelasandra SAVANDAIAH ,  Srinivasan MANIVANNAN ,  Arun RENGARAJ

IPC: H01J37/32

Abstract: A substrate support assembly includes a substrate support that is moveable between a raised position, a lowered position below the raised position, and an intermediate position between the raised and lowered positions. A lift pin is disposed in a hole through the substrate support, and is movable vertically with respect to the substrate support. In use, the substrate support assembly transitions between first and second configurations. In the first configuration, the substrate support and the lift pin are coupled such that the lift pin and the substrate support move simultaneously while the substrate support moves between the lowered position and the intermediate position. In the second configuration, the substrate support and the lift pin are decoupled such that the lift pin remains stationary while the substrate support moves between the intermediate position and the raised position.

公开(公告)号：US20250069914A1

公开(公告)日：2025-02-27

申请号：US18811897

申请日：2024-08-22

Applicant: Applied Materials, Inc.

Inventor： Thomas BREZOCZKY ,  Punnati KRUSHNA REDDY ,  Azhar ALI M.A. ,  Kirankumar Neelasandra SAVANDAIAH ,  Lakshmikanth Krishnamurthy SHIRAHATTI ,  Dhritiman Subha KASHYAP

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

Abstract: Degas stations for degassing substrates that are conveyed through a substrate processing system on a magnetically levitated carrier and related methods are provided. The degas station includes a housing, a magnetic levitation system coupled to the housing configured to levitate and move a carrier within the housing, a first heater assembly and a second heater assembly. The first heater assembly is disposed in the housing. The first heater assembly includes a first support, a first reflector disposed within the housing by the first support, and a first heat source coupled to reflector. The second heater assembly is disposed in the housing above the first heater assembly. The second heater assembly includes a second support, a second reflector disposed within the housing by the second support, and a second heat source coupled to the second reflector. At least one substrate support member is disposed between the first heater assembly and the second heater assembly.

公开(公告)号：US20240371678A1

公开(公告)日：2024-11-07

申请号：US18772590

申请日：2024-07-15

Applicant: Applied Materials, Inc.

Inventor： Anubhav SRIVASTAVA ,  Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Nitin Bharadwaj SATYAVOLU

IPC: H01L21/687

Abstract: Embodiments of the present disclosure generally relate to lift pins and to apparatus for controlling lift pin movement. In an embodiment, an apparatus for positioning a substrate in a chamber is provided. The apparatus includes a chamber component, a lift pin having a top surface for supporting the substrate and a lift pin shaft and a stopper. The apparatus further includes a compressible element positioned between the chamber component and the stopper, the compressible element further positioned around the lift pin shaft, the lift pin being moveable relative to a substrate transfer plane by movement of a substrate support in contact with the compressible element.

公开(公告)号：US20240332046A1

公开(公告)日：2024-10-03

申请号：US18585505

申请日：2024-02-23

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra SAVANDAIAH ,  Nitin Bharadwaj SATYAVOLU ,  Srinivasa Rao YEDLA ,  Bhaskar PRASAD ,  Thomas BREZOCZKY

IPC: H01L21/67 ,  C23C14/35 ,  C23C14/50 ,  H01J37/32 ,  H01J37/34

CPC classification number: H01L21/67126 ,  C23C14/35 ,  C23C14/50 ,  H01J37/32513 ,  H01J37/32715 ,  H01J37/3405 ,  H01J37/3426 ,  H01J2237/2007 ,  H01J2237/332 ,  H01L21/67167 ,  H01L21/67207

Abstract: A method and apparatus for substrate processing and a cluster tool including a transfer chamber assembly and a plurality of processing assemblies. Processing chamber volumes are sealed from the transfer chamber volume using a support chuck on which a substrate is disposed. A seal ring assembly is coupled to the support chuck. The seal ring assembly includes an inner assembly, an assembly bellows circumscribing the inner assembly, and a bellows disposed between the inner and outer platform. An inner ring is disposed between inner assembly of the seal ring assembly and the bottom surface of the support chuck. An outer ring disposed between the seal ring assembly and the lower sealing surface of the process chamber wall. The support chuck is raised to form an isolation seal between the processing chamber volume and the transfer chamber volume using the bellows, the inner ring, and the outer ring.