Surface topography measurement apparatus and method

    公开(公告)号:US11422096B2

    公开(公告)日:2022-08-23

    申请号:US17106555

    申请日:2020-11-30

    Abstract: Apparatus and methods for measuring surface topography are described. The analysis apparatus and methods detect light reflected from the reflective backside of a cantilever assembly including a tip, calculate a background level (BGL) value obtained from an optical scan of a reference sample using a power spectral density (PSD) value obtained from a topographical scan of a reference sample to generate a correlational coefficient between the BGL and the PSD values. The correlational coefficient between the BGL and PSD values is used to measure the BGL value of additional EUV mask blanks by a topographical scan of the EUV mask blanks using the same tip mounted to the cantilever.

    EUV mask blanks and methods of manufacture

    公开(公告)号:US11385536B2

    公开(公告)日:2022-07-12

    申请号:US16944556

    申请日:2020-07-31

    Abstract: An extreme ultraviolet reflective element comprising a multilayer stack of absorber layers on a multilayer stack of reflective layers. The element comprises spacing layer and phase tuning layer. Methods of manufacturing extreme ultraviolet reflective elements and lithography systems including extreme ultraviolet reflective elements are also described.

    PHYSICAL VAPOR DEPOSITION SYSTEM AND PROCESSES

    公开(公告)号:US20220107558A1

    公开(公告)日:2022-04-07

    申请号:US17552513

    申请日:2021-12-16

    Abstract: A physical vapor deposition (PVD) chamber and a method of operation thereof are disclosed. Chambers and methods are described that provide a chamber comprising an upper shield with two holes that are positioned to permit alternate sputtering from two targets. A process for improving reflectivity from a multilayer stack is also disclosed.

    Physical vapor deposition system and processes

    公开(公告)号:US11237473B2

    公开(公告)日:2022-02-01

    申请号:US16801642

    申请日:2020-02-26

    Abstract: A physical vapor deposition (PVD) chamber and a method of operation thereof are disclosed. Chambers and methods are described that provide a chamber comprising an upper shield with two holes that are positioned to permit alternate sputtering from two targets. A process for improving reflectivity from a multilayer stack is also disclosed.

    Physical Vapor Deposition Target Assembly
    40.
    发明申请

    公开(公告)号:US20200241409A1

    公开(公告)日:2020-07-30

    申请号:US16750586

    申请日:2020-01-23

    Abstract: Physical vapor deposition target assemblies, PVD chambers including target assemblies and methods of manufacturing EUV mask blanks using such target assemblies are disclosed. The target assembly includes a target shield adjacent the target and surrounding the peripheral edges of the target, the target shield comprising an insulating material and a non-insulating outer peripheral fixture to secure the target shield to the assembly.

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