Culture Structure, Culture Method and Culture Chip

    公开(公告)号:US20240352394A1

    公开(公告)日:2024-10-24

    申请号:US18038992

    申请日:2022-06-29

    CPC classification number: C12M27/16 C12M23/12 C12M23/16 C12M23/38

    Abstract: A culture structure, a culture method and a culture chip are provided. The culture structure includes a culture plate and a vibration structure provided on the culture plate; the culture plate includes a plurality of accommodating structures configured to accommodate culture solution; the vibration structure includes a vibration signal generating structure and a plurality of vibration members; the vibration signal generating structure is configured to generate a vibration signal; the plurality of vibration members are connected to the vibration signal generating structure and configured to drive the culture solution in the plurality of accommodating structures to move according to the vibration signal.

    CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD

    公开(公告)号:US20240351026A1

    公开(公告)日:2024-10-24

    申请号:US18039220

    申请日:2022-03-25

    Abstract: A chip packaging structure and a chip packaging method, the structure including: a sample substrate with through holes; first and second cover plates on opposite sides of the sample substrate; and at least one pair of a sample inlet and a sample outlet, each pair of the sample inlet and the sample outlet is in one or both of the first cover plate and the second cover plate, a flow path is between each pair of the sample inlet and the sample outlet, a first flow channel structure is on a surface of the first cover plate opposite to the sample substrate, a second flow channel structure is on a surface of the second cover plate opposite to the sample substrate, and the first flow channel structure and the second flow channel structure are connected with the through holes, to form a continuous channel corresponding to the flow path.

    ACTIVE PIXEL SENSOR AND FLAT PANEL DETECTOR

    公开(公告)号:US20220229194A1

    公开(公告)日:2022-07-21

    申请号:US17488259

    申请日:2021-09-28

    Abstract: The present disclosure provides an active pixel sensor and a flat panel detector. The active pixel sensor includes: a light sensing device configured to convert light sensed by the light sensing device into charges and supply the charges to a floating diffusion node; an amplification sub-circuit configured to amplify a signal according to a potential at the floating diffusion node and output the amplified signal through the output terminal; an adjustment sub-circuit configured to adjust, in response to a first control signal, a conversion gain from an amount of the light sensed by the light sensing device to the potential at the floating diffusion node; and a read sub-circuit configured to transmit a voltage of the input terminal of the read sub-circuit to the output terminal of the read sub-circuit according to a scan signal provided by the scan line.

    DIGITAL IMMUNOCHIP AND MANUFACTURE METHOD OF THE SAME

    公开(公告)号:US20220163516A1

    公开(公告)日:2022-05-26

    申请号:US17355338

    申请日:2021-06-23

    Abstract: The present disclosure provides a digital immunochip and a manufacture method thereof. The digital immunochip includes a first substrate and a second substrate which are opposite to each other. The first substrate includes: a first base substrate; at least one driving electrode on the first base substrate and configured to drive an object to be detected to move; a dielectric layer on a side of the at least one driving electrode away from the first base substrate and covering the at least one driving electrode; and a first hydrophobic layer on a side of the dielectric layer away from the first base substrate. The second substrate includes: a second base substrate; and an immunoassay substance on a side of the second base substrate proximal to the first hydrophobic layer of the first substrate and including an antigen or an antibody.

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