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公开(公告)号:US20240352394A1
公开(公告)日:2024-10-24
申请号:US18038992
申请日:2022-06-29
Applicant: BOE Technology Group Co., Ltd.
Inventor: Shicai WANG , Ding DING
Abstract: A culture structure, a culture method and a culture chip are provided. The culture structure includes a culture plate and a vibration structure provided on the culture plate; the culture plate includes a plurality of accommodating structures configured to accommodate culture solution; the vibration structure includes a vibration signal generating structure and a plurality of vibration members; the vibration signal generating structure is configured to generate a vibration signal; the plurality of vibration members are connected to the vibration signal generating structure and configured to drive the culture solution in the plurality of accommodating structures to move according to the vibration signal.
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公开(公告)号:US20240351026A1
公开(公告)日:2024-10-24
申请号:US18039220
申请日:2022-03-25
Inventor: Xiangguo MA , Zhukai LIU , Ding DING , Lin DENG
IPC: B01L3/00
CPC classification number: B01L3/502715 , B01L3/5025 , B01L2200/027 , B01L2300/0829
Abstract: A chip packaging structure and a chip packaging method, the structure including: a sample substrate with through holes; first and second cover plates on opposite sides of the sample substrate; and at least one pair of a sample inlet and a sample outlet, each pair of the sample inlet and the sample outlet is in one or both of the first cover plate and the second cover plate, a flow path is between each pair of the sample inlet and the sample outlet, a first flow channel structure is on a surface of the first cover plate opposite to the sample substrate, a second flow channel structure is on a surface of the second cover plate opposite to the sample substrate, and the first flow channel structure and the second flow channel structure are connected with the through holes, to form a continuous channel corresponding to the flow path.
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公开(公告)号:US20240170505A1
公开(公告)日:2024-05-23
申请号:US17777422
申请日:2021-05-31
Inventor: Fanli MENG , Zeyuan LI , Jiangbo CHEN , Ding DING
IPC: H01L27/144 , H01L23/31 , H01L27/092 , H01L27/12
CPC classification number: H01L27/1443 , H01L23/3171 , H01L27/0922 , H01L27/1259
Abstract: The present disclosure relates to an X-RAY detector including a base substrate and a plurality of detection units arranged on the base substrate. Each detection unit includes a light conversion element and a switching transistor, the light conversion element is configured to convert an optical signal into an electrical signal, and the switching transistor is configured to output the electrical signal to a reading signal line. Each detection unit further includes a radiation shielding structure located at a light-entering side of the detection unit, and an orthogonal projection of the radiation shielding structure onto the base substrate fully covers an orthogonal projection of the switching transistor onto the base substrate. The present disclosure further relates to a method for forming the X-RAY detector.
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公开(公告)号:US20220229194A1
公开(公告)日:2022-07-21
申请号:US17488259
申请日:2021-09-28
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Jiangbo CHEN , Fanli MENG , Zeyuan LI , Yao LU , Tuo SUN , Yanzhao LI , Ding DING
IPC: G01T1/20 , H04N5/32 , H04N5/378 , H01L27/146
Abstract: The present disclosure provides an active pixel sensor and a flat panel detector. The active pixel sensor includes: a light sensing device configured to convert light sensed by the light sensing device into charges and supply the charges to a floating diffusion node; an amplification sub-circuit configured to amplify a signal according to a potential at the floating diffusion node and output the amplified signal through the output terminal; an adjustment sub-circuit configured to adjust, in response to a first control signal, a conversion gain from an amount of the light sensed by the light sensing device to the potential at the floating diffusion node; and a read sub-circuit configured to transmit a voltage of the input terminal of the read sub-circuit to the output terminal of the read sub-circuit according to a scan signal provided by the scan line.
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公开(公告)号:US20220163516A1
公开(公告)日:2022-05-26
申请号:US17355338
申请日:2021-06-23
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Haonan LIU , Yudan YIN , Ding DING
IPC: G01N33/543 , B01L3/00
Abstract: The present disclosure provides a digital immunochip and a manufacture method thereof. The digital immunochip includes a first substrate and a second substrate which are opposite to each other. The first substrate includes: a first base substrate; at least one driving electrode on the first base substrate and configured to drive an object to be detected to move; a dielectric layer on a side of the at least one driving electrode away from the first base substrate and covering the at least one driving electrode; and a first hydrophobic layer on a side of the dielectric layer away from the first base substrate. The second substrate includes: a second base substrate; and an immunoassay substance on a side of the second base substrate proximal to the first hydrophobic layer of the first substrate and including an antigen or an antibody.
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