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公开(公告)号:US11249397B2
公开(公告)日:2022-02-15
申请号:US16692838
申请日:2019-11-22
摘要: A method of forming a cured layer on a substrate can include applying on the exterior surface of the substrate a first liquid film and subjecting the first liquid film to actinic radiation in at least one first region of the film. The actinic radiated region can modify the substrate surface such that the drop spreading of a region not subjected to actinic radiation is larger than the drop spreading in a region subjected to actinic radiation.
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公开(公告)号:US20200174362A1
公开(公告)日:2020-06-04
申请号:US16209746
申请日:2018-12-04
发明人: Niyaz Khusnatdinov
摘要: A method of controlling a control apparatus for use with a fluid dispenser having a plurality of nozzles includes obtaining, dividing, and substituting. A drop pattern is obtained as data for use in dispensing drops onto a substrate from the plurality of nozzles of the fluid dispenser. The obtained drop pattern is divided into a plurality of drop patterns based on a distance between drops of the obtained drop pattern. The plurality of drop patterns are substituted in place of the obtained drop pattern to dispense the drops onto the substrate from the fluid dispenser.
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公开(公告)号:US20200033720A1
公开(公告)日:2020-01-30
申请号:US16046810
申请日:2018-07-26
IPC分类号: G03F7/00
摘要: An apparatus and method configured to stabilize imprint head temperature. The apparatus and method includes an imprinting apparatus including, a mount attached to a fixed surface, a movable plate movable relative to the mount, at least one electromagnetic actuator mounted between the movable plate and the mount, wherein an electrical current is applied to the at least one electromagnetic actuator for controlling movement of the moveable plate, and wherein a root-mean-square of the electrical current applied to the at least one electromagnetic actuator in an idle state is equal to a root-mean-square of the electrical current applied to the at least one electromagnetic actuator during a continuous imprinting state.
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公开(公告)号:US20200033719A1
公开(公告)日:2020-01-30
申请号:US16045401
申请日:2018-07-25
摘要: A process, system, and method of manufacturing an article on a substrate having a fluid control feature. The fluid control feature may include at least one depressed region formed along an edge of an imprint field. Formable material is deposited in the imprint field of the substrate. A template is moved such that the template comes into contact with the formable material in the imprint field. While the template comes into contact with the formable material, the formable material may flow into the fluid control feature.
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公开(公告)号:US10304690B2
公开(公告)日:2019-05-28
申请号:US15466662
申请日:2017-03-22
IPC分类号: G03F7/00 , H01L21/02 , B29C59/02 , H01L21/3105 , B29L31/34
摘要: A method of can be used to generating a fluid droplet pattern for an imprint lithography process. A fluid dispense head can include a set of fluid dispense ports, wherein the fluid dispense ports are in a fixed arrangement. The method can include rotating the set of the fluid dispense ports to a rotation angle to change a fluid droplet pitch in a first direction; moving a substrate and the set of the fluid dispense ports relative to each other in a second direction substantially perpendicular to the first direction; and dispensing fluid droplets onto the substrate while moving the substrate and the set of the fluid dispense ports relative to each other. The method can be used in the formation of an electronic component within or over a semiconductor substrate. The apparatus can be configured to carry out the methods as described herein.
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公开(公告)号:US10131134B2
公开(公告)日:2018-11-20
申请号:US15000877
申请日:2016-01-19
发明人: Niyaz Khusnatdinov
摘要: Apparatus, systems and methods that use alpha-ionizers to discharge electrostatic charge accumulated on the working surfaces of imprint lithography templates and/or substrates.
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公开(公告)号:US10095106B2
公开(公告)日:2018-10-09
申请号:US15418952
申请日:2017-01-30
摘要: A nanoimprint lithography method to remove uncured pretreatment composition from an imprinted nanoimprint lithography substrate. The method includes disposing a pretreatment composition on a nanoimprint lithography substrate to form a pretreatment coating and disposing discrete portions of imprint resist on the pretreatment coating, each discrete portion of the imprint resist covering a target area of the nanoimprint lithography substrate. A composite polymerizable coating is formed on the nanoimprint lithography substrate as each discrete portion of the imprint resist spreads beyond its target area, and the composite polymerizable coating is contacted with a nanoimprint lithography template. The composite polymerizable coating is polymerized to yield a composite polymeric layer and an uncured portion of the pretreatment coating on the nanoimprint lithography substrate, and the uncured portion of the pretreatment coating is removed from the nanoimprint lithography substrate.
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公开(公告)号:US20180275511A1
公开(公告)日:2018-09-27
申请号:US15989622
申请日:2018-05-25
发明人: Timothy Stachowiak , Weijun Liu , Fen Wan , Gary Doyle , Niyaz Khusnatdinov
CPC分类号: G03F7/0002 , B29C59/02 , B29C59/026 , B29C2059/023 , C09K13/00
摘要: A nanoimprint lithography method includes contacting a composite polymerizable coating formed from a pretreatment composition and an imprint resist with a nanoimprint lithography template defining recesses. The composite polymerizable coating is polymerized to yield a composite polymeric layer defining a pre-etch plurality of protrusions corresponding to the recesses of the nanoimprint lithography template. The nanoimprint lithography template is separated from the composite polymeric layer. At least one of the pre-etch plurality of protrusions corresponds to a boundary between two of the discrete portions of the imprint resist, and the pre-etch plurality of protrusions have a variation in pre-etch height of ±10% of a pre-etch average height. The pre-etch plurality of protrusions is etched to yield a post-etch plurality of protrusions having a variation in post-etch height of ±10% of a post-etch average height, and the pre-etch average height exceeds the post-etch average height.
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公开(公告)号:US20170285463A1
公开(公告)日:2017-10-05
申请号:US15453504
申请日:2017-03-08
发明人: Toshiki Ito , Weijun Liu , Timothy Brian Stachowiak , Niyaz Khusnatdinov , Tomonori Otani , Masayuki Tanabe
IPC分类号: G03F7/00 , C09D135/02
CPC分类号: G03F7/0002 , C09D133/06 , C09D135/02
摘要: A pattern is formed on a substrate with forming a layer of a curable composition (A1) containing a component (a1) serving as a polymerizable compound (a1) and a component (b1) serving as a photopolymerization initiator on a surface of the substrate, then dispensing droplets of a curable composition (A2) containing a component (a2) serving as a polymerizable compound (a2) and a component (b2) serving as a photopolymerization initiator dropwise discretely onto the layer of the curable composition (A1), subsequently sandwiching a mixture layer of the curable composition (A1) and the curable composition (A2) between a mold and the substrate, then irradiating the mixture layer with light to cure the mixture layer, and releasing the mold from the mixture layer after the curing.
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公开(公告)号:US20170283632A1
公开(公告)日:2017-10-05
申请号:US15426282
申请日:2017-02-07
IPC分类号: C09D11/101 , C09D11/107 , C09D135/02 , C09D133/08 , B29C35/08 , B05D3/12 , B05D3/04 , G03F7/00 , B29C59/02 , C09D11/30 , B05D1/30
CPC分类号: C09D11/101 , B05D1/30 , B05D3/04 , B05D3/12 , B29C35/0805 , B29C59/026 , B29C2035/0833 , B29K2033/08 , B29L2011/00 , B29L2031/34 , C09D11/107 , C09D11/30 , C09D133/06 , C09D133/08 , C09D135/02 , G03F7/0002 , G03F7/161
摘要: A pattern is formed on a substrate with forming a layer of a curable composition (A1) containing a polymerizable compound (a1) on a surface of the substrate, then dispensing droplets of a curable composition (A2) containing a polymerizable compound (a2) dropwise discretely onto the curable composition (A1) layer, subsequently sandwiching a mixture layer of the curable composition (A1) and the curable composition (A2) between a mold and the substrate, then irradiating the mixture layer with light to cure the mixture layer, and releasing the mold from the mixture layer after the curing. The curable composition (A1) except a solvent has a viscosity at 25° C. of 40 mPa·s or more and less than 500 mPa·s. The curable composition (A2) except a solvent has a viscosity at 25° C. of 1 mPa·s or more and less than 40 mPa·s.
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