Imprint apparatus, control method, imprint method and manufacturing method

    公开(公告)号:US11054739B2

    公开(公告)日:2021-07-06

    申请号:US16046810

    申请日:2018-07-26

    IPC分类号: G03F7/00 H01L21/324

    摘要: An apparatus and method configured to stabilize imprint head temperature. The apparatus and method includes an imprinting apparatus including, a mount attached to a fixed surface, a movable plate movable relative to the mount, at least one electromagnetic actuator mounted between the movable plate and the mount, wherein an electrical current is applied to the at least one electromagnetic actuator for controlling movement of the moveable plate, and wherein a root-mean-square of the electrical current applied to the at least one electromagnetic actuator in an idle state is equal to a root-mean-square of the electrical current applied to the at least one electromagnetic actuator during a continuous imprinting state.

    Planarization process and apparatus

    公开(公告)号:US10580659B2

    公开(公告)日:2020-03-03

    申请号:US16049003

    申请日:2018-07-30

    摘要: Methods and apparatus for planarization of a substrate. Material is dispensed onto the substrate that varies depending upon the substrate topography variation. A superstrate is brought into contact with the material, the material takes on a shape of the superstrate. The material is solidified. The superstrate is lifted away from the solidified material. Material has a first shrinkage coefficient. Second material is dispensed onto the solidified material with an average thickness. The average thickness is greater than a second material thickness threshold that is dependent upon step height of the substrate and the first shrinkage coefficient. The second material is then solidified.

    SUPERSTRATE AND A METHOD OF USING THE SAME
    4.
    发明申请

    公开(公告)号:US20190250505A1

    公开(公告)日:2019-08-15

    申请号:US15896756

    申请日:2018-02-14

    IPC分类号: G03F7/00 G03F7/20

    CPC分类号: G03F7/0002 G03F7/70483

    摘要: A body of a superstrate can be used to form an adaptive planarization layer over a substrate that has a non-uniform topography. A body of a superstrate can have bending characteristics that are well suited to achieve both conformal and planarization behavior. The body can have a surface and a thickness in a range of t1 to t2, t1=(Pd4/2Eh)1/3; t2=(5Pd4/2Eh)1/3; P is a pressure corresponding to a capillary force between the body and a planarization precursor material; d is a bending distance; E is Young's modulus for the body; and h is a step height difference between two adjacent regions of a substrate. In an embodiment, a thickness can be selected and used to determine the maximum out-of-plane displacement, wmax, for conformal behavior is sufficient and that wmax for planarization behavior is below a predetermined threshold.

    REMOVING SUBSTRATE PRETREATMENT COMPOSITIONS IN NANOIMPRINT LITHOGRAPHY

    公开(公告)号:US20170282440A1

    公开(公告)日:2017-10-05

    申请号:US15418952

    申请日:2017-01-30

    CPC分类号: G03F7/0002

    摘要: A nanoimprint lithography method to remove uncured pretreatment composition from an imprinted nanoimprint lithography substrate. The method includes disposing a pretreatment composition on a nanoimprint lithography substrate to form a pretreatment coating and disposing discrete portions of imprint resist on the pretreatment coating, each discrete portion of the imprint resist covering a target area of the nanoimprint lithography substrate. A composite polymerizable coating is formed on the nanoimprint lithography substrate as each discrete portion of the imprint resist spreads beyond its target area, and the composite polymerizable coating is contacted with a nanoimprint lithography template. The composite polymerizable coating is polymerized to yield a composite polymeric layer and an uncured portion of the pretreatment coating on the nanoimprint lithography substrate, and the uncured portion of the pretreatment coating is removed from the nanoimprint lithography substrate.

    Process of imprinting a substrate with fluid control features

    公开(公告)号:US11294277B2

    公开(公告)日:2022-04-05

    申请号:US16045401

    申请日:2018-07-25

    摘要: A process, system, and method of manufacturing an article on a substrate having a fluid control feature. The fluid control feature may include at least one depressed region formed along an edge of an imprint field. Formable material is deposited in the imprint field of the substrate. A template is moved such that the template comes into contact with the formable material in the imprint field. While the template comes into contact with the formable material, the formable material may flow into the fluid control feature.

    Imprint apparatus control, control method and manufacturing method

    公开(公告)号:US11073758B2

    公开(公告)日:2021-07-27

    申请号:US16177143

    申请日:2018-10-31

    IPC分类号: G03F7/00 B29C43/58 B82Y40/00

    摘要: An apparatus and method configured to brake and/or dampen an imprint head. The apparatus and method includes a mount attached to a fixed surface, a movable plate movable relative to the mount and configured to hold and move an imprint template or superstrate, at least one electromagnetic actuator with a first electrical terminal and a second electrical terminal, mounted between the movable plate and the mount, wherein an electrical current is applied to the at least one electromagnetic actuator for controlling movement of the moveable plate, an inductance serially connected at the first electrical terminal of the at least one electromagnetic actuator to control the electrical current, and at least one switch serially connectable to the second terminal of the at least one electromagnetic actuator and a terminal of the inductance to switch between a state where the inductance acts upon the at least one electromagnetic actuator or a state where the inductance does not act upon the at least one electromagnetic actuator.

    Superstrate and a method of using the same

    公开(公告)号:US10859913B2

    公开(公告)日:2020-12-08

    申请号:US16737362

    申请日:2020-01-08

    摘要: A body of a superstrate can be used to form an adaptive planarization layer over a substrate that has a non-uniform topography. A body of a superstrate can have bending characteristics that are well suited to achieve both conformal and planarization behavior. The body can have a surface and a thickness in a range of t1 to t2, t1=(Pd4/2Eh)1/3; t2=(5Pd4/2Eh)1/3; P is a pressure corresponding to a capillary force between the body and a planarization precursor material; d is a bending distance; E is Young's modulus for the body; and h is a step height difference between two adjacent regions of a substrate. In an embodiment, a thickness can be selected and used to determine the maximum out-of-plane displacement, wmax, for conformal behavior is sufficient and that wmax for planarization behavior is below a predetermined threshold.

    Superstrate and a method of using the same

    公开(公告)号:US10606171B2

    公开(公告)日:2020-03-31

    申请号:US15896756

    申请日:2018-02-14

    IPC分类号: G03F7/00 G03F7/20

    摘要: A body of a superstrate can be used to form an adaptive planarization layer over a substrate that has a non-uniform topography. A body of a superstrate can have bending characteristics that are well suited to achieve both conformal and planarization behavior. The body can have a surface and a thickness in a range of t1 to t2, t1=(Pd4/2Eh)1/3; t2=(5Pd4/2Eh)1/3; P is a pressure corresponding to a capillary force between the body and a planarization precursor material; d is a bending distance; E is Young's modulus for the body; and h is a step height difference between two adjacent regions of a substrate. In an embodiment, a thickness can be selected and used to determine the maximum out-of-plane displacement, wmax, for conformal behavior is sufficient and that wmax for planarization behavior is below a predetermined threshold.