摘要:
A method of forming an integrated circuit includes forming at least one transistor over a substrate. The at least one transistor includes a first gate dielectric structure disposed over a substrate. A work-function metallic layer is disposed over the first gate dielectric structure. A conductive layer is disposed over the work-function metallic layer. A source/drain (S/D) region is disposed adjacent to each sidewall of the first gate dielectric structure. At least one resistor structure is formed over the substrate. The at least one resistor structure includes a first doped semiconductor layer disposed over the substrate. The at least one resistor structure does not include any work-function metallic layer between the first doped semiconductor layer and the substrate.
摘要:
An energy harvesting system includes a plurality of transducers. The transducers are configured to generate direct current (DC) voltages from a plurality of ambient energy sources. A sensor control circuit has a plurality of sensors configured to detect the DC signals from the plurality of transducers. A DC-to-DC converter is configured to supply an output voltage. A plurality of switches, each switch coupled between the DC-to-DC converter and a corresponding transducer of the plurality of transducers. The sensor control circuit enables one switch of the plurality of switches and disables the other switches of the plurality of switches based on a priority criterion.
摘要:
A circuit includes a comparator, a first circuit, and a second circuit. The comparator includes a first input node, a second input node, and an output node. The first circuit is configured to generate a temperature-dependent reference current at the second input node of the comparator. The second circuit is coupled with the second input node of the comparator. The second circuit is configured to increase a voltage level at the second input node of the comparator in response to the temperature-dependent reference current when a signal at the output node of the comparator indicates a first comparison result, and decrease the voltage level at the second input node of the comparator when the signal at the output node of the comparator indicates a second comparison result.
摘要:
An integrated circuit includes a capacitor. A switch is electrically coupled with the capacitor in a parallel fashion. A comparator includes a first input node, a second input node, and an output node. The second input node is electrically coupled with a first plate of the capacitor. The output node is electrically coupled with the switch. A transistor is electrically coupled with a second plate of the capacitor. A circuit is electrically coupled with a gate of the transistor. The circuit is configured to provide a bias voltage to the gate of the transistor so as to control a current that is supplied to charge the capacitor.
摘要:
Some embodiments regard a circuit comprising: a high voltage transistor providing a resistance; an amplifier configured to receive a current and to convert the current to a first voltage that is used in a loop creating the current; and an automatic level control circuit that, based on an AC amplitude of the first voltage, adjusts a second voltage at a gate of the high voltage transistor and thereby adjusts the resistance and the first voltage; wherein the automatic level control circuit is configured to adjust the first voltage toward the first reference voltage if the first voltage differs from a first reference voltage.
摘要:
A sensing circuit includes a sensing resistor, a reference resistor and a comparator. The comparator has a first input coupled to the sensing resistor, a second input coupled to the reference resistor, and an output. The first input is configured to be coupled to a data bit line associated with a memory cell to receive a sensing input voltage caused by a cell current of the memory cell flowing through the sensing resistor. The second input is configured to be coupled to a reference bit line associated with a reference cell to receive a sensing reference voltage caused by a reference current of the reference cell flowing through the reference resistor. The comparator is configured to generate, at the output, an output signal indicating a logic state of data stored in the memory cell based on a comparison between the sensing input voltage and the sensing reference voltage.
摘要:
Mechanisms for providing linear relationship between temperatures and digital codes are disclosed. In one method, at a particular temperature, a circuit in the sensor provides a temperature dependent reference voltage, and a compared voltage, to a comparator. The temperature dependent reference voltage depends on temperature in complement to absolute temperature or alternatively depends on temperature in proportion to absolute temperature. The compared voltage is generated corresponding to digital analog converter (DAC) codes as inputs. Another circuit varies the DAC codes until the temperature dependent reference voltage and the compared voltage are equal so that the dependent reference voltage corresponds to a DAC code. The various temperatures experienced by the temperature sensing circuit and the DAC codes are substantially linearly related
摘要:
An integrated circuit includes at least one first gate electrode of at least one active transistor. At least one first dummy gate electrode is disposed adjacent to a first side edge of the at least one first gate electrode. At least one second dummy gate electrode is disposed adjacent to a second side edge of the at least one first gate electrode. The second side edge is opposite to the first side edge. At least one guard ring is disposed around the at least one first gate electrode, the at least one first dummy gate electrode, and the at least one second dummy gate electrode. An ion implantation layer of the at least one guard ring substantially touches at least one of the at least one first dummy gate electrode and the at least one second dummy gate electrode.
摘要:
A method of forming an integrated circuit structure on a chip includes extracting an active layer from a design of the integrated circuit structure, forming a guard band conforming to the shape of the active layer, the guard band surrounds the active layer, and the guard band is spaced from the active layer at a first spacing in the X-axis direction and at a second spacing in the Y-axis direction, removing any part of the guard band that violates design rules, removing convex corners of the guard band, and adding dummy diffusion patterns into the remaining space of the chip outside the guard band. The first and second spacing can be specified as the same spacings in a Spice model characterization of the integrated circuit structure. The dummy diffusion patterns with different granularities can be added so that the diffusion density is substantially uniform over the chip.