公开(公告)号：US09138840B2

公开(公告)日：2015-09-22

申请号：US13650499

申请日：2012-10-12

申请人： Qiao-Long Chen ,  Meng Fu ,  Zi-Fu Yang ,  Chun-Chi Chen

发明人： Qiao-Long Chen ,  Meng Fu ,  Zi-Fu Yang ,  Chun-Chi Chen

IPC分类号： B23P15/26 ,  B23P11/00 ,  H01L23/367 ,  H01L21/48 ,  F28F3/04 ,  F28F3/06

CPC分类号： B23P15/26 ,  B23P11/00 ,  B23P2700/10 ,  F28F3/048 ,  F28F3/06 ,  F28F2275/122 ,  H01L21/4878 ,  H01L23/3672 ,  H01L2924/0002 ,  Y10T29/49908 ,  H01L2924/00

摘要： An exemplary method for manufacturing a heat sink includes steps: providing a base with a plurality of spaced protrusions formed thereon; providing a plurality of fins and bending a distal end of each fin to form a connecting end; fitting each fin between two adjacent protrusions correspondingly and attaching the connecting end of each fin to the base; and deforming each protrusion to press the connecting ends of two adjacent fins.

摘要翻译： 用于制造散热器的示例性方法包括以下步骤：提供具有在其上形成的多个间隔开的突起的基部; 提供多个翅片并弯曲每个翅片的远端以形成连接端; 将两个相邻突起之间的每个翅片相应地安装，并将每个翅片的连接端连接到基座; 并且使每个突起变形以按压两个相邻翅片的连接端。

公开(公告)号：US08199508B2

公开(公告)日：2012-06-12

申请号：US12503021

申请日：2009-07-14

申请人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

发明人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  H05K5/00 ,  H01L23/10 ,  F28F7/00

CPC分类号： H01L23/427 ,  F28D15/0275 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device dissipates heat generated by a heat-generating electronic element mounted on a top surface printed circuit board. The printed circuit board defines a plurality of first through holes. The heat dissipation device comprises a heat spreader located at a top side of the printed circuit board. The heat spreader defines a plurality of second through holes corresponding to the first through holes, respectively. A first heat sink is located over the heat spreader, and a plurality of second heat sinks is located at a bottom side of the printed circuit board. A plurality of heat pipes extending through the second through holes of the heat spreader and the first through holes of the printed circuit board to thermally connect the first and second heat sinks to the heat spreader.

摘要翻译： 散热装置散发由安装在顶面印刷电路板上的发热电子元件产生的热量。 印刷电路板限定多个第一通孔。 散热装置包括位于印刷电路板顶侧的散热器。 散热器分别限定与第一通孔相对应的多个第二通孔。 第一散热器位于散热器上方，并且多个第二散热器位于印刷电路板的底侧。 多个热管延伸穿过散热器的第二通孔和印刷电路板的第一通孔，以将第一和第二散热器热连接到散热器。

公开(公告)号：US08002019B2

公开(公告)日：2011-08-23

申请号：US12051853

申请日：2008-03-20

申请人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

发明人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： F28D15/0275 ,  H01L23/3672 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base, a fin group located on the base, a first heat pipe and a second heat pipe. The fin group includes a first fin group, a second fin group arranged on the first fin group and a third fin group arranged on the second fin group. The first heat pipe includes an evaporating portion sandwiched between the base and the first fin group, a condensing portion sandwiched between the first fin group and the second fin group, and a connecting portion interconnecting the evaporating portion and the condensing portion. The second heat pipe includes an evaporating portion sandwiched between the base and the first fin group, a condensing portion located between the second fin group and the third fin group, and a connecting portion interconnecting the evaporating portion and the condensing portion thereof.

摘要翻译： 散热装置包括基座，位于基座上的翅片组，第一热管和第二热管。 翅片组包括布置在第一鳍片组上的第一鳍片组，第二鳍片组和布置在第二鳍片组上的第三鳍片组。 第一热管包括夹在基部和第一翅片组之间的蒸发部分，夹在第一翅片组和第二翅片组之间的冷凝部分和将蒸发部分和冷凝部分互连的连接部分。 第二热管包括夹在基座和第一翅片组之间的蒸发部分，位于第二翅片组和第三翅片组之间的冷凝部分和将蒸发部分和其冷凝部分互连的连接部分。

公开(公告)号：US07597134B2

公开(公告)日：2009-10-06

申请号：US11683373

申请日：2007-03-07

申请人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

发明人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： F28D15/0275 ,  F28D15/0233 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device comprises at least two heat pipes (10) and a plurality of fins (20) thermally connected with the heat pipes (10). Each of the heat pipes (10) comprises a flattened evaporating portion (12) and a condensing portion (14). The evaporating portions (12) are closely connected with each other. A flat bottom surface (125) of the evaporating portions (12) of the heat pipes (10) directly engages with an electronic component. A flat top surface (120) of the evaporating portions (12) of the heat pipes (10) directly engages with a bottom surface of the fins (20). The condensing portions (14) of the heat pipes (10) extend through the fins (20).

摘要翻译： 散热装置包括至少两个热管（10）和与热管（10）热连接的多个翅片（20）。 每个热管（10）包括平坦的蒸发部分（12）和冷凝部分（14）。 蒸发部分（12）彼此紧密连接。 热管（10）的蒸发部分（12）的平坦的底面（125）直接与电子部件接合。 热管（10）的蒸发部分（12）的平坦顶表面（120）直接与散热片（20）的底表面接合。 热管（10）的冷凝部分（14）延伸穿过翅片（20）。

公开(公告)号：US08411420B2

公开(公告)日：2013-04-02

申请号：US12914988

申请日：2010-10-28

申请人： Meng Fu ,  Chun-Chi Chen ,  Bang-Jie Xie

发明人： Meng Fu ,  Chun-Chi Chen ,  Bang-Jie Xie

IPC分类号： H05K7/12

CPC分类号： F16M13/00 ,  F16M2200/08 ,  G06F1/1632 ,  H04R5/02

摘要： An electronic device assembly includes an electronic device and a bracket holding the electronic device. The bracket includes a first supporting seat defined a first receiving groove therein and a second supporting seat defined a second receiving groove therein. The first supporting seat is disengagably attachable to the second supporting seat according to either of two selectable arrangements. In a first one of the arrangements, the first receiving groove and the second receiving groove cooperatively define a first receiving chamber having a first width for holding the electronic device in a first orientation. In a second one of the arrangements, the first receiving groove and the second receiving groove cooperatively define a second receiving chamber having a second width for holding the electronic device in a second orientation.

摘要翻译： 电子设备组件包括电子设备和固定电子设备的支架。 托架包括在其中限定第一接收槽的第一支撑座和在其中限定第二接收槽的第二支撑座。 根据两种可选布置中的任一种，第一支撑座可分离地附接到第二支撑座。 在第一种布置中，第一接收槽和第二接收槽协作地限定具有用于将电子设备保持在第一方向的第一宽度的第一接收室。 在第二种布置中，第一接收槽和第二接收槽协作地限定具有用于将电子设备保持在第二方向的第二宽度的第二接收室。

公开(公告)号：US20050088819A1

公开(公告)日：2005-04-28

申请号：US10901618

申请日：2004-07-28

申请人： Chun-Chi Chen ,  Meng Fu

发明人： Chun-Chi Chen ,  Meng Fu

IPC分类号： G06F1/20 ,  H01L23/467 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a heat sink (6), a fan (1) and a fan holder (2). The fan holder comprises a guiding receptacle (20) and a securing base (40) covering the heat sink. An inlet (24) of the guiding receptacle is coupled to the bottom of the fan. An opening (221) is defined in the guiding receptacle for providing airflow access from the fan to the heat sink.

摘要翻译： 散热装置适于从电子包装中去除热量。 散热装置包括散热片（6），风扇（1）和风扇架（2）。 风扇支架包括导向插座（20）和覆盖散热器的固定底座（40）。 引导插座的入口（24）联接到风扇的底部。 在导向插座中限定了开口（221），用于提供从风扇到散热器的气流进入。

公开(公告)号：US20090244849A1

公开(公告)日：2009-10-01

申请号：US12248004

申请日：2008-10-08

申请人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

发明人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device attached to a top surface of an electronic device mounted on a printed circuit board, includes a heat sink and a retainer securing the heat sink onto the electronic device. The retainer includes a frame, a plurality of baffle walls and protrusion posts extending downwardly from the frame. Lower ends of the baffle walls of the retainer extend downwardly through the heat sink and engage with engaging edges of the electronic device. The heat dissipation device is further provided with a plurality of elastic members which respectively surround the protrusion posts of the retainer and are compressed between the retainer and the heat sink, thereby pushing the heat sink downwardly toward the electronic device.

摘要翻译： 安装在安装在印刷电路板上的电子装置的顶表面上的散热装置包括散热器和将散热器固定在电子装置上的保持架。 保持器包括框架，多个挡板壁和从框架向下延伸的突出柱。 保持器的挡板壁的下端向下延伸穿过散热器并与电子设备的接合边缘接合。 散热装置还设置有分别围绕保持器的突出支柱的多个弹性构件，并且在保持器和散热器之间被压缩，从而将散热器向下推向电子装置。

公开(公告)号：US20060104036A1

公开(公告)日：2006-05-18

申请号：US11135593

申请日：2005-05-23

申请人： Chun-Chi Chen ,  Shi-Wen Zhuo ,  Meng Fu ,  Chi Liang

发明人： Chun-Chi Chen ,  Shi-Wen Zhuo ,  Meng Fu ,  Chi Liang

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipating device includes a heat sink (60), a radiator (70) and heat-transfer pipes (80). The heat sink includes a chassis (62), a plate (64) separate from the chassis and a plurality of fins (66) extending between the chassis and the plate. The radiator includes a base (72) parallel to the fins. Each heat-transfer pipe includes a heat-absorbing portion (82) thermally positioned to the chassis, a heat-releasing portion (84) thermally positioned to the plate and a heat-transfer portion (86) disposed between the heat-absorbing portion and the heat-releasing portion. The heat-transfer portion is thermally received in the base of the radiator.

摘要翻译： 散热装置包括散热器（60），散热器（70）和传热管（80）。 散热器包括底盘（62），与底盘分离的板（64）和在底盘和板之间延伸的多个翅片（66）。 散热器包括平行于翅片的基座（72）。 每个传热管包括热定位到底盘的热吸收部分（82），热定位于板的散热部分（84）和设置在吸热部分和 散热部。 热传递部分被热接收在散热器的基座中。

公开(公告)号：US06942020B2

公开(公告)日：2005-09-13

申请号：US10890049

申请日：2004-07-12

申请人： Chun-Chi Chen ,  Meng Fu

发明人： Chun-Chi Chen ,  Meng Fu

IPC分类号： H01L23/427 ,  F28D15/00

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a plurality of fins (40), a post (20) and a plurality of heat pipes (30). Each fin defines an opening (42) and a plurality of punctures (44) spaced from the opening. The post is received in the openings of the fins. The heat pipes are engaged at opposite portions thereof with the post and the punctures of the fins.

摘要翻译： 散热装置包括多个翅片（40），柱（20）和多个热管（30）。 每个翅片限定开口（42）和与开口间隔开的多个穿孔（44）。 该柱被容纳在翅片的开口中。 热管在其与柱的相对部分处接合并且翅片的穿刺。

公开(公告)号：US07663884B2

公开(公告)日：2010-02-16

申请号：US12248004

申请日：2008-10-08

申请人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

发明人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device attached to a top surface of an electronic device mounted on a printed circuit board, includes a heat sink and a retainer securing the heat sink onto the electronic device. The retainer includes a frame, a plurality of baffle walls and protrusion posts extending downwardly from the frame. Lower ends of the baffle walls of the retainer extend downwardly through the heat sink and engage with engaging edges of the electronic device. The heat dissipation device is further provided with a plurality of elastic members which respectively surround the protrusion posts of the retainer and are compressed between the retainer and the heat sink, thereby pushing the heat sink downwardly toward the electronic device.

摘要翻译： 安装在安装在印刷电路板上的电子装置的顶表面上的散热装置包括散热器和将散热器固定在电子装置上的保持架。 保持器包括框架，多个挡板壁和从框架向下延伸的突出柱。 保持器的挡板壁的下端向下延伸穿过散热器并与电子设备的接合边缘接合。 散热装置还设置有分别围绕保持器的突出支柱的多个弹性构件，并且在保持器和散热器之间被压缩，从而将散热器向下推向电子装置。