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    Heat dissipating device
    1.
    发明申请
    Heat dissipating device 失效
    散热装置

    公开(公告)号：US20060104036A1

    公开(公告)日：2006-05-18

    申请号：US11135593

    申请日：2005-05-23

    申请人： Chun-Chi Chen ,  Shi-Wen Zhuo ,  Meng Fu ,  Chi Liang

    发明人： Chun-Chi Chen ,  Shi-Wen Zhuo ,  Meng Fu ,  Chi Liang

    IPC分类号： H05K7/20

    CPC分类号： H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipating device includes a heat sink (60), a radiator (70) and heat-transfer pipes (80). The heat sink includes a chassis (62), a plate (64) separate from the chassis and a plurality of fins (66) extending between the chassis and the plate. The radiator includes a base (72) parallel to the fins. Each heat-transfer pipe includes a heat-absorbing portion (82) thermally positioned to the chassis, a heat-releasing portion (84) thermally positioned to the plate and a heat-transfer portion (86) disposed between the heat-absorbing portion and the heat-releasing portion. The heat-transfer portion is thermally received in the base of the radiator.

    摘要翻译： 散热装置包括散热器（60），散热器（70）和传热管（80）。 散热器包括底盘（62），与底盘分离的板（64）和在底盘和板之间延伸的多个翅片（66）。 散热器包括平行于翅片的基座（72）。 每个传热管包括热定位到底盘的热吸收部分（82），热定位于板的散热部分（84）和设置在吸热部分和 散热部。 热传递部分被热接收在散热器的基座中。

    Heat sink electronic components
    2.
    发明申请
    Heat sink electronic components 审中-公开
    散热器电子元件

    公开(公告)号：US20060032617A1

    公开(公告)日：2006-02-16

    申请号：US11012958

    申请日：2004-12-14

    申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Chi Liang ,  Meng Fu

    发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Chi Liang ,  Meng Fu

    IPC分类号： F28D15/00

    CPC分类号： H01L23/427 ,  F28D15/0275 ,  F28F3/02 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink for electronic component includes a base, a first heat dissipation member coupled to the base, heat pipes embedded in the base and a second heat dissipation member coupled to the base. The base is made of a first metal material and includes a heat absorbing portion having a bottom surface for contacting with the electronic component and a heat conductive portion extending from a top surface of heat absorbing portion. The first heat dissipation member is made of a second metal material and coupled to the heat absorbing portion of the base. The second heat dissipation member is made of second metal material and coupled to the heat conductive portion of the base. The first metal material differs from and has higher heat conductivity than the second metal material.

    摘要翻译： 一种用于电子部件的散热器包括基座，耦合到基座的第一散热构件，嵌入在基座中的热管和耦合到基座的第二散热构件。 基座由第一金属材料制成，并且包括具有用于与电子部件接触的底面的吸热部和从吸热部的顶面延伸的导热部。 第一散热构件由第二金属材料制成并且联接到基座的吸热部分。 第二散热构件由第二金属材料制成并且连接到基座的导热部分。 第一金属材料与第二金属材料不同并且具有比第二金属材料更高的热导率。

    Heat dissipating device
    3.
    发明授权
    Heat dissipating device 失效
    散热装置

    公开(公告)号：US07218522B2

    公开(公告)日：2007-05-15

    申请号：US11135575

    申请日：2005-05-23

    申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Meng Fu ,  Chi Liang

    发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Meng Fu ,  Chi Liang

    IPC分类号： H05K7/20

    CPC分类号： H01L23/562 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipating device includes a heat sink and a protecting device attached to the heat sink. The heat sink includes a plurality of individual fins in assembly. The protecting device is made from plastic. The protecting device includes a lath resting on the fins, and a plurality of ribs beneath the lath. The ribs are interposed between the fins.

    摘要翻译： 散热装置包括散热器和附接到散热器的保护装置。 散热器包括多个单独的翅片组装。 保护装置由塑料制成。 保护装置包括搁置在翅片上的板条和在板条下方的多个肋条。 肋条插在翅片之间。

    Heat dissipating device
    4.
    发明申请
    Heat dissipating device 失效
    散热装置

    公开(公告)号：US20060018096A1

    公开(公告)日：2006-01-26

    申请号：US11135575

    申请日：2005-05-23

    申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Meng Fu ,  Chi Liang

    发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Meng Fu ,  Chi Liang

    IPC分类号： H05K7/20

    CPC分类号： H01L23/562 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipating device includes a heat sink and a protecting device attached to the heat sink. The heat sink includes a plurality of individual fins in assembly. The protecting device is made from plastic. The protecting device includes a lath resting on the fins, and a plurality of ribs beneath the lath. The ribs are interposed between the fins.

    摘要翻译： 散热装置包括散热器和附接到散热器的保护装置。 散热器包括多个单独的翅片组装。 保护装置由塑料制成。 保护装置包括搁置在翅片上的板条和在板条下方的多个肋条。 肋条插在翅片之间。

    Heat dissipating device
    5.
    发明授权
    Heat dissipating device 失效
    散热装置

    公开(公告)号：US07365978B2

    公开(公告)日：2008-04-29

    申请号：US11135593

    申请日：2005-05-23

    申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Meng Fu ,  Chi Liang

    发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Meng Fu ,  Chi Liang

    IPC分类号： H05K7/20

    CPC分类号： H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipating device includes a heat sink (60), a radiator (70) and heat-transfer pipes (80). The heat sink includes a chassis (62), a plate (64) separate from the chassis and a plurality of fins (66) extending between the chassis and the plate. The radiator includes a base (72) parallel to the fins. Each heat-transfer pipe includes a heat-absorbing portion (82) thermally positioned to the chassis, a heat-releasing portion (84) thermally positioned to the plate and a heat-transfer portion (86) disposed between the heat-absorbing portion and the heat-releasing portion. The heat-transfer portion is thermally received in the base of the radiator.

    摘要翻译： 散热装置包括散热器（60），散热器（70）和传热管（80）。 散热器包括底盘（62），与底盘分离的板（64）和在底盘和板之间延伸的多个翅片（66）。 散热器包括平行于翅片的基座（72）。 每个传热管包括热定位到底盘的热吸收部分（82），热定位于板的散热部分（84）和设置在吸热部分和 散热部。 热传递部分被热接收在散热器的基座中。

    Electronic device assembly with two-part bracket
    8.
    发明授权
    Electronic device assembly with two-part bracket 失效
    具有两部分支架的电子设备组件

    公开(公告)号：US08411420B2

    公开(公告)日：2013-04-02

    申请号：US12914988

    申请日：2010-10-28

    申请人： Meng Fu ,  Chun-Chi Chen ,  Bang-Jie Xie

    发明人： Meng Fu ,  Chun-Chi Chen ,  Bang-Jie Xie

    IPC分类号： H05K7/12

    CPC分类号： F16M13/00 ,  F16M2200/08 ,  G06F1/1632 ,  H04R5/02

    摘要： An electronic device assembly includes an electronic device and a bracket holding the electronic device. The bracket includes a first supporting seat defined a first receiving groove therein and a second supporting seat defined a second receiving groove therein. The first supporting seat is disengagably attachable to the second supporting seat according to either of two selectable arrangements. In a first one of the arrangements, the first receiving groove and the second receiving groove cooperatively define a first receiving chamber having a first width for holding the electronic device in a first orientation. In a second one of the arrangements, the first receiving groove and the second receiving groove cooperatively define a second receiving chamber having a second width for holding the electronic device in a second orientation.

    摘要翻译： 电子设备组件包括电子设备和固定电子设备的支架。 托架包括在其中限定第一接收槽的第一支撑座和在其中限定第二接收槽的第二支撑座。 根据两种可选布置中的任一种，第一支撑座可分离地附接到第二支撑座。 在第一种布置中，第一接收槽和第二接收槽协作地限定具有用于将电子设备保持在第一方向的第一宽度的第一接收室。 在第二种布置中，第一接收槽和第二接收槽协作地限定具有用于将电子设备保持在第二方向的第二宽度的第二接收室。

    Heat dissipation device with heat pipe
    9.
    发明授权
    Heat dissipation device with heat pipe 失效
    散热装置带热管

    公开(公告)号：US07537046B2

    公开(公告)日：2009-05-26

    申请号：US11695462

    申请日：2007-04-02

    申请人： Dong-Bo Zheng ,  Lei Cao ,  Meng Fu ,  Chun-Chi Chen

    发明人： Dong-Bo Zheng ,  Lei Cao ,  Meng Fu ,  Chun-Chi Chen

    IPC分类号： F28D15/00 ,  H05K7/20

    CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/0275 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipation device includes a base (10) for thermally engaging with an electronic device and a plurality of fins (320) arranged on the base (10). A heat pipe (52) thermally connects the fins (320) and the base (10) for transferring heat from the base (10) to the fins (320). The heat pipe (52) comprises an evaporation section (521) sandwiched between the base (10) and the fins (320), two condensation sections (525, 526) parallel to the evaporation section (521) and thermally engaging with the fins (320), and two connecting sections (527, 528) interconnecting corresponding condensation sections (525, 526) and the evaporation section (521). The connecting sections (527, 528) form an included angle therebetween. The condensation sections (525, 526) are spaced from and extend toward each other.

    摘要翻译： 散热装置包括用于与电子设备热接合的基座（10）和布置在基座（10）上的多个翅片（320）。 热管（52）热连接翅片（320）和底座（10），用于将热量从基座（10）传送到散热片（320）。 热管（52）包括夹在基座（10）和翅片（320）之间的蒸发部分（521），与蒸发部分（521）平行的两个冷凝部分（525,526），并与翅片 320）和互连相应的冷凝部分（525,526）和蒸发部分（521）的两个连接部分（527,528）。 连接部分（527,528）在它们之间形成夹角。 冷凝部分（525,526）彼此间隔开并且彼此延伸。

    Clip for heat sink
    10.
    发明授权
    Clip for heat sink 失效
    夹子为散热片

    公开(公告)号：US07391615B2

    公开(公告)日：2008-06-24

    申请号：US11309839

    申请日：2006-10-10

    申请人： Meng Fu ,  Shi-Wen Zhou ,  Chun-Chi Chen

    发明人： Meng Fu ,  Shi-Wen Zhou ,  Chun-Chi Chen

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4093 ,  H01L2224/16 ,  Y10T24/44427 ,  Y10T24/4447

    摘要： A clip includes a body with opposite first and second legs, a movable fastener, an actuating member and a sliding axle. The movable fastener has a retaining hole defined therein for engaging with a retention module and an elongated slot above the retaining hole. The actuating member includes a curving slot and is pivotally coupled to the movable fastener via a pivot. The sliding axle extends through the second leg of the body and the elongated slot of the movable fastener to couple them together, and the sliding axle has one portion inserted into the curving slot of the actuating member. When the actuating member is rotated about the pivot, the movable fastener is driven to move relative to the sliding axle between a relaxed position and a locked position.

    摘要翻译： 夹具包括具有相对的第一和第二腿部的主体，可移动紧固件，致动构件和滑动轴。 可移动紧固件具有限定在其中的保持孔，用于与保持模块和保持孔上方的细长狭槽接合。 致动构件包括弯曲槽，并且经由枢轴枢转地联接到可动紧固件。 滑动轴延伸穿过主体的第二腿部和可移动紧固件的细长槽以将它们联接在一起，并且滑动轴具有插入致动构件的弯曲槽中的一个部分。 当致动构件围绕枢轴旋转时，可移动紧固件被驱动以在松弛位置和锁定位置之间相对于滑动轴线移动。