公开(公告)号：US10320151B1

公开(公告)日：2019-06-11

申请号：US15953250

申请日：2018-04-13

Applicant: Cisco Technology, Inc.

Inventor： Matthew J. Traverso ,  Dominic F. Siriani ,  Mark Webster

IPC: G02B6/12 ,  H01S5/10 ,  H01S5/028 ,  H01S5/12 ,  H01S5/022 ,  H01S5/125 ,  H01S5/22 ,  H01S5/30

Abstract: The embodiments herein describe a single-frequency laser source (e.g., a distributed feedback (DFB) laser or distributed Bragg reflector (DBR) laser) that includes a feedback grating or mirror that extends along a waveguide. The grating may be disposed over a portion of the waveguide in an optical gain region in the laser source. Instead of the waveguide or cavity being linear, the laser includes a U-turn region so that two ends of the waveguide terminate at the same facet. That facet is coated with an anti-reflective (AR) coating.

公开(公告)号：US09964719B1

公开(公告)日：2018-05-08

申请号：US15582370

申请日：2017-04-28

Applicant: Cisco Technology, Inc.

Inventor： Sandeep Razdan ,  Vipulkumar Patel ,  Matthew J. Traverso

IPC: G02B6/42 ,  G02B6/138 ,  G02B6/34 ,  H01L21/56 ,  H01L23/00 ,  H01L25/16 ,  H01L21/768 ,  H01L21/78 ,  H01L23/31 ,  H01L23/538

CPC classification number: G02B6/4255 ,  G02B6/138 ,  G02B6/34 ,  G02B6/428 ,  H01L21/76802 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/5389 ,  H01L24/03 ,  H01L25/167 ,  H01L2224/0231 ,  H01L2224/02373 ,  H01L2224/02379 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/16145

Abstract: The present disclosure discloses an assembly. The assembly includes a photonic chip and an electrical chip disposed side by side. The assembly also includes mold compound that encapsulates the photonic chip and the electrical chip. The assembly further includes a redistribution layer (RDL) that extends across the top surface of the photonic chip and the top surface of the electrical chip and connects the photonic chip with the electrical chip. Moreover, the photonic chip includes an exposed optical interface for transmitting optical signals between the photonic chip and an external optical device.