公开(公告)号：US20210115243A1

公开(公告)日：2021-04-22

申请号：US17041640

申请日：2018-03-29

Applicant: Dow Global Technologies LLC

Inventor： Yong Zheng ,  Santosh S. Bawiskar ,  Brian W. Walther ,  Michael B. Biscoglio ,  Andong Liu

IPC: C08L51/06 ,  C08L23/06 ,  C08L23/08 ,  C08K5/42 ,  B32B27/08 ,  B32B27/32 ,  B32B27/36

Abstract: The disclosure relates to a tie resin formulation for use as a tie layer in a multilayer structure. The resin includes a first polyolefin grafted with an ethylenically unsaturated carboxylic acid, an ethylenically unsaturated acid derivative or a combination thereof, and having a density of 0.857 to 0.885 g/cm3, and 0.001 to 0.20 weight percent (wt. %) of a catalyst comprising at least one Lewis acid, where the resin includes the catalyst and up to 99.999 wt. % of the first polyolefin, where the wt. % is based on a total weight of the resin.

公开(公告)号：US20200299445A1

公开(公告)日：2020-09-24

申请号：US16061618

申请日：2016-12-20

Applicant: Dow Global Technologies LLC

Inventor： Santosh S. Bawiskar ,  Brian W. Walther

IPC: C08F255/08

Abstract: A process to form a functionalized ethylene-based polymer composition comprises reacting an ethylene-based polymer composition in at least one extruder with at least one functionalization agent and at least one free radical initiator at a melt temperature of greater than or equal to 200° C. The functionalized ethylene-based polymer composition has a yellowness index (YI) value of less than or equal to 45 and a functionalization content of greater than or equal to 2.0 wt %, based on the weight of the functionalized ethylene-based polymer composition.

公开(公告)号：US20180171186A1

公开(公告)日：2018-06-21

申请号：US15738927

申请日：2016-08-05

Applicant: Dow Global Technologies LLC

Inventor： Yong Zheng ,  Brian W. Walther ,  Santosh S. Bawiskar ,  Cristina Serrat

IPC: C09J123/06 ,  B32B27/08 ,  B32B7/12 ,  B32B27/32 ,  B32B27/30 ,  B32B27/34

CPC classification number: C09J123/06 ,  B32B1/08 ,  B32B7/12 ,  B32B27/06 ,  B32B27/08 ,  B32B27/306 ,  B32B27/32 ,  B32B27/327 ,  B32B27/34 ,  B32B2250/03 ,  B32B2250/04 ,  B32B2250/05 ,  B32B2250/24 ,  B32B2270/00 ,  B32B2307/7244 ,  B32B2307/7246 ,  B32B2439/40 ,  B32B2439/46 ,  B32B2597/00 ,  C08K5/42 ,  C08L23/06 ,  C08L23/0815 ,  C08L51/06 ,  C08L2201/14 ,  C08L2203/16 ,  C08L2207/062

Abstract: The present invention provides resins that can be used as a tie layer in a multilayer structure and to multilayer structures comprising one or more tie layers formed from such resins. In one aspect, a resin for use as a tie layer in a multilayer structure that comprises a high density polyethylene having a density greater than 0.960 g/cm3, wherein the high density polyethylene comprises 1 to 99 weight percent of the resin, a maleic anhydride grafted high density polyethylene, wherein the maleic anhydride grafted high density polyethylene comprises 1 to 99 weight percent of the resin, and a catalyst comprising at least one Lewis acid.

公开(公告)号：US20160039593A1

公开(公告)日：2016-02-11

申请号：US14773896

申请日：2014-03-14

Applicant: DOW GLOBAL TECHNOLOGIES LLC

Inventor： Shrikant Dhodapkar ,  Remi Trottier ,  Santosh S. Bawiskar ,  Kyle D. Anderson

IPC: B65D81/26 ,  C08K3/36 ,  C08J7/06 ,  B65B1/04 ,  B65B7/02

CPC classification number: B65D81/264 ,  B65B1/04 ,  B65B7/02 ,  C08J3/124 ,  C08J3/128 ,  C08J7/06 ,  C08J2323/16 ,  C08K3/36

Abstract: The present disclosure provides a packaging process and the resultant package produced from the process. The process includes introducing, into a mixing device, pellets composed of ethylene/propylene/diene polymer (EPDM). The EPDM comprises greater than 60 wt % units derived from ethylene. The pellets have a residual moisture content from 500 ppm to 2500 ppm. The process includes adding a silica-based powder to the mixing device and coating at least a portion of the pellets with the silica-based powder. The process includes sealing a bulk amount of the coated pellets in a bag made of a flexible polymeric film The process includes absorbing, with the silica-based powder, the residual moisture from the pellets, and preventing moisture condensation in the bag interior for a period from 7 days after the sealing step to 1000 days after the sealing step.

Abstract translation: 本公开提供了一种包装方法和由该方法生产的所得包装。 该方法包括将由乙烯/丙烯/二烯聚合物（EPDM）组成的颗粒引入到混合装置中。 EPDM包含大于60重量％的衍生自乙烯的单元。 颗粒的残留水分含量为500ppm至2500ppm。 该方法包括向混合装置中加入二氧化硅基粉末，并用二氧化硅基粉末涂覆至少一部分颗粒。 该方法包括将大量的涂覆颗粒密封在由柔性聚合物膜制成的袋中。该方法包括用二氧化硅基粉末吸收来自颗粒的残留水分，并防止袋内部的水分冷凝一段时间 从密封步骤后7天到密封步骤后1000天。