Hollow dielectric for image sensor
    31.
    发明授权
    Hollow dielectric for image sensor 有权
    空心电介质用于图像传感器

    公开(公告)号:US07338830B2

    公开(公告)日:2008-03-04

    申请号:US11271116

    申请日:2005-11-10

    IPC分类号: H01L21/00

    CPC分类号: H01L27/14632 H01L27/1462

    摘要: A plurality of apertures is formed in at least one first insulating layer disposed over a sensor formed in a semiconductor substrate. A second insulating layer is disposed over the at least one first insulating layer and the plurality of apertures in the at least one first insulating layer. The apertures form hollow regions in the at least one first insulating layer over the sensor, allowing more light or energy to pass through the at least one first insulating layer to the sensor, and increasing the sensitivity of the sensor.

    摘要翻译: 在设置在形成于半导体衬底中的传感器上的至少一个第一绝缘层中形成多个孔。 第二绝缘层设置在至少一个第一绝缘层和至少一个第一绝缘层中的多个孔之上。 所述孔在所述传感器上的所述至少一个第一绝缘层中形成中空区域,允许更多的光或能量穿过所述至少一个第一绝缘层到所述传感器,并且增加所述传感器的灵敏度。

    Light guide for image sensor
    32.
    发明授权
    Light guide for image sensor 有权
    图像传感器光导

    公开(公告)号:US07332368B2

    公开(公告)日:2008-02-19

    申请号:US11285671

    申请日:2005-11-22

    IPC分类号: H01L21/00

    CPC分类号: H01L27/14625 H01L27/14685

    摘要: A new method to form an image sensor device is achieved. The method comprises forming an image sensing array in a substrate comprising a plurality of light detecting diodes with spaces between the diodes. A first dielectric layer is formed overlying the diodes but not the spaces. The first dielectric layer has a first refractive index. A second dielectric layer is formed overlying the spaces but not the diodes. The second dielectric layer has a second refractive index that is larger than the first refractive index. A new image sensor device is disclosed.

    摘要翻译: 实现了形成图像传感器装置的新方法。 该方法包括在包括在二极管之间具有空间的多个光检测二极管的衬底中形成图像感测阵列。 第一介电层形成在二极管上,但不形成空间。 第一电介质层具有第一折射率。 第二电介质层形成在空间上而不是二极管上。 第二电介质层具有大于第一折射率的第二折射率。 公开了一种新的图像传感器装置。

    Semiconductor device having enhanced photo sensitivity and method for manufacture thereof
    33.
    发明授权
    Semiconductor device having enhanced photo sensitivity and method for manufacture thereof 有权
    具有增强的光敏度的半导体器件及其制造方法

    公开(公告)号:US07232697B2

    公开(公告)日:2007-06-19

    申请号:US10818312

    申请日:2004-04-05

    IPC分类号: H01L21/339

    CPC分类号: H01L27/14689 H01L27/1463

    摘要: Provided are a semiconductor device and a method for its manufacture. In one example, the method includes forming an isolation structure having a first refraction index over a sensor embedded in a substrate. A first layer having a second refraction index that is different from the first refraction index is formed over the isolation structure. The first layer is removed from at least a portion of the isolation structure. A second layer having a third refraction index is formed over the isolation structure after the first layer is removed. The third refraction index is substantially similar to the first refraction index.

    摘要翻译: 提供半导体器件及其制造方法。 在一个示例中,该方法包括在嵌入基板中的传感器上形成具有第一折射率的隔离结构。 在隔离结构上形成具有与第一折射率不同的第二折射率的第一层。 从隔离结构的至少一部分去除第一层。 在去除第一层之后,在隔离结构上形成具有第三折射率的第二层。 第三折射率基本上类似于第一折射率。

    Structure for CMOS image sensor
    34.
    发明申请
    Structure for CMOS image sensor 有权
    CMOS图像传感器的结构

    公开(公告)号:US20060164531A1

    公开(公告)日:2006-07-27

    申请号:US11044922

    申请日:2005-01-27

    IPC分类号: H04N5/335

    摘要: A CMOS image sensor having increased capacitance that allows a photo-diode to generate a larger current is provided. The increased capacitance reduces noise and the dark signal. The image sensor utilizes a transistor having nitride spacers formed on a buffer oxide layer. Additional capacitance may be provided by various capacitor structures, such as a stacked capacitor, a planar capacitor, a trench capacitor, a MOS capacitor, a MIM/PIP capacitor, or the like. Embodiments of the present invention may be utilized in a 4-transistor pixel or a 3-transistor pixel configuration.

    摘要翻译: 提供了具有允许光电二极管产生较大电流的增加的电容的CMOS图像传感器。 增加的电容可以降低噪声和暗信号。 图像传感器利用形成在缓冲氧化物层上的具有氮化物间隔物的晶体管。 附加电容可以由诸如叠层电容器,平面电容器,沟槽电容器,MOS电容器,MIM / PIP电容器等的各种电容器结构来提供。 本发明的实施例可以用于4-晶体管像素或3-晶体管像素配置。

    Image sensor device and method to form image sensor device
    35.
    发明授权
    Image sensor device and method to form image sensor device 有权
    图像传感器装置及其形成图像传感器的方法

    公开(公告)号:US07061028B2

    公开(公告)日:2006-06-13

    申请号:US10388274

    申请日:2003-03-12

    IPC分类号: H01L29/73

    CPC分类号: H01L27/14625 H01L27/14685

    摘要: A new method to form an image sensor device is achieved. The method comprises forming an image sensing array in a substrate comprising a plurality of light detecting diodes with spaces between the diodes. A first dielectric layer is formed overlying the diodes but not the spaces. The first dielectric layer has a first refractive index. A second dielectric layer is formed overlying the spaces but not the diodes. The second dielectric layer has a second refractive index that is larger than the first refractive index. A new image sensor device is disclosed.

    摘要翻译: 实现了形成图像传感器装置的新方法。 该方法包括在包括在二极管之间具有空间的多个光检测二极管的衬底中形成图像感测阵列。 第一介电层形成在二极管上,但不形成空间。 第一电介质层具有第一折射率。 第二电介质层形成在空间上而不是二极管上。 第二电介质层具有大于第一折射率的第二折射率。 公开了一种新的图像传感器装置。

    Quantum efficiency enhancement for CMOS imaging sensor with borderless contact
    36.
    发明授权
    Quantum efficiency enhancement for CMOS imaging sensor with borderless contact 有权
    具有无边界接触的CMOS成像传感器的量子效率增强

    公开(公告)号:US07038232B2

    公开(公告)日:2006-05-02

    申请号:US10669516

    申请日:2003-09-24

    IPC分类号: H01L29/06

    摘要: The present invention is a CMOS image sensor and its method of fabrication. This invention provides an efficient structure to improve the quantum efficiency of a CMOS image sensor with borderless contact. The image sensor comprises a N-well/P-substrate type photodiode with borderless contact and dielectric structure covering the photodiode region. The dielectric structure is located between the photodiode and the interlevel dielectric (ILD) and is used as a buffer layer for the borderless contact. The method of fabricating a high performance photodiode comprises forming a photodiode in the n-well region of a shallow trench, and embedding a dielectric material between the ILD oxide and the photodiode having a refraction index higher than the ILD oxide.

    摘要翻译: 本发明是CMOS图像传感器及其制造方法。 本发明提供了一种提高无边界接触CMOS图像传感器的量子效率的有效结构。 图像传感器包括覆盖光电二极管区域的无接触接触和介电结构的N阱/ P基板型光电二极管。 电介质结构位于光电二极管和层间电介质(ILD)之间,用作无边界接触的缓冲层。 制造高性能光电二极管的方法包括在浅沟槽的n阱区域中形成光电二极管,并且在ILD氧化物和具有高于ILD氧化物的折射率的光电二极管之间嵌入电介质材料。

    Hollow dielectric for image sensor
    37.
    发明申请
    Hollow dielectric for image sensor 有权
    空心电介质用于图像传感器

    公开(公告)号:US20050199921A1

    公开(公告)日:2005-09-15

    申请号:US10799986

    申请日:2004-03-12

    CPC分类号: H01L27/14632 H01L27/1462

    摘要: A plurality of apertures is formed in at least one first insulating layer disposed over a sensor formed in a semiconductor substrate. A second insulating layer is disposed over the at least one first insulating layer and the plurality of apertures in the at least one first insulating layer. The apertures form hollow regions in the at least one first insulating layer over the sensor, allowing more light or energy to pass through the at least one first insulating layer to the sensor, and increasing the sensitivity of the sensor.

    摘要翻译: 在设置在形成于半导体衬底中的传感器上的至少一个第一绝缘层中形成多个孔。 第二绝缘层设置在所述至少一个第一绝缘层和所述至少一个第一绝缘层中的多个孔之上。 所述孔在所述传感器上的所述至少一个第一绝缘层中形成中空区域,允许更多的光或能量穿过所述至少一个第一绝缘层到所述传感器,并且增加所述传感器的灵敏度。

    Semiconductor device having enhanced photo sensitivity and method for manufacture thereof
    38.
    发明申请
    Semiconductor device having enhanced photo sensitivity and method for manufacture thereof 有权
    具有增强的光敏度的半导体器件及其制造方法

    公开(公告)号:US20050133837A1

    公开(公告)日:2005-06-23

    申请号:US10818312

    申请日:2004-04-05

    IPC分类号: H01L29/84

    CPC分类号: H01L27/14689 H01L27/1463

    摘要: Provided are a semiconductor device and a method for its manufacture. In one example, the method includes forming an isolation structure having a first refraction index over a sensor embedded in a substrate. A first layer having a second refraction index that is different from the first refraction index is formed over the isolation structure. The first layer is removed from at least a portion of the isolation structure. A second layer having a third refraction index is formed over the isolation structure after the first layer is removed. The third refraction index is substantially similar to the first refraction index.

    摘要翻译: 提供半导体器件及其制造方法。 在一个示例中,该方法包括在嵌入基板中的传感器上形成具有第一折射率的隔离结构。 在隔离结构上形成具有与第一折射率不同的第二折射率的第一层。 从隔离结构的至少一部分去除第一层。 在去除第一层之后,在隔离结构上形成具有第三折射率的第二层。 第三折射率基本上类似于第一折射率。

    Grid metal design for large density CMOS image sensor
    39.
    发明申请
    Grid metal design for large density CMOS image sensor 有权
    网格金属设计,用于大尺寸CMOS图像传感器

    公开(公告)号:US20050030403A1

    公开(公告)日:2005-02-10

    申请号:US10945342

    申请日:2004-09-20

    CPC分类号: H01L27/14603 H01L27/14643

    摘要: A new grid metal design for image sensors is disclosed which is comprised of a semiconductor image sensor chip having a pixel region covering most of the chip and a logic circuit region on the chip periphery. The pixel region contains. an array of image pixels where for each image pixel the majority of its area is occupied by a light sensing element and the other image pixel circuit elements are arranged in the periphery of the image pixel without overlapping the image-sensing element. A number of metal levels are of the first type, at which functional metal patterns exist both for the chip peripheral logic circuits and for the pixel circuit elements. A number of metal levels are of the second type, at which functional metal patterns exist only for the chip peripheral logic circuits and dummy metal patterns cover the pixel region except for the light sensing elements. A first dielectric layer is disposed under the first metal layer, an interlevel dielectric layer between metal levels of either type and a passivation layer over the last metal level.

    摘要翻译: 公开了一种用于图像传感器的新的栅格金属设计,其包括具有覆盖芯片的大部分的像素区域和芯片周边上的逻辑电路区域的半导体图像传感器芯片。 像素区域包含。 图像像素阵列,其中对于每个图像像素,其大部分区域被光感测元件占据,并且其他图像像素电路元件被布置在图像像素的周围,而不与图像感测元件重叠。 多个金属级别是第一类型,其中功能金属图案存在于芯片外围逻辑电路和像素电路元件。 许多金属水平是第二类型,其中功能金属图案仅存在于芯片外围逻辑电路,并且虚拟金属图案覆盖除了感光元件之外的像素区域。 第一介电层设置在第一金属层的下方,在最后一个金属层上的任一种金属层与钝化层之间的层间电介质层。

    Stripe photodiode element with high quantum efficiency for an image sensor cell
    40.
    发明授权
    Stripe photodiode element with high quantum efficiency for an image sensor cell 有权
    用于图像传感器单元的具有高量子效率的条纹光电二极管元件

    公开(公告)号:US06309905B1

    公开(公告)日:2001-10-30

    申请号:US09494634

    申请日:2000-01-31

    IPC分类号: H01L2100

    摘要: A method of fabricating a stripe photodiode element, for an image sensor cell, has been developed. The stripe photodiode element is comprised of a narrow width, serpentine shaped, lightly doped N type region, in a P well region. The use of the serpentine shaped region results in increased photon collection area, when compared to counterparts fabricated using non-serpentine shaped patterns. In addition the use of the serpentine shaped N type regions allow both vertical, as well as horizontal depletion regions, to result, thus increasing the quantum efficiency of the photodiode element. The combination of narrow width, and a reduced dopant level, for the N type serpentine shaped region, result in a fully depleted photodiode element.

    摘要翻译: 已经开发了用于图像传感器单元的制造条形光电二极管元件的方法。 条形光电二极管元件由P阱区域中的窄宽度,蛇形形状的轻掺杂N型区域组成。 与使用非蛇形形状图案制造的对应物相比,使用蛇形形状区域导致增加的光子收集面积。 此外,蛇形N形区域的使用允许垂直和水平耗尽区域都产生,从而增加光电二极管元件的量子效率。 N型蛇形形状区域的窄宽度和降低的掺杂剂水平的组合导致完全耗尽的光电二极管元件。