摘要:
An electrode reshaping process and apparatus is provided for use in a semiconductor etching device. A wafer is place between upper and lower electrodes of the semiconductor etching device. The apparatus and method selectively adjusts the shape of an upper electrode in the semiconductor etching device to compensate for non-uniformities inherent in the etching device. One or more motors attached to the upper electrode provide the electrode shaping forces in accordance with information provided by etch rate variation models stored in a host computer. With the shape of the upper electrode adjusted, the wafer can be etched more uniformally.
摘要:
A test fixture for a boat having a plurality of slots for holding wafers includes a base for fixedly holding a boat to be tested; a wafer simulator, which wafer simulator includes a plurality of wafers sized to properly seat in the plurality of slots in the boat; structure for moving the plurality of wafers of the wafer simulator wholly into and out of the plurality of slots in the boat; and structure determining whether the plurality of wafers is properly seated in the plurality of slots in the boat when the wafer simulator is moved wholly into the plurality of slots in the boat.
摘要:
A reticle sorter and a semiconductor fabrication facility employing one or more reticle sorters is provided. The reticle sorter(s) generally lies between a reticle storage system and a group of one or more photolithography exposure tools (e.g., steppers) and is configured for sorting reticles in one or more cassettes. The use of the reticle sorter provides sorting functionality apart from the reticle storage system and typically closer to the group of photolithography steppers with which it is associated. This can, for example, significantly increase the throughput of semiconductor wafers through the associated photolithography exposure tools as well as in the semiconductor fabrication plant as a whole.
摘要:
The present invention provides for a method and an apparatus for using a latency time period as a control input parameter. A manufacturing run of semiconductor devices is processed. Metrology data from the processed semiconductor devices is acquired. A latency analysis process is performed using the acquired metrology data. A feedback/feed-forward modification process is performed in response to the latency analysis process.
摘要:
Systems and methods for managing automated material handling systems, such as semiconductor fabrication facilities, using material item (e.g., wafer lot) attributes and cassette attributes are provided. A semiconductor fabrication facility typically includes multiple wafer lots and multiple cassettes for storing the wafer lots. A system and method, in one embodiment of the invention, includes setting one or more lot attributes for each wafer lot, setting one or more cassette attributes for each cassette, and selecting a particular cassette for holding a particular wafer lot based on the one or more wafer lot attributes of the particular wafer lot and the one or more cassette attributes of the particular cassette. The wafer lot and cassette attributes may, for example, include an attribute identifying a position in a fabrication sequence and one or more attributes indicative of one or more contaminants. By selecting cassettes in this manner, wafer lots and cassettes may, for example, be classified or logically zoned.
摘要:
A system for verifying the integrity of components moving within a material handling system ensures that only components of acceptable integrity and condition are allowed to move onto the processing locations of a semiconductor plant. In an example embodiment, components that are warped or cracked are initially detected and scanned by a beam break system and/or an optical system. An integrity verification assessment is made immediately on the component to determine whether the scanned component meets with a predefined baseline parameter or characteristic. The components that do not pass integrity verification are then removed from the material handling system while the components that pass move on to the first processing location.
摘要:
The physical movement of reticles and solder bump masks within a wafer processing plant are continually tracked and documented in a historical database for the useful life of the reticles or masks. In an example embodiment of the mask tracking method, the method includes moving the masks from one location to another in mask pods. In addition, a mask data set is generated for each mask composed of a mask identification code cross-referenced to a pod identification code and the mask data sets are then stored in a computer arrangement. The mask data sets are then updated in the computer arrangement to include a facility location identification code as each mask moves to a subsequent location during wafer processing. An important advantage is that wafer lots and reticles can now be matched to an event on the processing line and stored as data for later review and analysis.
摘要:
A scanning system for scanning bar codes attached to wafer cassettes received in a chamber of a wafer processing tool. The system includes a scanner positioned external to the chamber for reading the bar codes and generating signals indicative thereof. Light generated by the scanner passes through an opening in the chamber wall and reflects off one or more reflective or refractive members positioned internal to the chamber, to illuminate the bar code attached to a wafer cassette contained in the chamber. Light reflected from the bar code likewise is bent by the reflective or refractive members and passes through the wall opening where it is sensed by the scanner. The reflective or refractive members are positioned so that the scanner can read bar codes which are not within the line of sight of the scanner through the wall opening. Once the bar code is read, the scanner generates a signal which can be used to access a database stored in memory which contains information related to wafers contained in the cassettes identified by the bar codes.
摘要:
A method and apparatus is presented for transferring semiconductor wafers through a barrier between two separate fabrication areas without the transfer of a container (i.e., wafer boat) with the wafers. The method includes providing an air lock chamber configured within a wall separating a first fabrication area and a second fabrication area. A first door providing access to the air lock chamber from the first fabrication area is opened and a first wafer boat containing the wafers is placed into the air lock chamber. The wafers are removed from the first wafer boat and placed in the air lock chamber. The empty first wafer boat is then removed from the air lock chamber, and the first door is closed. A second door providing access to the air lock chamber from the second fabrication area is opened, and an empty second wafer boat is placed into the air lock chamber. The wafers in the air lock chamber are then placed into the empty second wafer boat, and the second wafer boat containing the wafers is removed from the air lock chamber. The second door is then closed, completing the transfer of the wafers. In a preferred embodiment, the air lock chamber contains a mass transfer system which automatically performs the steps of (i) removing the wafers from the first wafer boat, and (ii) placing the wafers into the empty second wafer boat. The mass transfer system also stores the wafers inside the mass transfer system during the transfer operation.
摘要:
The invention provides an apparatus for supporting a workpiece during the manufacturing process involving the workpiece and a process for manufacturing a workpiece using the apparatus. The apparatus includes a holding device for maintaining the workpiece in a predetermined orientation during performance of the manufacturing process. The holding device includes a plurality of members. The improvement comprises at least one member of the plurality of members including a plurality of indicators arranged in a predetermined order to establish an identifying code. Each indicator of the plurality of indicators absorbs a predetermined portion of incident light.