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31.
公开(公告)号:US20230155011A1
公开(公告)日:2023-05-18
申请号:US17695892
申请日:2022-03-16
Applicant: GlobalFoundries U.S. Inc.
Inventor: Shesh Mani Pandey , Jeffrey B. Johnson
IPC: H01L29/735 , H01L29/06 , H01L29/08 , H01L29/10 , H01L29/66
CPC classification number: H01L29/735 , H01L29/0649 , H01L29/0808 , H01L29/0821 , H01L29/1008 , H01L29/6625
Abstract: A disclosed structure includes a bipolar junction transistor (BJT) and a method of forming the structure. The structure includes a semiconductor layer on an insulator layer. The BJT includes a base region positioned laterally between emitter and collector regions. The emitter region includes an emitter portion of the semiconductor layer and an emitter semiconductor layer, which is within an emitter cavity in the insulator layer, which extends through an emitter opening in the emitter portion, and which covers the top of the emitter portion. The collector region includes a collector portion of the semiconductor layer and a collector semiconductor layer, which is within a collector cavity in the insulator layer, which extends through a collector opening in the collector portion, and which covers the top of the collector portion. Optionally, the structure also includes air pockets within the emitter and collector cavities.
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公开(公告)号:US20230087058A1
公开(公告)日:2023-03-23
申请号:US17549013
申请日:2021-12-13
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Shesh Mani Pandey , Judson R. Holt , Vibhor Jain
IPC: H01L29/732 , H01L29/66
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to bipolar transistors and methods of manufacture. The structure includes: a base region composed of a semiconductor on insulator material; an emitter region above the base region; and a collector region under the base region and within a cavity of a buried insulator layer.
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公开(公告)号:US20220181468A1
公开(公告)日:2022-06-09
申请号:US17116167
申请日:2020-12-09
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Shesh Mani Pandey , Judson Robert Holt
Abstract: A transistor device formed on a semiconductor-on-insulator (SOI) substrate including a bulk semiconductor layer, a buried insulation (BOX) layer positioned on the bulk semiconductor layer, and an active semiconductor layer positioned on the BOX layer. The transistor device includes: a gate structure, a sidewall spacer, and a source/drain region; a plurality of distinct openings extending through the active semiconductor layer of the SOI substrate in the source/drain region adjacent the sidewall spacer, each opening of the plurality of openings extending to a respective recess formed in the BOX layer of the SOI substrate in the source/drain region adjacent the sidewall space, wherein each recess extends under a portion of the active semiconductor layer; and an epitaxial (epi) semiconductor material disposed in the recesses in the BOX layer, in the plurality of openings through the active semiconductor layer, and over a surface of the active semiconductor layer.
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公开(公告)号:US11049955B2
公开(公告)日:2021-06-29
申请号:US16727453
申请日:2019-12-26
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Shesh Mani Pandey , Jagar Singh , Judson R. Holt
IPC: H01L29/66 , H01L29/165 , H01L29/78 , H01L29/06 , H01L29/417
Abstract: One illustrative device disclosed herein includes a transistor formed above a semiconductor-on-insulator (SOI) substrate, wherein the transistor comprises a gate structure, a sidewall spacer and source/drain regions, openings formed in the active layer in the source/drain regions adjacent the sidewall spacer, recesses formed in a buried insulation layer of the SOI substrate in the source/drain regions of the transistor, wherein the recesses extend laterally under a portion of the active layer, and an epi semiconductor material positioned in at least the recesses in the buried insulation layer.
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35.
公开(公告)号:US20210193526A1
公开(公告)日:2021-06-24
申请号:US16720084
申请日:2019-12-19
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Shesh Mani Pandey
IPC: H01L21/8249 , H01L27/06 , H01L29/08 , H01L29/10 , H01L21/265 , H01L21/266 , H01L21/74
Abstract: Bipolar junction transistors include a collector, a base on the collector, and an emitter on the base. The base is between the collector and the emitter. The emitter comprises first portions and a second portion on the base. The first portions of the emitter are between the second portion of the emitter and the base. The first portions and the second portion comprise doped areas that are doped with the same polarity impurity in different concentrations. The base comprises a doped area that is doped with an opposite polarity impurity from the first and second portions of the emitter. The first portions of the emitter extend from the second portion of the emitter into the base. Specifically, the second portion has a bottom surface contacting the base, and the first portions comprise at least two separate impurity regions extending from the bottom surface of the second portion into the base.
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公开(公告)号:US12176427B2
公开(公告)日:2024-12-24
申请号:US17931938
申请日:2022-09-14
Applicant: GlobalFoundries U.S. Inc.
Inventor: Shesh Mani Pandey , Vibhor Jain
IPC: H01L29/735 , H01L29/08 , H01L29/10 , H01L29/66
Abstract: Embodiments of the disclosure provide a bipolar transistor and gate structure on a semiconductor fin and methods to form the same. A structure according to the disclosure includes a semiconductor fin including an intrinsic base region and an extrinsic base region adjacent the intrinsic base region along a length of the semiconductor fin. Sidewalls of the intrinsic base region of the semiconductor fin are adjacent an emitter and a collector along a width of the semiconductor fin. A gate structure is on the semiconductor fin and between the intrinsic base region and the extrinsic base region.
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公开(公告)号:US20240194592A1
公开(公告)日:2024-06-13
申请号:US18064472
申请日:2022-12-12
Applicant: GlobalFoundries U.S. Inc.
Inventor: Shesh Mani Pandey , Mark D. Levy , Chung Foong Tan
IPC: H01L23/525 , H01L23/532
CPC classification number: H01L23/5256 , H01L23/53271
Abstract: A fuse structure includes a fuse body including a polysilicon, and a metal heater over the fuse body. The fuse structure also includes a heating spreading structure thermally coupled to the metal heater and extending horizontally adjacent to at least one side of the fuse body. The metal heater can be a portion of a metal wire or a resistor including a resistive metal. The heat spreading structure may include a plurality of metal contacts.
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公开(公告)号:US12009412B2
公开(公告)日:2024-06-11
申请号:US17549013
申请日:2021-12-13
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Shesh Mani Pandey , Judson R. Holt , Vibhor Jain
IPC: H01L29/732 , H01L29/66
CPC classification number: H01L29/732 , H01L29/66234
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to bipolar transistors and methods of manufacture. The structure includes: a base region composed of a semiconductor on insulator material; an emitter region above the base region; and a collector region under the base region and within a cavity of a buried insulator layer.
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39.
公开(公告)号:US20240188287A1
公开(公告)日:2024-06-06
申请号:US18061538
申请日:2022-12-05
Applicant: GlobalFoundries U.S. Inc.
Inventor: George Robert Mulfinger , Selina A. Mala , Shesh Mani Pandey , Adam S. Rosenfeld , Md Nasir Uddin Bhuyian
CPC classification number: H01L27/11206 , G11C17/16
Abstract: A one-time programmable (OTP) fuse includes a trench isolation; a gate metal layer over the trench isolation; and a PN junction over the gate metal layer. More particularly, the OTP fuse may include a first terminal including a highly doped n-type polysilicon layer over the trench isolation, and a second terminal including a highly doped p-type polysilicon layer over the trench isolation. The highly doped n-type polysilicon layer contacts the highly doped p-type polysilicon layer, creating a PN junction and a fuse link defined in a portion of the gate metal layer between the trench isolation and the PN junction. The gate metal layer has a uniform thickness that allows better dimension control of the fuse link to reduce fuse programming current variability.
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公开(公告)号:US11855197B2
公开(公告)日:2023-12-26
申请号:US17580127
申请日:2022-01-20
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Shesh Mani Pandey , Alexander M. Derrickson , Judson R. Holt , Vibhor Jain
IPC: H01L29/737 , H01L29/08 , H01L29/10 , H01L29/417 , H01L29/423 , H01L29/66
CPC classification number: H01L29/7371 , H01L29/0821 , H01L29/1004 , H01L29/41708 , H01L29/42304 , H01L29/66234
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to vertical bipolar transistors and methods of manufacture. The structure includes: an intrinsic base region comprising semiconductor-on-insulator material; a collector region confined within an insulator layer beneath the semiconductor-on-insulator material; an emitter region above the intrinsic base region; and an extrinsic base region above the intrinsic base region.
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