Continuous fluid jet ejector with anisotropically etched fluid chambers
    31.
    发明授权
    Continuous fluid jet ejector with anisotropically etched fluid chambers 有权
    具有各向异性蚀刻流体室的连续流体喷射喷射器

    公开(公告)号:US07731341B2

    公开(公告)日:2010-06-08

    申请号:US11220514

    申请日:2005-09-07

    IPC分类号: B41J2/02

    摘要: A fluid ejection device, a method of cleaning the device, and a method of operating the device are provided. The device includes a substrate having a first surface and a second surface located opposite the first surface. A nozzle plate is formed over the first surface of the substrate and has a nozzle through which fluid is ejected. A drop forming mechanism is situated at the periphery of the nozzle. A fluid chamber is in fluid communication with the nozzle and has a first wall and a second wall. The first wall and the second wall are positioned at an angle other than 90° relative to each other. A fluid delivery channel is formed in the substrate and extends from the second surface of the substrate to the fluid chamber. The fluid delivery channel is in fluid communication with the fluid chamber.

    摘要翻译: 提供流体喷射装置,清洁装置的方法以及操作装置的方法。 该装置包括具有第一表面和与该第一表面相对的第二表面的基底。 喷嘴板形成在基板的第一表面上,并且具有喷嘴,流体被喷射通过该喷嘴。 液滴形成机构位于喷嘴的周边。 流体室与喷嘴流体连通并且具有第一壁和第二壁。 第一壁和第二壁相对于彼此以不同于90°的角度定位。 流体输送通道形成在基底中并从基底的第二表面延伸到流体腔。 流体输送通道与流体室流体连通。

    Fluid ejector having an anisotropic surface chamber etch
    37.
    发明授权
    Fluid ejector having an anisotropic surface chamber etch 有权
    具有各向异性表面腔蚀刻的流体喷射器

    公开(公告)号:US07213908B2

    公开(公告)日:2007-05-08

    申请号:US10911186

    申请日:2004-08-04

    IPC分类号: B41J2/05

    摘要: A fluid ejecting device and method of forming same are provided. The fluid ejecting device includes a substrate having a first surface and a second surface located opposite the first surface. A nozzle plate is formed over the first surface of the substrate. The nozzle plate has a nozzle through which fluid is ejected. A drop forming mechanism is situated at the periphery of the nozzle. A fluid chamber is in fluid communication with the nozzle and has a first wall and a second wall with the first wall and the second wall being positioned at an angle relative to each other. A fluid delivery channel is formed in the substrate and extends from the second surface of the substrate to the fluid chamber. The fluid delivery channel is in fluid communication with the fluid chamber. A source of fluid impedance includes a physical structure located between the nozzle and the fluid delivery channel.

    摘要翻译: 提供一种流体喷射装置及其形成方法。 流体喷射装置包括具有第一表面和与第一表面相对的第二表面的基底。 在基板的第一表面上形成喷嘴板。 喷嘴板具有喷嘴,流体被喷射通过喷嘴。 液滴形成机构位于喷嘴的周边。 流体室与喷嘴流体连通,并且具有第一壁和第二壁,其中第一壁和第二壁相对于彼此以一定角度定位。 流体输送通道形成在基底中并从基底的第二表面延伸到流体腔。 流体输送通道与流体室流体连通。 流体阻抗源包括位于喷嘴和流体输送通道之间的物理结构。

    CMOS/MEMS integrated ink jet print head and method of operating same
    38.
    发明授权
    CMOS/MEMS integrated ink jet print head and method of operating same 失效
    CMOS / MEMS集成喷墨打印头及其操作方法

    公开(公告)号:US06502925B2

    公开(公告)日:2003-01-07

    申请号:US09792114

    申请日:2001-02-22

    IPC分类号: B41J205

    摘要: An ink jet print head is formed of a silicon substrate that includes an integrated circuit formed therein for controlling operation of the print head. The silicon substrate has one or more ink channels formed therein along the longitudinal direction of the nozzle array. An insulating layer or layers overlie the silicon substrate and has a series or an array of nozzle openings or bores formed therein along the length of the substrate and each nozzle opening communicates with an ink channel. The area comprising the nozzle openings forms a generally planar surface to facilitate maintenance of the printhead. A heater element is associated with each nozzle opening or bore for asymmetrically heating ink as ink passes through the nozzle opening or bore.

    摘要翻译: 喷墨打印头由硅基板形成,该硅基板包括形成在其中的集成电路,用于控制打印头的操作。 硅基板沿着喷嘴阵列的纵向方向形成有一个或多个油墨通道。 绝缘层或层叠在硅衬底上,并且沿着衬底的长度形成有一系列或阵列的喷嘴开口或孔,并且每个喷嘴开口与油墨通道连通。 包括喷嘴开口的区域形成大致平坦的表面,以便于打印头的维护。 当墨水通过喷嘴开口或孔时,加热器元件与每个喷嘴开口或孔相关联,用于不对称地加热墨。

    CMOS/MEMS integrated ink jet print head with silicon based lateral flow nozzle architecture and method of forming same
    39.
    发明授权
    CMOS/MEMS integrated ink jet print head with silicon based lateral flow nozzle architecture and method of forming same 失效
    CMOS / MEMS集成喷墨打印头,采用硅基侧流喷嘴结构及其形成方法

    公开(公告)号:US06439703B1

    公开(公告)日:2002-08-27

    申请号:US09751722

    申请日:2000-12-29

    IPC分类号: B41J202

    摘要: A continuous ink jet print head is formed using a combination of traditional CMOS technology to form the various controlling electrical circuits on a silicon substrate having insulating layer(s) which provide electrical connections to heater elements associated with a nozzle and a MEMS technology for forming ink delivery cavities or channels and bores. A blocking structure is formed in the silicon substrate between an ink channel formed in the silicon substrate and a nozzle bore formed in the insulating layer(s). The blocking structure causes ink in an ink channel to flow around the blocking structure and thereby develop lateral flow components to the liquid entering the bore so that as the stream of fluid emanates from the bore the lateral flow components are a factor in allowing an increased stream deflection under the condition of asymmetric heating.

    摘要翻译: 使用传统CMOS技术的组合形成连续喷墨打印头,以在具有绝缘层的硅基板上形成各种控制电路,所述绝缘层提供与喷嘴相关联的加热元件的电连接以及用于形成墨的MEMS技术 输送腔或通道和孔。 在硅衬底中形成的硅衬底中形成的墨水通道和形成在绝缘层中的喷嘴孔之间形成阻挡结构。 阻塞结构导致墨水通道中的墨水流过阻塞结构,从而向进入孔的液体形成横向流动分量,使得当流体流从孔发出时,横向流动分量是允许增加流量 在不对称加热条件下的挠曲。

    Fluid ejector having an anisotropic surface chamber etch
    40.
    发明授权
    Fluid ejector having an anisotropic surface chamber etch 有权
    具有各向异性表面腔蚀刻的流体喷射器

    公开(公告)号:US07836600B2

    公开(公告)日:2010-11-23

    申请号:US11685259

    申请日:2007-03-13

    摘要: A method of forming a fluid chamber and a source of fluid impedance includes providing a substrate having a surface; depositing a first material layer on the surface of the substrate, the first material layer being differentially etchable with respect to the substrate; removing a portion of the first material layer thereby forming a patterned first material layer and defining the fluid chamber boundary location; depositing a sacrificial material layer over the patterned first layer; removing a portion of the sacrificial material layer thereby forming a patterned sacrificial material layer and further defining the fluid chamber boundary location; depositing at least one additional material layer over the patterned sacrificial material layer; forming a hole extending from the at least one additional material layer to the sacrificial material layer, the hole being positioned within the fluid chamber boundary location; removing the sacrificial material layer in the fluid chamber boundary location by introducing an etchant through the hole; forming the fluid chamber by introducing an etchant through the hole; and forming a source of fluid impedance.

    摘要翻译: 形成流体室和流体阻抗源的方法包括提供具有表面的基底; 在所述衬底的表面上沉积第一材料层,所述第一材料层相对于所述衬底可差分蚀刻; 去除第一材料层的一部分,从而形成图案化的第一材料层并限定流体室边界位置; 在所述图案化的第一层上沉积牺牲材料层; 去除牺牲材料层的一部分,从而形成图案化的牺牲材料层并进一步限定流体室边界位置; 在图案化的牺牲材料层上沉积至少一个附加材料层; 形成从所述至少一个附加材料层延伸到所述牺牲材料层的孔,所述孔位于所述流体室边界位置内; 通过在孔中引入蚀刻剂来除去流体室边界位置中的牺牲材料层; 通过在孔中引入蚀刻剂来形成流体室; 并形成流体阻抗源。