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31.发明授权Signal processing device, signal processing method, reception device, transmission/reception device, communication module, and electronic device 失效信号处理装置，信号处理方法，接收装置，发送/接收装置，通信模块和电子装置公开(公告)号：US08508396B2
公开(公告)日：2013-08-13
申请号：US13003778
申请日：2009-02-20
申请人： Akira Enami , Keisuke Uno , Hayami Hosokawa , Kentaro Hamana , Tetsuya Nosaka
发明人： Akira Enami , Keisuke Uno , Hayami Hosokawa , Kentaro Hamana , Tetsuya Nosaka
IPC分类号： H03M1/00
CPC分类号： H03F3/087
摘要： It is possible to reduce a noise component mixed in an analog signal while suppressing increase of power consumption. An amplification unit amplifies the inputted analog signal and converts the amplified signal into a digital signal of a predetermined format for output. The amplification unit includes: an analog circuit unit for processing an analog signal; and a digital circuit unit for processing a digital signal; wherein the circuits are arranged on a substrate. The analog circuit unit includes: an amplification circuit for amplifying the inputted analog signal; and an LPF for cutting off a high frequency component of the amplified analog signal. The digital circuit unit includes: a rectification circuit which rectifies a waveform of the signal whose high-frequency component is cut off; and digital output circuit which converts the waveform-rectified signal into a digital signal of a predetermined format for output.
摘要翻译： 可以抑制模拟信号中混合的噪声成分，同时抑制功耗的增加。 放大单元放大输入的模拟信号，并将放大的信号转换成预定格式的数字信号以输出。 放大单元包括：模拟电路单元，用于处理模拟信号; 以及用于处理数字信号的数字电路单元; 其中所述电路布置在基板上。 模拟电路单元包括：放大电路，用于放大输入的模拟信号; 以及用于切断放大的模拟信号的高频分量的LPF。 数字电路单元包括：整流电路，其对高频分量被切断的信号的波形进行整流; 以及将波形整流信号转换为预定格式的数字信号以输出的数字输出电路。
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32.发明申请TRANSMITTER, RECEIVER, TRANSCEIVER, TRANSMISSION CONTROL METHOD, RECEPTION CONTROL METHOD, OPTICAL TRANSMISSION MODULE AND ELECTRONIC DEVICE 失效发射机，接收机，收发器，传输控制方法，接收控制方法，光传输模块和电子设备公开(公告)号：US20110135311A1
公开(公告)日：2011-06-09
申请号：US12673084
申请日：2008-08-27
申请人： Akira Enami , Keisuke Uno , Kentaro Hamana , Tetsuya Nosaka , Hayami Hosokawa
发明人： Akira Enami , Keisuke Uno , Kentaro Hamana , Tetsuya Nosaka , Hayami Hosokawa
CPC分类号： H04B10/508 , H01S5/0428 , H01S5/06812
摘要： A transmission device has a light emitting element for converting an electric signal to an optical signal and transmitting the same, and a drive section for outputting the optical signal from the light emitting element and driving the light emitting element by providing the electric signal to the light emitting element. The electric signal provided by the drive section to the light emitting element is a waveform deformed signal having a waveform in which a time required for a fall is longer than a time required for a rise in a binary signal having a signal of high level and a signal of low level.
摘要翻译： 传输装置具有用于将电信号转换为光信号并将其发送的发光元件，以及用于从发光元件输出光信号并通过向光提供电信号来驱动发光元件的驱动部分 发光元件。 由驱动部向发光元件提供的电信号是具有波形的波形变形信号，其中下降的时间要比具有高电平的信号的二进制信号的上升所需的时间长 信号低电平。
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33.发明授权公开(公告)号：US08313252B2
公开(公告)日：2012-11-20
申请号：US12671345
申请日：2008-08-06
申请人： Hiroshi Sameshima , Naru Yasuda , Hayami Hosokawa
发明人： Hiroshi Sameshima , Naru Yasuda , Hayami Hosokawa
IPC分类号： G02B6/36
CPC分类号： G02B6/4214 , G02B6/4201 , G02B6/4242 , G02B6/4251
摘要： In a package (5) formed by a supporting portion (5a) for supporting a light emitting portion (7) or a light receiving portion (9) for emitting or receiving an optical signal, and a lid (5b) for covering the supporting portion (5a); the supporting portion (5a) or the lid (5b) includes a light guide mounting surface (22) for supporting at least one end including an incident/exit port of the optical signal in a film light guide (4) for optically coupling with the light emitting portion (7) or the light receiving portion (9) and transmitting the optical signal; and a length (D) in a Z-direction serving as a perpendicular direction with respect to the light guide mounting surface (22) from the light guide mounting surface (22) of the supporting portion (5a) or the lid (5b) to the lid (5b) or the supporting portion (5a) facing the light guide mounting surface (22) is longer than a length (d) in the Z-direction in a region of the film light guide (4) supported by the light guide mounting surface (22). The light guide package having a structure in which the deformation and the damage of the core are less likely to occur even when subjected to impact by vibration and the like is thereby provided.
摘要翻译： 在由用于支撑发光部分（7）的支撑部分（5a）或用于发射或接收光信号的光接收部分（9）形成的封装（5）中，以及用于覆盖支撑部分 （5a）; 支撑部分（5a）或盖子（5b）包括一个光导安装表面（22），用于在薄膜光导（4）中支撑包括光信号的入射/出射端口的至少一端，用于与 发光部（7）或光接收部（9），并发送光信号; 以及从支撑部（5a）或盖（5b）的导光体安装面（22）向相对于导光体安装面（22）的垂直方向的Z方向的长度（D）〜 面对导光体安装面（22）的盖（5b）或支撑部（5a）比由光导支撑的薄膜光导（4）的区域的Z方向的长度（d）长 安装表面（22）。 因此，具有即使受到振动等的冲击也不易发生芯的变形和损伤的结构的导光组件。
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34.发明申请OPTICAL TRANSMISSION MODULE, ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开光传输模块，电子设备及其制造方法公开(公告)号：US20100221016A1
公开(公告)日：2010-09-02
申请号：US12710872
申请日：2010-02-23
CPC分类号： G02B6/4214 , G02B6/4212 , H01L2224/48091 , H01L2224/48465 , H01L2224/48471 , H01L2924/00014 , H01L2924/01019 , H01L2924/1815 , H01L2924/00 , H01L2224/4554
摘要： A light transmission module has a light transmission path for transmitting light, an optical element including a light emitting and receiving surface for emitting or receiving an optical signal transmitted by the light transmission path, and having a light emitting and receiving point with a function of photoelectric conversion and an electrode pad formed on the light emitting and receiving surface, a substrate mounted with the optical element and an electrical wiring, a bonding wiring for electrically connecting the electrode pad and the electrical wiring, and a sealing portion for sealing the optical element. The electrical wiring and the electrode pad are reverse wire-bonded by the bonding wiring. The sealing portion includes an inclined part where a liquid sealing resin material is raised and solidified along a side wall of the optical element by surface tension, and a flat part where the liquid sealing resin material is spread in parallel and solidified along the light emitting and receiving surface, the inclined part and the flat part being coupled.
摘要翻译： 光传输模块具有用于透射光的光传输路径，包括用于发射或接收由光传输路径传输的光信号的发光和接收表面的光学元件，并具有具有光电功能的发光和接收点 转换和形成在发光和接收表面上的电极焊盘，安装有光学元件的基板和电线，用于电连接电极焊盘和电线的接合线以及用于密封光学元件的密封部分。 电线和电极焊盘通过接合线反向引线接合。 密封部分包括倾斜部分，其中液体密封树脂材料通过表面张力沿着光学元件的侧壁升高和固化，以及平坦部分，其中液体密封树脂材料沿着发光和/ 接收表面，倾斜部分和平坦部分联接。
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35.发明申请LIGHT TRANSMISSION PATH PACKAGE, LIGHT TRANSMISSION MODULE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING LIGHT TRANSMISSION MODULE 有权光传输路径封装，光传输模块，电子设备及制造光传输模块的方法公开(公告)号：US20100119238A1
公开(公告)日：2010-05-13
申请号：US12530894
申请日：2008-03-12
申请人： Junichi Tanaka , Hayami Hosokawa , Naru Yasuda , Yukari Terakawa
发明人： Junichi Tanaka , Hayami Hosokawa , Naru Yasuda , Yukari Terakawa
CPC分类号： G02B6/4203 , G02B6/122 , H01L33/54 , H01L2224/48091 , H01L2924/00014
摘要： A light transmission path package includes first and sealing surface adjustment members, which are arranged with facing each other by way of a light emitting/receiving element on a lead frame substrate, having a length in a normal direction of the substrate surface from the substrate surface of H2; wherein a relational expression H3
摘要翻译： 光传输路径封装包括第一密封表面调节构件，其通过引线框架基板上的发光/接收元件彼此面对地布置，其具有从基板表面到基板表面的法线方向的长度 的H2; 其中满足关系式H3
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公开(公告)号：US07460747B2
公开(公告)日：2008-12-02
申请号：US11638155
申请日：2006-12-13
CPC分类号： G02B6/4214 , G02B6/125 , G02B6/43 , G02B2006/12104
摘要： A waveguide includes a core part, clad layer surrounding the core part about an optical axis of the core part, and an optical path conversion mirror formed at the end face of at least one of the core part or the clad layer. The optical path conversion mirror converts an optical path of a signal light. The shape of the end face of the core part and the shape of the end face of the clad layer are different in the optical path conversion mirror.
摘要翻译： 波导包括芯部分，围绕芯部分的核心部分围绕芯部的包层，以及形成在芯部或包覆层中的至少一个的端面处的光路转换镜。 光路转换镜转换信号光的光路。 芯部的端面的形状和包层的端面的形状在光路转换镜中是不同的。
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公开(公告)号：US07244924B2
公开(公告)日：2007-07-17
申请号：US11348974
申请日：2006-02-07
CPC分类号： B60Q1/302 , E01F9/559 , F21V5/04 , F21V7/0091 , F21W2111/00 , F21Y2115/10 , G02B19/0028 , G02B19/0061 , H01L33/54 , H01L33/58 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00012
摘要： This invention improves the use efficiency of light emitted by a solid light emitter such as a light emitting diode, and realizes a desired directional pattern. On a front boundary surface of a mold resin 13 sealing a light emitter 12, there are formed a direct emission region 18 for emitting the light from the light emitter 12 and a total reflection region 19 for totally reflecting the light from the light emitter 12. The direct emission region 18 is convex lens-shaped. A light reflecting portion 20 having a concave mirror shape is disposed on a rear wall of the mold resin 13. A part of light emitted from the light emitter 12 is emitted forward by receiving an optical lens action when it passes through the direct emission region 18. Another part of the light emitted by from the light emitter 12 is totally reflected by the total reflection region 19, and is reflected by the light reflecting portion 20, and emitted forward from the total reflection region 19.
摘要翻译： 本发明提高了由诸如发光二极管的固体发光体发射的光的使用效率，并且实现了所需的方向图。 在密封发光体12的模制树脂13的前边界面上形成有用于发射来自发光体12的光的直接发射区域18和用于全反射来自发光体12的光的全反射区域19。 直接发射区域18是凸透镜状的。 具有凹面镜形状的光反射部分20设置在模制树脂13的后壁上。 从光发射器12发射的光的一部分在通过直接发射区域18时通过接收光学透镜作用而向前发射。 来自发光体12的光的另一部分被全反射区域19全反射，被光反射部20反射，从全反射区域19向前方射出。
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公开(公告)号：US07177517B2
公开(公告)日：2007-02-13
申请号：US11058639
申请日：2005-02-15
摘要： In the upper face of a lower clad layer, a core trench is formed having a cross-sectional trapezoidal shape having a narrow bottom face and a wide upper face, a core is formed within the core trench, and an upper clad layer is formed at the upper face of the core for sealing. The bottom face of the core trench becomes a low refractive index layer having a refractive index smaller than the lower clad layer. The substantive difference of refractive index between the core and the lower clad layer is thus increased.
摘要翻译： 在下包层的上表面中，形成具有窄底面和宽上表面的截面梯形形状的芯沟槽，在芯沟槽内形成芯，并且在上覆盖层形成上覆盖层 芯的上表面用于密封。 芯沟槽的底面变为折射率小于下包层的低折射率层。 因此，芯和下包层之间的折射率的实质差异增加。
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39.发明授权公开(公告)号：US07013055B2
公开(公告)日：2006-03-14
申请号：US10611684
申请日：2003-07-01
申请人： Kazuyuki Hayamizu , Yoshiyuki Komura , Yukari Terakawa , Hayami Hosokawa , Toshiyuki Takahashi , Masayoshi Higuchi , Yoshitaka Tatara , Naru Yasuda , Hiroto Nozawa
发明人： Kazuyuki Hayamizu , Yoshiyuki Komura , Yukari Terakawa , Hayami Hosokawa , Toshiyuki Takahashi , Masayoshi Higuchi , Yoshitaka Tatara , Naru Yasuda , Hiroto Nozawa
CPC分类号： G02B6/4246 , G02B6/12007 , G02B6/125 , G02B6/138 , G02B6/30 , H01L31/14
摘要： A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.
摘要翻译： 一种制造光波导器件的方法包括提供用于固定光纤的光纤引导件和用于在硅衬底的波导固定区域外部提供元件安装台的光学元件放置部分。 在硅衬底的波导固定区域的外部形成金属薄膜。 在通过将成为上包层的接合树脂将光波导基板结合到硅基板的整个上表面之后，沿着波导固定区域的边缘切割光波导基板，并且光波导基板 去除波导固定区域外部，露出光纤引导件和光学元件放置部分。
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公开(公告)号：US20050180714A1
公开(公告)日：2005-08-18
申请号：US11058639
申请日：2005-02-15
摘要： In the upper face of a lower clad layer, a core trench is formed having a cross-sectional trapezoidal shape having a narrow bottom face and a wide upper face, a core is formed within the core trench, and an upper clad layer is formed at the upper face of the core for sealing. The bottom face of the core trench becomes a low refractive index layer having a refractive index smaller than the lower clad layer. The substantive difference of refractive index between the core and the lower clad layer is thus increased.
摘要翻译： 在下包层的上表面中，形成具有窄底面和宽上表面的截面梯形形状的芯沟槽，在芯沟槽内形成芯，并且在上覆盖层形成上覆盖层 芯的上表面用于密封。 芯沟槽的底面变为折射率小于下包层的低折射率层。 因此，芯和下包层之间的折射率的实质差异增加。
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